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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/01/2022 | Andy Shaughnessy, Design007 Magazine
EIPC Summer Conference 2022: Day 2 Review
06/29/2022 | Pete Starkey, I-Connect007
EIPC Summer Conference 2022: Day 1 Review
06/28/2022 | Pete Starkey, I-Connect007
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
06/24/2022 | I-Connect007
Catching up With Author Ed Chambliss: Fixing a ‘Broken’ Business Model
06/22/2022 | Dan Beaulieu, D.B. Management Group
PCB :: Suppliers
HDI: Today, Tomorrow and the Future
For the November issue of The PCB Magazine, our editorial team interviewed some of the top HDI experts in the PCB supply chain. Joining us on the conference call were Steve Bird, PCB/flex technology manager at Finisar, and Tony Torres of APCT.
35 Years of HDI Fabrication Processes and Obstacles for Implementation
The electronics industry is the world’s largest and most robust market. It is also a bulwark of American creativity, with Silicon Valley as its origin and fortress.
HDI: Born in the USA and Making a Comeback
There is no denying that high-density interconnect (HDI) has been around a long time—over 25 years, believe it or not. From almost the moment of its conception in the U.S., the technology was adopted by and used almost exclusively in Asia.
Walt Custer’s Annual Update from productronica 2017
Industry consultant Walt Custer of Custer Consulting sat down with me at productronica 2017 to once again inform our readers with his yearly update and perspective on what’s happening in the industry. And guess what? It’s good news! Pertinent charts referenced in our conversation are included, but if you want more, Walt invites you to click the link at the end of this conversation and email him directly.
Video from productronica 2017: Electra Polymers Updates on the Latest Developments in DI Soldermask
From the show floor at productronica 2017, Electra Polymers' sales manager Ashley Steers discusses the state of the art in soldermask for direct imaging. Sales and marketing director Shaun Tibbals comments on developments in ink-jet soldermask, and opportunities in wafer-level packaging.
Video from productronica 2017: DIS Improves Registration of Flex and Rigid-Flex PCBs
From the show floor at productronica 2017, we stopped by the DIS booth for a conversation with Tony Faraci. Here, he explains how DIS has tackled the challenges of handling and alignment of flex-rigid multilayer builds (especially cut-out pre-preg layers and packing pieces) and automated what was previously an operator-dependent manual process.
Video from productronica 2017: Taiyo America Highlights Ink-Jettable Solder Mask
After a long-term program of cooperative development, evaluation and qualification, Taiyo America’s solvent-free ink-jet solder mask formulation is working successfully in a technically demanding production environment. Don Monn recounts his experiences from the show floor at productronica 2017.
Video from productronica 2017: Rogers Discusses Trends Driving Growth
Dirk Lefelon, European sales manager for Rogers Corporation, discusses his group’s final 2017 results. He also explains what the new year will bring, including increased investment in capacity for the European market, especially for the automotive segment.
The PCB Norsemen: Industry 4.0, AI and CircuitData
As automation works its way onto the shop floors, it still struggles to replace humans in the supporting roles, such as designers, purchasers, brokers, and back-office staff. Where automation on the shop floor replaces humans in doing repetitive manual tasks, the supporting roles (at least some of them) require intelligence to understand and utilise information.
Catching up with…Brigitflex
Today, Brigitflex is building unique custom-made boards for companies all over the world, from large defense and aerospace companies to small incubator companies inventing new products. They have become well-known as the shop to go to when nobody else can solve your problems.
The History of Predictive Engineering
It all started in 1983, at HP, when I complained to our group's vice president that our W. Edwards Deming and Total Quality Management (TQM) Six Sigma training was being concentrated in PCB manufacturing. We had eliminated final inspection and instead placed quality in the hands of the operators with a final electrical test. The electrical test was governed by what we learned from Deming.
Final Finishes: Taking Gold Thickness into Account
Martin Bunce was one of several people from MacDermid Enthone who presented at SMTA International this year. He sat down with me for a chat about his paper on final finishes, particularly with regard to controlling gold thickness.
Strategies for Developing Copper Plating Systems
I-Connect007's Patty Goldman met with Dr. Albert Angstenberger, global technology manager for metallization with MacDermid Enthone Electronics Solutions, while at SMTA International. He presented a most interesting paper on copper pillar plating systems that we hope to publish in The PCB Magazine sometime in the future.
Experts Discussion: Signal Integrity and Impedance Control
When the content gathering for an issue on signal integrity and controlled impedance was officially underway, our I-Connect007 editorial team’s first stop was an “experts discussion” with industry experts: Mike Steinberger of SiSoft, Mark Thompson of Prototron Circuits, and Yogen and Sunny Patel of Candor Industries. This teleconference call was a whirlwind at times, but we captured valuable information that we have distilled here, for our readers.
Predictive Engineering: Happy Holden Discusses True DFM
Happy Holden has been involved in DFM for over 45 years, since he first started working at HP and optimized their PCB design and manufacturing processes. Naturally, for this issue, Barry Matties and Andy Shaughnessy made it a priority to get Happy’s thoughts on DFM, and what true DFM entails.
Institute of Circuit Technology Hayling Island Seminar 2017
This year’s event had a well-chosen and varied programme featuring presentations on process chemistry and R&D consortia, a discussion of controversial standards proposals and a review of the experiences of commissioning new technology in a start-up factory.
Catching Up with FineLine Global
With locations all over the world and technology offerings covering all technologies, I wanted to see for myself what this “broker on steroids” was all about—how they got started and how they grew. So I was delighted to have a conversation with Eli Ikan, Fineline Global’s General Manager.
RTW SMTAI: What's New at MacDermid Enthone
Jim Hartzell of MacDermid Enthone explains the responsibilities of his new position servicing the end-user as part of a group that deals directly with OEMs. He also discusses MacDermid's steady growth and some of the hotter market segments, as well as a variety of new product offerings.
The State-of-the-Art in PCB Pre-production Engineering
If there’s one benefit of old age, it’s being able to remember the introduction to our industry of technologies that may be taken for granted by the present generation, but were revolutionary at the time. I can recall the history of Ucamco as far back as the late 1980s when, as one of the very early adopters of the DISC laser plotter and its associated electronic PCB front-end tooling system, our company gained entry to a spectacular new world of pre-production engineering capability.
Ventec Shares Their Insights on the Laminate Market, Part II
The discussion on laminates and markets with Ventec’s Mark Goodwin continues as he talks about the importance of service, where Ventec is headed, and offers some advice on partnering with your supplier.
Ventec Shares Their Insights on the Laminate Market, Part I
I-Connect007’s Barry Matties sat down with the COO of Ventec USA/Europe, Mark Goodwin, to discuss the laminate market as a whole, the market segments behind that growth, and how Ventec has positioned itself in the thermal management space.
High-Throw DC Acid Copper Formulation for Vertical Continuous Electroplating Processes
The electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors.
Weiner’s World—August 2017
IPC is planning to hold a special meeting on automotive electronics for senior executives during IPC APEX EXPO 2019. The meeting will be planned and produced by the IPC Ambassador Council. Its presentations will feature senior members of the entire automotive electronics supply chain.
NEPCON South China 2017 Opens Today
NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 and Automotive World China, opens its doors today at the Shenzhen Convention and Exhibition Center to showcase nearly 600 companies catering to the electronics manufacturing industry. This year’s event, the largest ever in the show's 30-year history, features 45,000 square meters of exhibition space.
Compliance Management: The Defining Factor Between Success and Failure
Compliance management in the defense industry can be the defining factor between financial success and costly mistakes. This short article highlights some of the risks and implications of failing to comply with U.S. Defense export and import regulations.
IMPACT Interview: Tony Revier, Uyemura
One of the best parts of IMPACT for me is meeting and getting to know people in our industry that I haven’t met before. While hors d’oeuvres were coming around before the Tuesday evening awards dinner, I found a quiet corner to talk with Uyemura USA President and CEO Tony Revier.
The Speed of Nouya: Interview with Bao Xinyang of Shanghai Nanya
The theme of the June issue of PCB007 China Magazine is "High-Speed Materials." As is becoming more widely understood, domestic material supply is the only way for China’s high-frequency, high-speed circuit board industry to grow.
A Conversation with New Isola Chief Revenue Officer Michael White
In a recent conference call with Isola’s new Chief Revenue Officer Michael White, I-Connect007 Publisher Barry Matties, and Managing Editor Patty Goldman gained a deeper understanding of the internal reorganization happening right now with Isola and Mike’s plans for Isola’s marketing team.
High-Frequency, High-Speed: an Opportunity for China CCLs to Lead
As a leading Chinese CCL manufacturer, Shengyi Technology has invested 250 million RMB in 2016, for the new Jiangsu Shengyi Special PCB Co. Ltd. facility, which will make high-frequency, high-speed CCL product. We invited Lin Xia, senior marketing director of Guangdong Shengyi Technology Co. Ltd., and assistant general manager of Suzhou Shengyi Sci-Tech Co. Ltd. He will be focusing on why high-frequency high-speed CCL is a good opportunity for China manufacturers to become a worldwide leader in this arena.
Review of the 2017 IPC Reliability Forum
IPC continues to lead our industry by example with their inaugural Reliability Forum, held in Chicago in April. The event was focused on manufacturing high-performance products and featured industry royalty from both a speaker and audience standpoint.
I-Connect Survey on Process Step Elimination: What is More Important for Productivity?
Is utilizing the best technology out there the most important factor in improving productivity? Or is it automating certain, if not all, processes in your production? What about employee morale, what is its impact on the overall productivity of your line?
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 2
The second day saw the conference room full once more, the late networking session in the bar having resulted in no significant casualties, and I was pleased to accept the invitation to moderate the first session, on processes and materials for flexible PCBs.
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
HDP User Group 2017 European Meeting Highlights Technology Progress
The conference facility at the offices of Oracle, in the royal burgh of Linlithgow in West Lothian, Scotland, was the venue for the 2017 European meeting of the High Density Packaging User Group. I was delighted and privileged to be invited once again to sit in on the open session, an intense programme of technical presentations and discussions, project reviews, status updates and new project proposals.
Weiner’s World—May 2017
China’s central bank is effectively anchoring the yuan to the dollar, a policy twist that has helped stabilize the currency in a year of political transition and market jitters about China’s economic management. The yuan weakened more than 6% against the dollar in 2016; this year, it is up roughly 1%, and the expectation that the currency will fluctuate—a gauge known as implied volatility—is around its lowest in nearly two years.
Growth Ahead for Flexible Hybrid Electronics Industry
According to Zion Research, “global demand for the flexible electronics market was valued at $5.13B in 2015 and is expected to generate revenue of $16.5B by 2021, growing at a CAGR of slightly above 21% between 2016 and 2021.” Key elements of the market, in the view of most analysts, include flex displays, sensors, batteries, and memory.
Deep Into Technology at Compunetics
There aren’t many printed circuit companies in my neck of the woods. There is one, however, that has always fascinated me, and that is Compunetics, in Monroeville, Pennsylvania, a suburb of Pittsburgh. Having worked with them on the electrophoretic photoresist, a PPG product, many years ago, it was great to stop by and catch up with CTO Tim Schmitt and Technical Applications Manager Jesse Ward, along with General Manager Burhan Capar, a relative newbie to the company.
'Flexdude' Tom Woznicki Celebrates Company’s 25th Anniversary
Twenty-five years ago, Tom “Flexdude” Woznicki got laid off. A lot of people did, back during the mini-recession that helped bring Bill Clinton into the White House. So, he launched his own flex circuit design bureau and never looked back. Since then, he’s designed flex circuitry for everything under the sun, including the Mars Rover; the flex circuits he designed are visible in many of the Rover photos. I ran into Tom at DesignCon 2017 and we discussed the benefits of flex circuits, the expansion of the flex market, and his company’s first quarter-century in operation.
Mutracx Makes Green Operations Economically Viable
During IPC APEX EXPO, I sat down for an interview with with Jeroen de Groot, CEO of Mutracx. He detailed the company’s plans to install new equipment at a facility in Romania, and he explains why having a green manufacturing operation is not enough—it must also be economically feasible.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
RTW IPC APEX EXPO: Updates on Formulations for Direct Imaging and Inkjet Technologies
Chris Wall, technical director and Shaun Tibbals, sales and marketing director at Electra Polymers, review latest developments in digital imaging technologies for solder resist. Multi-wave direct imaging systems give more scope to the ink supplier to optimize formulation and offer improved flexibility of operation to the user.
EIPC Workshop on PCB BioMEMS
The Premier Inn conference centre at Heathrow Airport was the venue for the EIPC workshop on PCB BioMEMS. What, I hear you ask, is a PCB BioMEMS? This is an abbreviation for biomedical (or biological) microelectromechanical systems, otherwise known as lab-on-chip.
RTW IPC APEX EXPO: ERP System Helps Gardien Ensure Global Consistency in Quality Assurance Services
How does a global provider of quality assurance services to the PCB industry give its customers the peace of mind that no matter where they utilize its services that they will always be to the same consistent high standard? Gardien Global VP of Quality Rick Meraw explains the benefits of an in-house-developed ERP system in driving efficiency and best practice throughout the organization.
Mike Carano on the First PCB Executive Forum Held at IPC APEX EXPO 2017
When John Mitchell came on board as president of IPC, he decided to tap the members of the Raymond E. Pritchard Hall of Fame for suggestions and advice. So he established the IPC Ambassador Council and tasked them to create special programs for IPC conferences. It is this group of people who put together the recent PCB Executive Forum that was presented at IPC APEX EXPO 2017.
RTW IPC APEX EXPO: John Davignon Offers HDPUG Update
The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.
The Near and Far Future for Orbotech and Inspection
Orbotech’s PCB Division President Arik Gordon and I spoke in detail about the company’s newest developments in automated optical shaping (AOS), Orbotech’s unique culture and commitment to R&D, and what he expects to see in the near future for the inspection industy.
RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.
RTW IPC APEX EXPO: Ventec Talks Benefits of High-Level OEM Tech Team
Managing Director of Ventec Europe, Thomas Michels comments upon the complementary non-copper-clad-laminate, one-stop-shopping opportunities that have resulted from the merger of the TMT business with the Ventec operation, and discusses the benefits of a strong integrated supply chain and a high-level team of OEM applications specialists in building long-term partnerships between Ventec and its customers.
RTW IPC APEX EXPO: Schmoll and Taiyo America Partner to Speed Up Solder Mask Development
How to accelerate the development of specialist direct-imaging solder resists to suit the requirements of the Asian and North American markets? Jesse Session, technical manager at Taiyo America, describes how close collaboration between ink formulator and equipment supplier enables the optimization to be achieved most effectively.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider. He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: Taiyo Discusses Option for PCB Heat Dissipation—Thermally Conductive Solder Resist
Conventional solder resists are relatively poor conductors of heat, but dense PCB assemblies generate heat that needs to be dissipated by all means possible. Don Monn, business development and European sales manager for Taiyo America, introduces a ceramic-filled formulation that increases thermal conductivity by a factor of 10 or more.
RTW IPC APEX EXPO: Ventec Discusses CCL Supply Chain Issue
Mark Goodwin, COO of USA and Europe for Ventec International Group, and Jack Pattie, CEO of Ventec USA, discuss the effect of current material issues on the supply chain for copper-clad laminate, comment upon prospects for the future and stress the importance of customer-supplier relationships in forecasting and planning requirements.
RTW IPC APEX EXPO: Orbotech Tackles Next-Gen Interconnection Density
Orbotech West President Sharon Cohen explains the company structure and philosophy—translating ideas into reality - and how, by understanding the issues driving PCB technology, Orbotech is able to provide the imaging and inspection tools to meet the needs of next-generation interconnection density.
RTW IPC APEX EXPO: Lenthor Engineering Updates Rigid-Flex Capabilities
Lenthor's CFO Oscar Akbar and EMS Manager Matt Kan tell Guest Editor Kelly Dack about the growing flex market and Lenthor's strategy to grow with it.
The Power of Three: A Solder Mask Solution for North America
Technology and process developments in mature industries like the printed wiring board industry are not always easy. Many new products are evolutionary enhancements of existing processes. Often, these developments enhance the process and improve overall process control.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
RTW IPC APEX EXPO: Changing Drilling With Perfect Point Drill and Jinzhou Precision Tech
Shane Stewart VP of sales for Perfect Point and Michael Kwok for Jinzhou spoke about their newest drills. A change in the stucture of the bit itself results in a cleaner hole and a better positional accuracy.
Schmoll Talks Technology
Schmoll’s Thomas Kunz and I had a chat recently at the HKPCA show. In our short discussion, we covered several topics, including Schmoll’s approach to the U.S. market, their work in direct imaging, and the nature of their relationship with ink suppliers.
RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.
RTW IPC APEX EXPO: Arlon's Partnership With Doosan Brings Benefits All Around
The recent distribution agreement between Arlon EMD and Doosan Electro-Materials enables the supply and technical support of Doosan’s flexible laminates and high-Tg FR-4 and halogen-free materials into North America to complement Arlon’s established range of polyimide and specialty materials for the military, avionics and space market segments. Arlon vice president Brad Foster explains the opportunities and benefits.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
RTW IPC APEX EXPO: New Strategies in the U.S. for Eternal Photoresist
Bob Ferguson, CEO of Break Free Strategies and well-known industry executive, talks with Guest Editor Mike Carano (RBP Chemical Technologies) about his role in helping Eternal Materials position its photoresist technology to compete in the North American marketplace.
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Real Time with...IPC: MacDermid Enthone Positions Itself to Meet the Needs of the Electronics Supply Chain
Warren Kenzie, Technical Director at Macdermid Enthone, discusses with I-Connect007 Guest Editor Mike Carano the critical need to develop equipment sets that are properly designed to ensure optimal functioning of the production processes. He also noted the need to understand the relationship between materials, chemistry, equipment, and people.
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
Catching up with…Nessis Inc. President Kathleen Niles
When I checked in on one of my old PCB sales associates recently, he told me that he had a new gig selling the latest and greatest new productivity software tools. He spoke so highly about Nessis Inc. and what their tools could do for companies, especially PCB shops, that I decided to learn more. I arranged to talk with Kathleen Niles, the co-founder and president of Nessis Inc. Here is a portion of that conversation.
Patty’s Perspective: Everything Old is New Again
This month’s issue is all about plating and surface finishes; long ago, that was pretty much my start in the world of printed circuits—wet processing. So this is kind of my home turf—and not, since I haven’t worked in wet processing for some…well, for many years. I’ve always expected that I could hop right back onto the plating room floor and pick right up where I left off all those years ago. Or could I? Have things changed much? Time to read on and see.
Rather than joining the annual forecast fray by attempting to provide guidance or guesses as to the outlook for the PCB and electronic assembly businesses in 2017, I thought I would provide a different year-end assessment. Here are a few thoughts for the New Year and beyond from a long-term colleague and friend of the past half century, Harvey Miller, electronics market researcher, consultant and founder of Fabfile Online.
Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri of Rogers Corp. speaks with I-Connect007's Stephen Las Marias about the 5G trend and thermal management issues in power electronics and how they will impact PCB materials requirements.
Ladle on Manufacturing: Making Suppliers Work for You
Every company has its own way of doing things. For some, the engineering team develops a detailed specification for the equipment they would like to purchase and this is put out to multiple suppliers for tender, along with full documentation for the commercial terms that will apply to the purchase. At the other end of the scale, a machine inquiry can be a simple phone call: “How much for a new machine?”
Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
Orbotech's Shavi Spinzi speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers. He explains why the PCB manufacturing industry needs to move to Industry 4.0, and discusses how Orbotech can help them in their Industry 4.0 journey.
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