Lost your password?
Not a member?
Resend confirmation instructions
Sort By Category
- New Technology
- Printed Electronics
- New Products
- Test & Inspection
- Fabrication Process
- IPC Standards
- From The Show
- PCB Fabricator
- Market Impact Cost
I-Connect007 Editor's Choice: Five Must-Reads for the Week
10/30/2020 | Nolan Johnson, I-Connect007
Gardien on the Right Track With New ERP System
10/29/2020 | Andy Shaughnessy, Design007 Magazine
Real Time with… AltiumLive Europe: If You Don’t Know How It’s Made, How Can You Possibly Design It?
10/26/2020 | Pete Starkey, I-Connect007
EIPC Technical Snapshot: Automotive Technology
10/19/2020 | Pete Starkey, I-Connect007
I-Connect007 Editor's Choice: Five Must-Reads for the Week
10/16/2020 | Nolan Johnson, I-Connect007
PCB :: Associations
IPC Reliability Forum Wrap-up With Brook Sandy-Smith
I attended the recent IPC High-Reliability Forum and Microvia Summit in Baltimore, Maryland. The speakers and panelists focused on a variety of topics, but one issue that kept popping up was the failure of some microvias on military and aerospace PCBs. Fortunately, some smart technologists are focusing on determining the cause of these via failures. I asked Brook Sandy-Smith, IPC’s technical education program manager, to give us a quick wrap-up of this event.
Mentor Tools: Optimized for Flex and Rigid-flex Design
With the launch of the new Flex007 section in Design007 Magazine, we asked David Wiens, product marketing manager with Mentor, a Siemens Business, to tell us about their tools’ flex and rigid-flex design capabilities. As David explains, today’s higher-end design software tools are optimized for flex design, making workarounds a thing of the past.
IPC High-reliability Forum and Microvia Summit Review, Part I
The IPC High-Reliability Forum and Microvia Summit covered a broad range of topics related to reliability and provided interactive opportunities to share expert knowledge and experience in determining and understanding the causes of failure and selecting the best design rules, materials, processes, and test methods to maximise product reliability.
Crowded Congressional Calendar Affects Industry Priorities
More than five months remain in 2019, but U.S. congressional leaders are already running out of time as they face a long list of must-pass bills before year’s end. Although some of these bills do not affect the electronics industry, some of them do, and the overall agenda does affect the opportunities and risks we face.
A Conversation with Karen McConnell—An Emerging Engineer Program Mentor
IPC’s Emerging Engineer program, launched in 2016, provides early career professionals an opportunity to learn from dedicated industry volunteers who participate in IPC standards development. IPC’s editorial staff had the opportunity to talk with one of those dedicated volunteers, mentor Karen McConnell, Senior Staff Engineer CAD CAM, Northrop Grumman, about why she participates as a mentor in IPC’s Emerging Engineer program.
How Changing Cleaning Technologies Affect Reliability
At the recent IPC High-Reliability Forum and Microvia Summit, Andy Shaughnessy spoke with Michael Konrad, founder and president of Aqueous Technologies and a speaker and panelist at the event in Baltimore, Maryland. They discussed Konrad’s presentation and the recent proliferation of cleaning, from solely high-reliability products to Class 1 consumer products.
EPA, Industry Come Together in Visit to TTM Facility
IPC member TTM Technologies is proud to show off the new wastewater-treatment system at its Sterling, Virginia plant, which is helping to enhance the company’s pollution prevention and resource recovery performance.
Dissecting the IPC Regional Survey on PCB Technology Trends
Sharon Starr, Denny Fritz, and Mike Carano talk about the global 2018 IPC Technology Trends Report released early this year—the size of the survey, how it was conducted, the general findings, and regional differences. They also shared their takeaways and regional insights, and the industry outlook over the next five to 10 years.
An Examination of Glass-fiber and Epoxy Interface Degradation in Printed Circuit Boards
Multilayer organic laminates, which make up over 90% of the interconnecting substrates in electronics (standard FR-4 represents 85% of the substrates used for laminates), can develop a loss of electrical insulation resistance between two biased conductors due to conductive filament formation.
Saying Yes to Opportunities: IPC’s Emerging Engineer Program Offers Career Growth for Electronics Industry Newcomers
What makes the IPC Emerging Engineer Program a premier networking and career enriching program? IPC staff spoke to Emerging Engineer Kate Stees, materials and process engineer, Lockheed Martin, about her experience in the program and why she recommends it to other engineers.
Albert Gaines: Design All Comes Down to Documentation
During SMTA Atlanta, I spoke with Albert Gaines of HiGain Design. We discussed Albert’s belief that everything starts with design and that too many engineers and designers focus solely on the final board at the expense of the documentation, which is a designer’s most important product. Do you consider your documentation to be a critical product?
Words of Advice: Making Life Easier for Fabrication and Assembly
In a recent survey, we asked the following question: What steps do you take to make the job easier for your fabrication and assembly providers? Here are a few of the answers, edited slightly for clarity.
IPC SummerCom Highlights: A Government Relations Perspective
Last week, IPC hosted SummerCom, our semi-annual standards development committee meetings, in Raleigh, North Carolina. The event brought together thousands of technical experts from around the world to shape the product, manufacturing, and supply-chain standards that guide our industry.
Microtek Labs: Providing Trusted Testing in the Chinese Market
On a recent visit to Microtek Laboratories' Changzhou facility, Barry Matties, publisher, and Edy Yu from the I-Connect007 China team spoke with chairman and CTO Bob Neves about the changes he has seen living and doing business in China over the past 15 years, and the increased importance of standards and testing as China moves into manufacturing more high-reliability products.
Libraries: A Must-have for Design
I-Connect007 was invited to attend a session of the Orange County Chapter of the IPC Designers Council (DC). Even though I have been an IPC member for over half a century (yes, almost since vacuum tubes dominated design), this was my first DC event.
What Electronics Companies Need to Know About Environmental Product Requirements
The task of monitoring and complying with environmental, health and safety (EHS) rules that affect electronics companies and their products requires a watchful eye on all levels of government: local, state, national, and international.
IPC’s PCB Tech Trends Study Highlights Issues Impacting Fabricators
The 2018 survey results indicated the need for speed and low loss as critical functions of the materials chosen. This is the digital age, and with the Internet of Things, virtual and augmented reality, vehicle-to-vehicle communication, etc., the need for low-loss and ultra-low-loss materials continues to grow as a percentage of circuit boards fabricated.
PCB Fabricators’ Tech Capabilities Exceed OEMs’ Needs in Many Areas
Some interesting differences showed up in the board property data reported by the OEMs and PCB fabricators that participated in IPC’s PCB Technology Trends 2018 study.
IMPACT Washington, D.C. 2019 Recap: Leaders Call for Action on USMCA Trade Deal
Top executives from electronics companies across the United States were in Washington, D.C., last week to call on the Trump administration and Congress to support policies that will drive the electronics industry’s future growth in North America and worldwide.
Are Regional Differences in PCB Technology as Great as We Think?
We keep hearing that Asia is all consumer and automotive electronics and North America and Europe are all high reliability/long life. The findings in IPC’s PCB Technology Trends 2018 study show that these regions are not as different as expected, and the differences we do see are interesting.
XNC Format: Gerber Takes Data Into the Future
The problem is that so many NC files are of deplorable quality because the NC format was never designed as a data transfer format. It has always been a machine driver and contains all sorts of information that a drilling machine needs, but that is irrelevant and confusing for data exchange.
Technically Appropriate Material Choices are Key to Design Success
Materials are no longer a passive part of the design; they play an active role in the manufacturability, reliability, and speed of a PCB. I-Connect007’s Nolan Johnson and Mike Creeden, founder of San Diego PCB Design, discuss several key characteristics that designers should consider in their material selection process.
New Technical Director and Upcoming 2019 EIPC Summer Conference
Tarja Rapala-Virtanen is the newest technical director for the EIPC. I-Connect007's Nolan Johnson and long-time EIPC conference attendee Pete Starkey discuss her new role, the upcoming summer conference in Leoben, Austria, and the program in place for the June conference.
Export Controls in Flux
U.S. export control rules have changed significantly over the last decade, and more changes are expected as policymakers tackle the treatment of new and foundational technologies and respond to geopolitical developments.
IPC Asia President Phil Carmichael on China Trends
At the productronica China 2019 show in Shanghai, Barry Matties joined Phil Carmichael, president of IPC Asia, to discuss the continued growth of IPC in Asia, including the increasing emphasis on training. IPC China has grown from hosting two technical conferences five years ago to 32 in the past year. Phil also addresses current trends he’s seeing as well as trade tensions between China and the U.S.
Alun Morgan on Thermal Management and LEDs in Automotive
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.
U.S. Tax Law Boosts Growth, But Uncertainties Loom
Monday, April 15 was the deadline for millions of Americans to file their income tax returns, so this is a good time to review the Tax Cuts and Jobs Act of 2017 (TCJA) as well as the current tax policy landscape and how these rules are affecting the electronics industry.
SEMI’s Cristina Sandoval on Mentoring and Retaining Young Talent
Cristina Sandoval, manager of workforce development and university initiatives for the SEMI Foundation, discusses how two new programs, as well as a long-running high school STEM outreach program, are aiming to address the skills gap within the industry. Sandoval also explains SEMI’s efforts to prepare students to enter the workforce and continuing to develop talent as young professionals join the industry.
Kelly Dack at IPC APEX EXPO: The Attendees Speak!
During IPC APEX EXPO, Guest Editor Kelly Dack and the I-Connect team roamed the show floor, recorders in hand. They asked various attendees for their impressions of the show, and any new tools and technology that may have caught their attention. These are their stories.
Brexit Postponed Amid Political Gridlock; Industry Disruptions in Store
The United Kingdom’s effort to leave the European Union, known by the nickname “Brexit,” is bogged down in political uncertainty, which in turn is creating disruptions in the global economy.
CPCA Show and productronica China 2019 Review
It was a busy week in China for the electronics industry. With multiple trade shows and conferences going on simultaneously in Shanghai, including the CPCA Show 2019, productronica China, SEMICON China, electronica China, and FPD China, it appears from the crowds that the market is strong in the region.
IPC: Trump’s FY2020 Budget Plan Kicks Off U.S. Policy Debates
Within the last week, U.S. President Trump released his $4.7 trillion fiscal 2020 budget plan, kicking off the annual federal budget process. IPC is watching several budget debates that could impact the electronics industry and its supply chain.
EIPC Winter Conference, Day 1
EIPC Chairman Alun Morgan writes about the highlights of and the technical discussions at the recent EIPC Winter Conference held in Milan last February 14–15.
Industry Outlook from IPC's Sharon Starr
Sharon Starr, IPC's director of market research, provides updates on the EMS and PCB industry outlook, benefits of IPC membership and participation, plans to expand the EMS statistical program, and new studies being published.
2019 Outlook: IPC Advocacy for Workforce Education and Training
The chronic shortage of skilled workers is the top business challenge facing the electronics industry worldwide. Our skilled workers are aging and retiring faster than we can hire replacements.
USMCA Fights Ramps Up; IPC Helps Launch New Coalition
The coalition has a series of daunting and time-pressing tasks ahead of it. The USMCA needs to surmount procedural and political hurdles and be passed this year if we are to avoid the pitfalls of election year politics in the United States.
Accelerating and Disrupting Innovation: The Tesla Story
The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.
Gene Weiner on the IPC APEX EXPO 2019 Automotive Executive Forum
Dan Feinberg spoke with Gene Weiner, president and CEO of Weiner International Associates, about IPC's history of forums, his thoughts on the Executive Forum on Advancing Automotive Electronics at IPC APEX EXPO 2019, and how the IPC Hall of Famers and the industry can help improve forum success.
Inspiring the Next Generation of Industry Leaders: IPC STEM Student Outreach Program
At IPC APEX EXPO 2019, I-Connect007 Managing Editor Patty Goldman spoke with Colette Buscemi, IPC's senior director for education programs, about the success and expansion of the IPC STEM Student Outreach Program, activities and scholarship opportunities for students through sponsor support—including I-Connect007—and feedback she received on the event.
Trump Administration can Ease EPA Reporting Burden for Electronics Industry
The finish line may be in sight in a decade-long effort to persuade the U.S. Environmental Protection Agency (EPA) to curb unnecessary and duplicative Toxic Substances Control Act (TSCA) reporting requirements that discourage recycling of manufacturing byproducts.
A Drone's-eye View of the IPC APEX EXPO Show Floor
If you couldn't make it to IPC APEX EXPO in San Diego, don't worry. We have full coverage of this annual must-attend event, from the opening ceremony to the close of the final day. To get a sense of the size of this year's show, check out our drone's-eye view of the show floor. Can we name our drone Air007?
RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager
Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.
Joe Clark Discusses DownStream’s Updated Tool Lineup and IPC-2581
DownStream Technologies recently revamped their entire product line, from CAM350 through BluePrint-PCB. DownStream co-founder Joseph Clark and Guest Editor Kelly Dack discuss some of these updates, including a new GUI and capabilities such as 3D analysis, as well as news about IPC-2581.
IPC APEX EXPO 2019 Show Week Time-lapse Video
From set up to tear down, I-Connect007 captured a 4-day time-lapse video of the show floor from our Real Time with... IPC APEX EXPO booth. In addition, this video includes overhead shots of each of our generous premium sponsor's booths.
IPC APEX EXPO 2019: It's a Wrap!
The IPC APEX EXPO 2019 show floor closed yesterday with applause. After three days of meetings, networking, and tire kicking, if you will, exhibitors head back to their offices with a list of leads, to-do lists, and stories to share. Meanwhile, attendees now head home with important decisions to make about what they learned and who they want to do business with.
RTW IPC APEX EXPO 2019: Ventec Highlights Core Solutions for Thermal Management
Jack Pattie, president of Ventec International Group, speaks with I-Connect007 Guest Editor Kelly Dack about the many heat issues associated with circuit boards right now—whether in general applications, power applications, PCs—as everyone demands smaller, faster, and more powerful systems.
IPC APEX EXPO 2019 Day Two: Do You Hear That Buzz?
On the IPC APEX EXPO show floor Wednesday, the energy and action peaked with control software and interconnected machine communication continuing to be the buzz at the show.
RTW IPC APEX EXPO 2019: For Elmatica, the Future is All About Data
At this year's IPC APEX EXPO, guest editor Judy Warner sits down with Elmatica CEO Didrik Bech to discuss the company's business model and CircuitData, their award-winning open-source PCB design data language.
The Designers Council: A Chapter Primer From the Ground Up
Thinking it might be a way to make new contacts with PCB designers in Orange County, I attended a couple of Designers Council meetings. The chapter president at that time was Paul Fleming, who asked me to be part of his steering committee because he learned that I had spent decades in fabrication. Within a few months, he had gotten a job transfer to Arizona, so he twisted my arm to take over as the chapter president. I agreed, but little did I know that this would become a major turning point in my PCB career.
The Sun Rises on IPC APEX EXPO 2019
It's sunrise on Monday in San Diego, and IPC APEX EXPO at the San Diego Convention Center is already abuzz with activity. The exhibition hall setup is on schedule to open for business tomorrow morning, January 29th, 2019.
In the Studio: Real Time with…IPC
It's almost time for IPC APEX EXPO 2019 at the San Diego Convention Center, and that means another Real Time with…IPC video program bringing you interviews with the electronics industry's top movers and shakers, engineers, and managers.
AltiumLive Munich Draws Designers from Around Europe
I’m finally unpacked after last week’s AltiumLive PCB design summit in Munich. Much like the AltiumLive event I attended in San Diego last October, the conference drew hundreds of PCB designers. This marked the second AltiumLive PCB design summit held in Munich, and Altium seems to have it down to a science. I spoke with designers from Germany, Austria, the Netherlands, and Belgium, just to name a few countries. Many of them were involved in the automotive segment but some were in medical and industrial controls as well. It’s great to be at an event that is full of PCB designers, because designers are few and far between at most PCB industry events.
STEM: The Future of Our Industry
Facing a growing shortage of talented labor with which to fill the employment positions in America, IPC is working to help solve this problem. Colette Buscemi, senior director of IPC’s education programs, is encouraging IPC members to better engage pre-college and post-secondary college students at the local level. Barry Matties spoke with Colette about the educational programs IPC has put in place to invest in future generations, including the STEM program at this year’s IPC APEX EXPO.
CES 2019 Showstoppers, the Show Floor, and Some Neat Stuff
CES 2019 is over, and those of us who spent four to five days trying to see and hear as much as possible are in recovery mode. There were over 182,000 attendees, and 6,600 of us were media all trying to get to as much of the 2.9-million-square-feet exhibit space as possible.
The Quest for Perfect Design Data Packages
There’s an ongoing problem in the PCB industry: fabrication shops are receiving incomplete or inadequate design data packages, leaving manufacturers scrambling to fill in the blanks. For a quick-turn prototype shop like Washington-based Prototron, with over 5,000 customers and up to 60% of orders coming from new customers each month, that can add up to a lot of wasted time and effort just in the quoting stage. Dave Ryder, Prototron president, and Mark Thompson, engineering support, delve into this continuing issue and more.
Birds of a Feather: PCB Carolina and the RTP Designers Council
At PCB Carolina 2018, I met with show founders Tony Cosentino, Randy Faucette, and Lance Olive, who are all employees at the Better Boards service bureau in nearby Cary. I asked the trio to discuss the show’s history, its relationship to the Research Triangle Park (RTP) North Carolina Chapter of the IPC Designers Council, as well as the show’s tremendous growth over the past few years.
Dan Feinberg: A CES 2019 Preview
Dan Feinberg gets a first look at the new devices and technologies being shown this year at the innovation world's biggest expo. Read on.
Top 10 Most-Viewed FLEX007 Articles in 2018
Here’s a list of the top 10 most viewed FLEX007 articles in the past year.
Susy Webb: The History and Future of the Designers Council
When we started planning this issue on the IPC Designers Council, I knew I’d have to speak with design instructor Susy Webb, a longtime DC member and currently an executive board officer. I asked Susy to discuss how she first got involved with the DC, why designers should join their local chapter, and what the future holds for this group.
Top 10 Most-Read PCB007 Interviews of 2018
Here’s a list of the top 10 most-read PCB interviews in the past year. Topping the list is an interview by Publisher Barry Matties with industry veteran Gene Weiner, who talked about the market conditions in China, and any effect the new U.S. administration might have on trade relations going forward.
Upcoming 2019 Trade Show Season in the USA
A look back at Dan Feinberg's predictions made a year ago, and a preview of what we might see at CES 2019 along with some new projections. CES—the first, largest, and most influential and predictive of global electronics trends of this group of trade shows.
Rick Almeida Discusses DownStream's Latest News
At the 2018 electronica exhibition in Munich, Rick Almeida, founder of DownStream Technologies, brings Editor Pete Starkey up to speed with the company’s latest news.
New Designers Council Column: The Digital Layout
The IPC Designers Council is launching a new column in Design007 Magazine: “The Digital Layout.” I recently asked two IPC Designers Council (DC) Executive Board members, Mike Creeden and Stephen Chavez, to discuss the content and objective of their new column, and how this all ties in with the DC.
Stephen Chavez: Breaking the Design Data Bottleneck
When we started planning this issue on design data, I knew we’d have to speak with PCB designer and EPTAC design instructor Steph Chavez. In this interview, he explains some of the biggest issues related to good design data handoff, and he offers some ways forward.
150+ Years of Experience: Reflections with Three Industry Icons
You would be hard-pressed to find a more knowledgeable and experienced group than that of Gary Ferrari, Gene Weiner, and Happy Holden. In a brief interview with Barry Matties, these three industry icons consider the past, present, and future state of electronics manufacturing while also offering advice to the newest generation of manufacturers.
Strategies to Manage Your China Business Through Turbulence
While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.
IPC Workforce Pledge Draws White House Praise, Points the Way to Jobs of the Future
President Trump kicked off the workforce challenge to U.S. businesses in July. As a longtime leader in education and training within the electronics industry, IPC took it as an opportunity to review our existing programs and identify ways to grow and innovate. The result? IPC joined the Pledge to America’s Workers by promising to create new career opportunities for at least 1 million Americans in the electronics industry.
IPC Signs White House Pledge to the American Worker
IPC has signed the President’s Pledge to the American Worker and made a commitment to create at least 1 million new training and workforce development opportunities in the electronics industry over the next five years.
Catching up With Scott McCurdy and Freedom CAD
During PCB West, Scott McCurdy of Freedom CAD Services sat down with Technical Editor Tim Haag for an interview. We discussed Freedom CAD’s latest news, some trends in PCB design software tools, and the continuing need to draw more young people into a career in PCB design.
RTW SMTAI: John Mitchell Updates on IPC's Education Efforts
Dr. John Mitchell, president and CEO of IPC, sits down with I-Connect007 Managing Editor Nolan Johnson to discuss IPC's recent work in education and workforce engagement, as well as the latest developments in their certification program.
Defense Speak Interpreted: Defense Electronic Supply Chain Issues
On October 5, 2018, the Department of Defense (DoD) highlighted issues with the release of the 146-page report “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” from President Donald J. Trump.
SLP: The Next Level of Technology
As our electronic devices and machines become more powerful and as Moore’s Law chugs along, things in the world of PCBs keep getting smaller. You know the drill—finer lines and spaces, thinner laminates, more layers— cram more circuitry into the same or shrinking area. Where will it all end? Or will it?
PCBs Are Moisture-Sensitive Devices
Research by SMT & Hybrid GmbH (now SMT Elektronik) was conducted just prior to the original publication of IPC-1601, which now provides detailed guidelines for the packaging and storage of PCBs, both from the PCB manufacturer and at the assembler’s manufacturing floor.
BGA Fanout Routing Overview
PCB developers are deluged with new challenges caused by increasing density and smaller components. Ball grid arrays (BGAs) create particular challenges during layout, with hundreds of connections in just a few square centimeters. Fortunately, designers now have options for addressing these issues.
PCB Design, Fabrication and Use from the Mil-Aero End-User Perspective
The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.
Press Release Tips
Copyright © 2020 I-Connect007. All rights reserved.