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ESI’s Chris Ryder: There’s More to Choosing a Laser Than You Think
01/16/2019 | Barry Matties, I-Connect007
CES Press Day: NVIDIA, Samsung, and Intel
01/11/2019 | Dan Feinberg, Technology Editor, I-Connect007
Agfa on Revolutionary Inkjet Solder Mask Applications
01/10/2019 | Pete Starkey, I-Connect007
Better to Light a Candle: Chapter One—Prepping the Next Generation
01/08/2019 | Marc Carter, Independent Contributor
Dan Feinberg: A CES 2019 Preview
01/08/2019 | Dan Feinberg, Technology Editor, I-Connect007
Eagle Electronics: Success through 'Building Everything'
During a recent visit to Chicago, Editors Andy Shaughnessy and Patty Goldman stopped by Eagle Electronics just outside of Chicago. Chief Operating Officer Brett McCoy gave them a tour of the facility, and spoke about the company’s plans for the future, and why Eagle is bucking the niche market trend and manufacturing a wide variety of PCBs.
RTW IPC APEX EXPO: Lenthor Engineering Updates Rigid-Flex Capabilities
Lenthor's CFO Oscar Akbar and EMS Manager Matt Kan tell Guest Editor Kelly Dack about the growing flex market and Lenthor's strategy to grow with it.
RTW IPC APEX EXPO: Prototron's Russ Adams on their 30th Year
Prototron's Russ Adams and Editor Kelly Dack discuss the company’s 30th year in business and their latest endeavors to meet their customer’s needs. Don't miss this chance to hear Kelly sing "Happy Birthday."
The Power of Three: A Solder Mask Solution for North America
Technology and process developments in mature industries like the printed wiring board industry are not always easy. Many new products are evolutionary enhancements of existing processes. Often, these developments enhance the process and improve overall process control.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
RTW IPC APEX EXPO: Candor Industries' Unique Capabilities Through an Alternative PCB Manufacturing Process
Sunny Patel, Technical Sales Manager with Candor Industries, tells Guest Editor Kelly Dack about their unique manufacturing method that not only improves PCB process turnaround time but also yields much tighter design constraint quality.
RTW IPC APEX EXPO: Changing Drilling With Perfect Point Drill and Jinzhou Precision Tech
Shane Stewart VP of sales for Perfect Point and Michael Kwok for Jinzhou spoke about their newest drills. A change in the stucture of the bit itself results in a cleaner hole and a better positional accuracy.
Schmoll Talks Technology
Schmoll’s Thomas Kunz and I had a chat recently at the HKPCA show. In our short discussion, we covered several topics, including Schmoll’s approach to the U.S. market, their work in direct imaging, and the nature of their relationship with ink suppliers.
RTW IPC APEX EXPO: Impact of Cross-Hatched Ground Planes on HF Electrical Performance of Flex Circuits
The HDPUG High-Frequency Flex project is studying the effect of different design features, specifically cross hatched ground planes, on signal integrity for flexible printed circuit boards operating at frequencies up to 20 GHz. Jonathan Weldon, RF Applications Engineer at DuPont Electronic Materials, discusses some of the results of the program.
RTW IPC APEX EXPO: Arlon's Partnership With Doosan Brings Benefits All Around
The recent distribution agreement between Arlon EMD and Doosan Electro-Materials enables the supply and technical support of Doosan’s flexible laminates and high-Tg FR-4 and halogen-free materials into North America to complement Arlon’s established range of polyimide and specialty materials for the military, avionics and space market segments. Arlon vice president Brad Foster explains the opportunities and benefits.
Imagineering CEO Khurrum Dhanji Discusses New AS9100 Guidebook
I have had many conversations with Imagineering President and CFO Parvin Dhanji, and CEO Khurrum Dhanji, and I always come away very impressed with their dedication to their community, associates and their customers. That’s why it was no surprise to me that they teamed with I-Connect007 to publish this long overdue guide to AS9100.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
Vertical Conductive Structures–a New Dimension in High-Density Printed Circuit Interconnect
From our previous conversations, I knew that Joan Tourné was working on a novel high-density interconnection concept. Having eagerly awaited the chance to discuss the technology in detail, I was delighted when he contacted me to confirm that his IP had been secured and that he could now talk openly about VeCS, the Vertical Conductive Structure designed to provide a cost-effective alternative for complex fan-out from fine-pitch grid array components.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
RTW IPC APEX EXPO: John C. Maxwell Leadership Training Discussion
Steve Williams discusses his recent certification as a Maxwell Leadership coach and speaker. The discussion centers on the need for leadership development at all levels of an organization. As many companies have found, supervisors are often promoted for their tactical ability, but without the necessary supervisory skills.
RTW IPC APEX EXPO: New Strategies in the U.S. for Eternal Photoresist
Bob Ferguson, CEO of Break Free Strategies and well-known industry executive, talks with Guest Editor Mike Carano (RBP Chemical Technologies) about his role in helping Eternal Materials position its photoresist technology to compete in the North American marketplace.
RTW IPC APEX EXPO: APEX EXPO Wrap-up Roundtable
Publisher Barry Matties and Managing Editor Andy Shaughnessy join Bob Neves of Microtek Labs for a review of IPC APEX EXPO 2017 and a look at the state of the PCB industry.
RTW IPC APEX EXPO: Tara Dunn talks with Clark Webster from All Flex
Clark Webster discusses the increased need for high temperature, high speed materials, new developments in their assembly capabilities and the importance of working with your manufacturer for flex design.
Time-Lapse Video: The IPC APEX EXPO 2017 Show in Under Seven Minutes!
During IPC APEX EXPO 2017, we at I-Connect007 had our time-lapse camera running from setup to closing. The camera was positioned high in our studio, where we conducted our RealTimewith…IPC APEX EXPO video interviews, aimed down the main aisle.
Real Time with...IPC: Don Veri on Meyer Burger's Latest Inkjet Developments
Don Veri, sales and business development for Meyer Burger, discusses the company's newest inkjet technology, as well as their focus on printed electronics.
Patty's Perspective: New Technology Heading our Way— Faster than Ever!
As an excellent introduction to this issue, IPC’s John Mitchell gives us a wonderful overview of what emerging technology is and what we need to do to keep up. One thing he emphasizes is a trained and competitive workforce. Indeed, in our recent hiring survey we learned that an overwhelming percentage of you are concerned about a shortage of skilled and qualified people. John’s column is a great call to action.
Real Time with...IPC: IPC Market Research Update
Sharon Starr updated everyone on the Market Research services, industry forecasting and research projects her group publishes. She also mentioned a "call to action" for a meeting tomorrow with IPC members, seeking input on needed metrics for their new Pulse of the Industry program she will be rolling out this year, which will be a "Industry Health Scorecard".
Real Time with...IPC: American Standard Circuits Strives to Define the Future of PCB Technology
VP of Operations Olson discussed his company's wide range of technology and how they are poised to take on whatever their customers need.
Ladle on Manufacturing: Drilling Deep
Whether you stack high or drill thick panels, the dynamics of drilling are similar. When you overlay the outer-layer artworks you may notice that the holes on the exit side of the panel or stack have a much higher level of positional variation than the entry side holes.
Real Time with...IPC: MacDermid Enthone Positions Itself to Meet the Needs of the Electronics Supply Chain
Warren Kenzie, Technical Director at Macdermid Enthone, discusses with I-Connect007 Guest Editor Mike Carano the critical need to develop equipment sets that are properly designed to ensure optimal functioning of the production processes. He also noted the need to understand the relationship between materials, chemistry, equipment, and people.
Real Time with...IPC 2017 Videos Now Available for Viewing
Over 70 video interviews from the IPC APEX EXPO 2017 show in San Diego, CA are now available for viewing. See the opening ceremony, hear from suppliers and others on their new products, learn more about the HDP Users Group. Don't miss the videos by IPC President John Mitchell and his staff.
Catching up with…Prototron Tucson’s General Manager Kim O’Neil
Prototron’s Tucson Division serves as the company’s military defense division as well. They focus on mil-spec and aerospace work as well as special technology PCBs such as RF, microwave and flex circuits. During the past few months Kim 0’Neil and his team have been working on updating their mil-spec qualification from MIL-PRF-55110 to MIL-PRF-31032. Since Prototron is one of the first companies to make this transition, I wanted to talk to Kim about this accomplishment.
EIPC 2017 Winter Conference Review of Day 2
Almost everyone made it back to the conference room for the start of the second day of the EIPC Winter Conference in Salzburg, even those who had enjoyed the late networking session into the early hours!
EIPC 2017 Winter Conference Review of Day 1
Themed to address the question: “The Future Needs of the Global Electronics Industry: What Solutions will Europe Provide?" the conference was a truly international event, attracting delegates from thirteen countries, to hear a well-chosen programme of twenty presentations in five sessions, introduced by EIPC Chairman Alun Morgan.
Weiner’s World—January 2017
This month’s column is a bit shorter than usual as we prepare for next month’s IPC APEX EXPO and its Executive Forum for PCB fabricators and their supply chain. This month also marks the 65th anniversary of Epec LLC in New Bedford, Massachusetts. The company, founded in 1952, is the oldest printed circuit fabricator in North America. Half of its $50 million in sales is reported to be with printed circuits.
Electroplated Copper Filling of Through-holes: Influence on Hole Geometry
The process consists of a two-step acid copper plating cycle. The first step utilizes periodic pulse reverse (PPR) electroplating to form a conductive copper bridge across the middle of a through-hole and is followed by direct current electroplating to fill the resultant vias formed in the bridge cycle.
Trouble in Your Tank: Acid Copper Plating
Electroplating a printed circuit board is by no means a trivial task. Higher layer counts, smaller-diameter vias (through-hole and blind) as well as higher-performance material sets contribute to the greater degree of difficulty with today’s technology.
Help Wanted! Our 2017 Industry Hiring Survey
This month we conducted an industry survey on plans for hiring during the year. Included here is a summary of the results. We started by simply asking, “Do you plan to hire additional people this year?” More than half of the respondents answered yes while about a third said no—which we take as an optimistic sign that our industry plans to expand in 2017.
Study of Immersion Gold Processes Used for Both ENIG & ENEPIG
The use of electroless nickel/electroless palladium/immersion gold (ENEPIG) has been steadily increasing the past several years and benefits of the finish have now become well-known throughout the industry. The finish provides both reliable solder joints and wire bonds
Now is the Time for Comprehensive Tax Reform
Tax policy is among the most basic tools of any government to accomplish its objectives. From the private sector perspective, taxes are one of largest expenses of any business. But despite being such an important topic for government and business, there is widespread agreement that the U.S. federal tax code is a mess.
Catching up with…Nessis Inc. President Kathleen Niles
When I checked in on one of my old PCB sales associates recently, he told me that he had a new gig selling the latest and greatest new productivity software tools. He spoke so highly about Nessis Inc. and what their tools could do for companies, especially PCB shops, that I decided to learn more. I arranged to talk with Kathleen Niles, the co-founder and president of Nessis Inc. Here is a portion of that conversation.
Patty’s Perspective: Everything Old is New Again
This month’s issue is all about plating and surface finishes; long ago, that was pretty much my start in the world of printed circuits—wet processing. So this is kind of my home turf—and not, since I haven’t worked in wet processing for some…well, for many years. I’ve always expected that I could hop right back onto the plating room floor and pick right up where I left off all those years ago. Or could I? Have things changed much? Time to read on and see.
Understanding Rush PCB
I had an interesting interview recently with Rush PCB CEO Akber Roy, who goes by Roy. I was stunned by some of the things he told me about the Silicon Valley company, such as how Rush PCB can turn around full turn-key quotes in less than three hours. He also told me they can deliver full turn-key product in five days or less, sometimes three days.
WKK and Schmoll Join Forces in China
Tom Burkhardt of Schmoll Maschinen and Hamed El-Abd of WKK spoke with Publisher Barry Matties about the recently formed distribution partnership between the two companies and specifically how each company stands to benefit from this pairing.
Ladle on Manufacturing: Material Matters
Have you considered whether or not you could improve your multilayer yields by better use of your base materials? Perhaps the following could give you a few ideas of how this could help you.
CES 2017: Disruptive Technologies
Those of you that have read my previous columns covering CES 2017 know that at recent CES shows I have seen many drones, autonomous cars, IoT devices, robots, and many other items ranging from robots who stand in for your doctor to smart trash cans who tell you via Alexa, Google, or soon, Cortana on your own computer, that since you have thrown away two empty milk cartons in the last few days it may be time to order more milk; just say yes and consider it ordered.
Catching up with...Coast to Coast Circuits CEO Walt Stender
Coast to Coast is an independent American circuit board manufacturing company. Yes, the key word here is “independent.” After many mergers and acquisitions that have diminished the mil/aero PCB vendor base, there are only a handful of independent companies for our country’s defense and aerospace contractors to choose from.
Book Recommendation: Simply Brilliant—Powerful Techniques to Unlock your Creativity and Spark New Ideas
This is more than a brainstorming book, much more. In his new book, Schroeder teaches the reader not only how to brainstorm in a group, but also how to come up with ideas as an individual.
Catching up with…LinkedIn Expert Bruce Johnston
My friend and business associate Bruce Johnston was named one of the LinkedIn Thought Leaders—The USA & Canada List (100+) by Andy O’Hearn, an expert LinkedIn coach and social media analyst. When you consider that there are over 467 million LinkedIn members, being in this list of approximately 100 is a pretty big deal.
CES 2017: Press Day, LaunchIt and Showstoppers
Before the show opens, CES provides two days and evenings not open to the general attendees, to enable companies, large and small, an opportunity to present their new offerings to the press. These opportunities range from small meetings with individual members of the trade press to huge events such as those presented by Samsung, Asus, Sony, Intel, Panasonic and others, with literally several hundred in attendance.
Emmy Ross Discusses the New I-Connect007 E-Book Series
One thing that is long overdue in our industry is a series of guidebooks focused on helping companies with all their needs, from qualifications like AS9100 and Mil-P-31032 to various technologies, heavy copper, rigid-flex and microvias. I-Connect007 is now providing our industry with an entire series of these guidebooks, starting with the first book, "The Printed Circuits Buyers Guide to… AS9100 Certification." Authored by Imagineering Inc., this book educates readers about the AS9100 quality standard, and explains how to earn this certification.
Five New Books that Will Change Your Perspective on Sales and Marketing
In honor of the December topic of sales and marketing of The PCB Magazine, I’m providing a review of five books that can directly influence the way we think about sales, marketing, customers and customer service.
CES Unveiled: Press Day and the NVIDIA Keynote
CES Unveiled exhibitors range from well-known companies such as: Lenovo, showing their latest high-end (and very impressive) notebooks, tablets and all in one computers; Ampad, with their new series of very capable fast and long range routers; and Thrustmaster, showcasing their virtual reality-ready gaming peripherals. Additionally, there are many previously almost unknown companies exhibiting many IoT items.
On Location at HKPCA: IPC’s Mitchell and Carmichael on Asia, the Global Industry Outlook, and Trump
While in Shenzhen, China recently, with the PCB industry’s biggest trade show as a backdrop, Publisher Barry Matties sat down once again to interview IPC President John Mitchell and IPC Asia President Phil Carmichael. This time they discussed trends they’re seeing in the Asia-Pacific region and what a Trump presidency means to the industry.
Catching up with...M&A Expert Tom Kastner
If you want to know what is going on in our industry when it comes to mergers and acquisitions, there is no better person to turn to than Tom Kastner. Whenever I want to verify a rumor of a company being bought or sold, Tom is the first person I call, and unless he is under an NDA, he will fill me in. In this, our latest discussion, we talked about the PCB industry’s M&A activity in 2016 and what Tom expects to see in 2017.
CES 2017: Preview and a Projection for the Future
Well here we are again; one more year has gone. Think back to one year ago and look at all that has happened, including recent political happenings, technical advances in 3-D printing and manufacturing, and the huge improvement in display technology, what with OLED and HDR putting everyday 4K displays into the background and driving the proverbial nail in 3D TVs.
Catching up with…Dr. Anthony Caputo
I met Dr. Anthony Caputo last year while helping one of my clients secure some strong engineering talent. Anthony had been reading my columns and reached out to me since he was looking for a new opportunity in a high-tech printed circuit board facility. Once I read his CV and saw his credentials, I jumped at that chance to help this talented young man.
Rather than joining the annual forecast fray by attempting to provide guidance or guesses as to the outlook for the PCB and electronic assembly businesses in 2017, I thought I would provide a different year-end assessment. Here are a few thoughts for the New Year and beyond from a long-term colleague and friend of the past half century, Harvey Miller, electronics market researcher, consultant and founder of Fabfile Online.
Supplier Spotlight: American Standard Circuits' AS9100 Journey
I had the privilege of working with American Standard Circuits (ASC) over the past year with their successful pursuit of AS9100 quality management system certification. The company has chosen to share their approach, lessons learned and benefits gained by going through this formidable process.
TTM President Thomas Edman on the Global PCB Market, Technology, and More
The TTM and Viasystems merger put the PCB industry on notice last year when it created one of the biggest powerhouses in the world. At this year’s HKPCA and IPC show, Barry Matties met with TTM Technologies President and Chief Executive Officer, Thomas Edman to get his views on the market, technology, the culture of TTM and even the Trump effect.
Book Recommendation: Leading the Unleadable—How to Manage Mavericks, Cynics, Divas, and Other Difficult People
This is the book you’ve been looking for. I approached this book with a bit of trepidation. I wasn’t sure what this was going to be about. But being inquisitive, I decided to give it a read. It was the subtitle "How to Manage Mavericks, Cynics, Divas, and other Difficult People" that got to me.
Real Time With...HKPCA & IPC Show 2016: Rogers Discusses 5G, Power Electronics Trends
At the recent HKPCA and IPC Show 2016 in Shenzhen, China, John Ranieri of Rogers Corp. speaks with I-Connect007's Stephen Las Marias about the 5G trend and thermal management issues in power electronics and how they will impact PCB materials requirements.
'Can Do' in CAM Outsourcing: CAM Engineering – Automation
As volume production in PCB has shifted significantly to Asia, manufacturers in Europe and North America have been focusing on high technology, quick-turn, prototype, and lower-volume production.
Ladle on Manufacturing: Making Suppliers Work for You
Every company has its own way of doing things. For some, the engineering team develops a detailed specification for the equipment they would like to purchase and this is put out to multiple suppliers for tender, along with full documentation for the commercial terms that will apply to the purchase. At the other end of the scale, a machine inquiry can be a simple phone call: “How much for a new machine?”
Real Time With...HKPCA & IPC Show 2016: Orbotech Highlights Need for Industry 4.0
Orbotech's Shavi Spinzi speaks with Editor Stephen Las Marias about the latest trends happening in the PCB manufacturing industry, and the market growth drivers. He explains why the PCB manufacturing industry needs to move to Industry 4.0, and discusses how Orbotech can help them in their Industry 4.0 journey.
Innovative Use of Vias for Density Improvements
In today’s fast-paced global, economic environment—which requires constant innovation, upskilling, and performance improvements— there is a need for increasing density. The classic way to increase density is to reduce the trace and spacing.
Patty’s Perspective: Everything You Want to Know about Vias but Were Afraid to Ask
Regarding our survey on vias, almost 85% of our respondents said they used blind/buried vias. And since 15% of those answering were either suppliers or consultants, it seems that approximately 100% use the B/Bs. OK then, on to a tougher question. We then asked how often, and it turns out that “use” covers everything from rarely to pretty much all the time, with a definite undercurrent of “because we have to.”
New Tools Mean More Designer Control for High-Speed PCBs
In the last hour of the electronica exhibition in Munich, Pete Starkey finally got the opportunity to sit down with Martyn Gaudion, Managing Director of Polar Instruments. They discussed the changing state of PCB design, and how the newest software tools allow PCB designers and engineers to have more control when designing high-speed PCBs.
Real Time with...HKPCA & IPC Show 2016 Slideshow - Day 1
The International Printed Circuit & APEX South China Fair 2016, presented by HKPCA and IPC, kicked off this week in Shenzhen, China. The theme of this year’s event is “Global Wisdom Shaping the Future.”
Advanced UV Lasers for Fast, High-Precision PCB Manufacturing
For more than 30 years, lasers have played a significant role in the manufacturing of PCBs. It is not a coincidence that electronic devices have, at the same time, become increasingly miniaturized. The ability to tightly focus a laser beam much smaller than a mechanical tool has been an enabler of such dense, compact circuitry; and the elimination of consumables such as drilling and routing bits has reduced manufacturing costs.
Aismalibar on Markets, Materials, and the Increase in Copper Prices
As a European laminate provider specializing in insulated metal substrates and thermal management, Aismalibar is often put in the demanding position of catering to some of Europe’s toughest customers, including the automotive industry. Pete Starkey and Barry Matties caught up with Director General Eduardo Benmayor at the most recent Electronica trade show to learn more about the company and get his take on the current state of the IMS marketplace.
Here we go again! The winter holiday (and trade show) season is upon us! Electronica's mood was upbeat. Next, the Asia and San Diego shows. We just received word as we were preparing for our trip to next month's HKPCA/IPC event in Shenzhen China that the CPCA (China Printed Circuit Association) show suddenly changed its March 2017 date and venue. Meanwhile, the HKPCA show, now billed as our industry's largest event, will have nearly 550 exhibitors—of which 20% are new.
KCE Group: A Thailand-Based PCB Manufacturer with a Growing Global Footprint
Recently, while at electronica in Munich, Germany I-Connect007's Judy Warner met KCE America President Rick Rhodes, and Joe Yeo of KCE Group. They discuss the unique challenges and opportunities that come with the rigorous automotive market, and explain why they continue to enjoy explosive growth.
A Scientific Response to Mr. Laminate Tells All
We read with interest Doug Sober’s recent Mr. Laminate Tells All column, "The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware." The article raises interesting questions about the IPC 4101 classification system, primarily, how is a pure resin defined?
Rogers on the Booming Wireless Infrastructure Market
With the advent of 5G and next generation antennas, the already booming wireless infrastructure market is slated for continued growth through 2021, and as the primary material supplier for this sector, Rogers Corp. must continue to meet the technological demands of the Verizons and AT&Ts of world.
Walt Custer’s Global Market Outlook
With 2016 winding down, Walt Custer shared his end-of-the-year market research data with me at the recent electronica trade show in Munich, Germany. In our interview, Walt breaks down his findings and offers insight into the changing trends as we head into 2017.
Mr. Laminate Tells All: The Certification of IPC-4101D Polyimide Base Materials: Buyer Beware
At the most recent IPC meeting held in Rosemont, Illinois, one of the hot topics of discussion at the Laminate and Prepreg Subcommittee was the three polyimide specification sheets. The header portion for the three polyimide-based copper-clad laminates and prepregs are shown in Figure 1, for easy comparison of polyimide grades.
Rogers Highlights Thermally Enhanced 92ML Materials at electronica
I met with Rogers Corporation Business Development Manager John Ranieri at Electronica recently. Ranieri’s professional focus is on the 92ML series of laminate, prepregs, and IMS, which was highlighted at the Munich show. The 92ML products are geared for the power electronics marketplace where thermal management is a major concern.
HKPCA’s Daniel Chan on China’s PCB Manufacturing and Technology Landscape
Editor Edy Yu recently spoke with Daniel Chan, executive director of the Hong Kong Printed Circuit Association (HKPCA). Chan possesses more than 25 years of experience in global business management with strong leadership influencing suppliers and internal clients in business strategy and transformation.
electronica 2016 Impressions
Germany’s third-largest city, and capital of the southeastern state of Bavaria, Munich was once more host to electronica, which can justifiably claim to be the world’s leading trade fair for electronic components, systems and applications.
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