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Altix Discusses Trends in U.S., European and Asian Markets
12/03/2021 | Pete Starkey, I-Connect007
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/03/2021 | Andy Shaughnessy, I-Connect007
EIPC Technical Snapshot Review: Semi-additive Processes
12/01/2021 | Pete Starkey, I-Connect007
Alex Stepinski: A Philosophical View
11/30/2021 | I-Connect007 Editorial Team
Happy Thanksgiving From the I-Connect007 Team
11/25/2021 | I-Connect007
PCB :: Associations
IPC APEX EXPO 2020 Attendees Speak: Lauren Byrge
"We design and fabricate group spaces for various clients on the show floor, so we’re just visiting clients and checking out what IPC APEX EXPO is offering this year," said Lauren Byrge, account executive for Marquis Exhibits. "I feel like the crowd is pretty good. Every booth looks like it’s buzzing. My impression of the electronics industry is good. The people are friendly and nice, and we enjoy working in this space."
IPC APEX EXPO 2020 Attendees Speak: Brian Wojtkiewicz
"It seems they are all pursuing digital imaging; whether it’s direct imaging exposure or inkjet solder mask, they’re all going that direction, and it’s not just the big customers; small customers are doing the same," said Taiyo's Brian Wojtkiewicz. "They’re investing money, which is good. New investment is what has been lacking for a couple of years."
Taiyo America Brings New Ideas to Solder Mask Development
During the show, Technical Editor Pete Starkey and Don Monn, Midwest regional sales director at Taiyo America, discuss the company’s progress with the establishment of inkjet solder mask as a production reality, now with OEM approvals. Monn also addresses the development of crack-resistant white solder mask and new screen-printable formulations with very high thermal conductivity.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
Burkle North America: New Equipment and ‘New Blood’ in the Industry
During the show, Guest Editor Dick Crowe and Kurt Palmer, president and CEO of Burkle North America, discuss Kurt's career history and responsibilities in his present role. Palmer also details the equipment that the company is exhibiting on the show floor, and the palpable excitement that veteran technologists feel this year seeing younger engineers and students attending IPC APEX EXPO 2020. There’s a lot of “new blood” in the industry, as Palmer explains.
IPC APEX EXPO 2020 Attendees Speak: Katie Carl
"We have a wide range of kids. All of them have some sort of interest in technology, which is why they wanted to come in general," said Katie Carl, a high school teacher escorting a group of kids at IPC APEX EXPO. "It’s neat when they start seeing how these technologies are created because a lot of them have seen robotics or have done a tiny bit of soldering with little circuits, but when they can see how those things are built and created in the industry, it makes it more applicable for them."
Congratulations to Steve Pudles! IPC Hall of Fame 2020 Inductee
With over 32 years spent working with IPC, Steve Pudles was elected to the IPC’s Hall of Fame this year. Patty Goldman spoke with Steve about how he first became involved as well as his time in the organization, including his work with the EMS Management Council.
Solder Paste Printing From the Stencil’s Perspective
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.
Will Moisture Management Expand to the U.S. Market?
Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.
IPC Government Relations: Focus on Supply Chain Resiliency
During IPC APEX EXPO, Editor Nolan Johnson sat down with Chris Mitchell, VP of global government affairs, to discuss IPC’s latest initiative with industry intelligence programs. As Chris explains, some of these efforts are focused on improving the DoD’s supply chain. This includes moving the DoD from leaded to lead-free components to help avoid millions of dollars in rework. He also discusses the team’s drive to unite with partners around the world and create a truly global organization.
IPC APEX EXPO 2020 Attendees Speak: Sheryl Long
"It’s a great place to see our customers and other friendly faces," said Sheryl Long, global marketing communications manager for Rogers Corporation. "The traffic has been a little slow this year, but it’s a great place to meet everybody at one spot and to get together and talk about what’s going on in the industry.
Catching up With Flexible Circuit Technologies
Dan Beaulieu catches up with Troy Koopman, president and co-founder of Flexible Circuit Technologies (FCT), and Carey Burkett, the company’s VP of business development. FCT is a full-service flex and rigid-flex supplier.
IPC: Automotive Electronics Segment Exploding
Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.
Advances in Substrates for Thermal Management
Pete Starkey and Eduardo Benmayor, general manager for Aismalibar, discuss ways in which insulated metal substrates have been modified to relieve stresses on the solder joints of high-end LED assemblies during thermal cycling. Eduardo also describes a range of thermally conductive FR-4 laminates that can be processed like standard FR-4 for applications where thermal dissipation can be maximized without changing the design.
IPC APEX EXPO 2020: The I-Connect007 Photo Gallery
If you couldn’t make it to IPC APEX EXPO 2020 in San Diego, don’t worry. I-Connect007 was there to cover it all. From “A Night of Happy-ness” through tear-down, our reporters were on hand to document the entire week.
Not All Plating Lines Are Created Equal
Barry Matties and Happy Holden met with CEO Michael Ludy and CMO Sarah Großmann from Ludy, a company specializing in galvanic plating equipment for PCBs. This interview gives an overview of Ludy and their latest advancements in PCB plating equipment.
American Standard Circuits: Strong Focus on Military and Aerospace
During IPC APEX EXPO 2020, Joe Fjelstad speaks with Anaya Vardya, president and CEO of American Standard Circuits. In this interview, Anaya shares a variety of recent business updates. He also highlights the company's flex technology and I-Connect007 eBooks on flex and rigid-flex fundamentals, as well as RF and microwave PCBs.
IPC Designers Council Has a New Name: IPC Design
Yes, you read that right. The IPC Designers Council is now known as IPC Design. Many of you have heard secondhand stories about what this change will entail, so I asked IPC to shed some light on this subject. I recently spoke with IPC’s Teresa Rowe and Patrick Crawford about what’s changing, what’s not, and IPC’s plans to provide improved infrastructure for PCB design content and curriculum.
iNEMI: Emerging Technologies Driving Rapid Industry Development
During IPC APEX EXPO, Editor Joe Fjelstad spoke with Grace O'Malley, iNEMI's VP of technical and project operations, about the well-attended roadmap sessions and other iNEMI meetings taking place at the show. Topics covered included emerging applications and how these technologies are driving industry development across the board, and at a fast pace.
RTW IPC APEX EXPO: John Mitchell Discusses the Show's Evolution
During IPC APEX EXPO, Technology Editor Dan Feinberg spoke with John Mitchell, CEO and president of IPC, about the event’s evolution from a strictly PCB show into a miniature Consumer Electronics Show, including new ideas and prototypes. They also discussed several new IPC initiatives, including IPC Design.
IPC APEX EXPO 2020 Show Week Time-lapse Video
It was a busy week at IPC APEX EXPO in San Diego, and I-Connect007 was there to cover it all. From set-up to tear down, I-Connect007 captured a four-day time-lapse video of the show floor. We’d like to thank our good friends at MacDermid Alpha for letting us set up our camera in their booth.
IPC APEX EXPO Reflections
The sun may have risen and set on the 2020 edition of IPC APEX EXPO, but the developments from the week in San Diego certainly will linger with us for some time. Editor Nolan Johnson provides a summary of the events at IPC APEX EXPO 2020 in San Diego, California.
Phil Carmichael: IPC Asia Continues Solid Growth
Phil Carmichael, IPC president of Asia Pacific, talks with Barry Matties at the HKPCA show during the first week of December 2019 about the continued growth and increased engagement by Asian member companies with IPC, with over 320 members in standards committees now working on the development of the next-generation standards.
True or False: CFX Edition
Since the release of IPC-2591—Connected Factory Exchange (CFX), Version 1.0—there has been a lot of buzz regarding CFX within the industry from all segments. Still, with all of the buzz, there are also some misconceptions floating around the industry regarding CFX. David Bergman takes some of those statements, using feedback from Subcommittee members, and plays a little game of “True or False: CFX Edition.”
IPC APEX EXPO 2020: Day 2 Review
Wednesday at IPC APEX EXPO drew a fairly steady stream of attendees to the show floor. Exhibitors we spoke with said the visitors were ready to spend some money. Almost everyone said their company was having a good quarter and experiencing slow but consistent growth year over year.
AT&S: Working With Designers on a Global Level
Barry Matties recently took a tour of AT&S’s Austrian factory, which is developing new circuit design strategies surrounding embedded and active components. Gerald Weis discusses the company’s focus on serving and educating PCB designers around the world, as well as their plans to embrace the latest technology and Industry 4.0 processes going forward.
IPC APEX EXPO 2020: Day 1 Review
2020 was a special anniversary year for IPC APEX EXPO: “Celebrating 20 years of excellence in electronics” was the tagline. Pete Starkey provides a review of the Day 1 activities on the show floor and beyond.
IPC APEX EXPO 2020 Dawns on San Diego
IPC APEX EXPO 2020 launched on Tuesday, February 4, and I-Connect007 started its exclusive coverage.
Upcoming IPC APEX EXPO Offers Sessions on 5G
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.
IPC Solder Stencil Task Group—Inviting OEM Input to IPC APEX EXPO Meeting
Jeff Schake of ASM Assembly Systems is chairman of IPC’s Solder Stencil Task Group. In this conversation with Nolan Johnson and Barry Matties, Jeff discusses what they will be meeting about at the upcoming IPC APEX EXPO.
Residual/Free TBBPA in FR-4
Sergei Levchik describes how testing has shown that FR-4 printed circuit boards do not contain free or residual tetrabromobisohenol-A (TBBPA).
Nolan’s Notes: IPC APEX EXPO 2020 Preview
IPC APEX EXPO is here again. If you have followed our coverage in SMT007 and Design007, then you’re probably laser-focused on the upcoming show. We have been previewing IPC APEX EXPO all month, and we’re excited to pass that information along to you within these pages. Here’s what we learned.
EIPC Winter Conference: Business, Technology, and Community
Managing Editor Nolan Johnson recently spoke with Kristen Smit-Westerberg about the upcoming EIPC Winter Conference, February 13−14, 2020, in Rotterdam.
Four Reasons to Choose Polycapillary Optics for XRF Coatings Analysis
As electronic components continue to shrink and increase in complexity, metal finishes on these components need to be plated onto smaller features. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition. X-ray fluorescence (XRF) is a widely used technique for measuring coating thickness and material composition because it’s non-destructive, fast and straightforward to use.
CES: The Main Halls
CES 2020 is now over, and the next round of shows is underway (NAMM is also over now, IPC APEX EXPO is next week, followed by AWE and others). CES displayed electronics related to gaming, monitors, computers, smartwatches, TVs, vehicles, cellphones, etc. However, the effect on the industry and the way we live will be felt until the next CES. The largest and most influential participants are usually found at the Las Vegas Convention Center.
Fresh Thinking on the Logistics of Laminate Distribution
Mark Goodwin, COO of Europe and the Americas for Ventec International Group, sits down with Barry Matties to explain his approach to supply chain management, efficient distribution, and maintaining definitive product identity at every stage.
IPC APEX EXPO Technical Session Preview
Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.
The IPC Education Foundation’s New Column
The IPC Education Foundation’s new column with I-Connect007 will feature Charlene Gunter du Plessis, Aaron Birney, and Corey Lynn. These IPC Education Foundation members will share updates on programs and activities here. Find out more about the authors below and read "Foundations of the Future" in the SMT007 Week Newsletter.
IPC Validation Services: What to Expect at IPC APEX EXPO 2020
IPC’s Randy Cherry previews what to expect from IPC APEX EXPO 2020, including a full line on display demonstrating CFX/Hermes, further development of the Validation Services program, as well as testimonials from member companies that have been participating in IPC’s new trusted supplier program to the Department of Defense (DoD).
IPC APEX EXPO Technical Conference, Featuring Fundamentals and the Intersection
IPC's Brook Sandy-Smith brings us a preview of the Technical Conference at IPC APEX EXPO 2020. In addition to the Sessions @ the Intersection and the Technical Conference, the Fundamentals Program is new at IPC APEX EXPO 2020. The program provides curated content for industry newcomers and anyone interested in a broader view through the many facets of electronics manufacturing. Attendees will learn important concepts, terminology, and background as preparation for the detailed content on new studies and technologies presented at the technical conference.
Foundations of the Future: Get More Engaged in 2020
Since the inception of the IPC Education Foundation in January 2019, the mission remains to create connections between electronics manufacturers and supply chain companies, academia and the emerging workforce. In this debut column, Charlene Gunter du Plessis describes plans for engaging in 2020, including scholarships and more, and the IPC APEX EXPO 2020 STEM Student Outreach event.
IPC APEX EXPO: Sessions @ the Intersection
In this short video, Brook Sandy-Smith, IPC’s technical conference program manager, explains how “the lntersection” will be a new meeting place In between this year's IPC APEX EXPO show floor and the technical conference available to attendees and the free sessions that are open to any registration type.
Visit the Newcomers’ Lounge at IPC APEX EXPO
The Newcomers’ Lounge will open on February 2, will remain open through February 6, and is conveniently located near the technical conference and meetings area, where it will serve as a dedicated resource center for newcomers to get their questions answered and meet other newcomers. Use the lounge to take a break from the hustle and bustle of a busy day, catch up on emails, or grab a quick snack or refreshment.
Meet Two New CID Grads: Kalen Brown and Michael Steffen
At PCB West, I spoke with two newly minted Certified Interconnect Designers: Kalen Brown of EaglePicher and Michael Steffen of Crystal Group. After passing the CID exam, they attended the IPC Designers Council Executive Board Meeting, where the more “seasoned” veterans were very happy to meet them.
CFX Preview at IPC APEX EXPO 2020
The I-Connect007 Editorial Team chats with IPC’s Chris Jorgensen about the advances CFX has made in the past year and where the standard is in the standardization process. Chris also previews the CFX line that will be on display at the upcoming IPC APEX EXPO and shares IPC’s plans on educating and providing support solutions to potential users of CFX to implement it more easily.
Updates on Cleaning Standards and Committees
Graham Naisbitt of Gen3 discusses the changes he's seeing in cleaning, including how the WP-019 white paper has caused a closer look at electrochemical reliability. As a long-time head of committees, Graham also breaks down many of the topics he hopes are addressed at this year’s IPC APEX EXPO.
Ivanka Trump CES Keynote: The Path to the Future of Work
The Palazzo Ballroom at the Venetian Hotel and Casino was the site for one of the most anticipated keynotes at CES on Tuesday afternoon. CTA CEO Gary Shapiro moderated a conversation with Ivanka Trump, advisor to the President of the United States. The two discussed the current state of the workforce, higher education, skills retraining, alternatives to university education, and immigration. These are all topics that have been under discussion within the electronics manufacturing industry for some time now.
Engaging STEM Students at IPC APEX EXPO 2020
At this year’s IPC APEX EXPO, you’re likely to see quite a few high school students moving amongst all the normal show activities thanks to the IPC APEX EXPO STEM Outreach Program. Launched two years ago at IPC APEX EXPO 2018, the 2020 version of the STEM Outreach Program will be larger and more immersive than ever before.
How to Become a Certified IPC Trainer
The Blackfox Certified IPC Trainer (CIT) programs are best suited for experienced and skilled electronics technicians, engineers, and supervisors who have the will and passion to teach and train colleagues about the quality standards of IPC. They also provide successful candidates with a credential that confirms their knowledge and understanding of IPC quality systems.
Book Summary: The Printed Circuit Assembler’s Guide to…Process Validation
The latest book in I-Connect007’s "The Printed Circuit Assembler’s Guide to…" series is authored by Gen3’s Graham Naisbitt. With his deep background in process validation and standards work, Naisbitt is uniquely qualified to explore achieving acceptable electrochemical reliability using both CAF and SIR testing. This eBook is a perfect present for the holidays.
Utilizing AI in CAD Library Development
Nolan Johnson speaks with Chico Wu of Footprintku, a company using artificial intelligence (AI) to help fill gaps in CAD library development by partnering with design teams on things like addressing resource shortages and automating custom design rulesets while also eliminating other manual steps in the process.
The Future of the World Is Truly in the Hands of Our Youth
At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.
AltiumLive Frankfurt 2019: Happy Holden Keynote
Nobody left early! Altium had wisely kept Happy Holden’s keynote presentation on “PCB Trends that Will Impact Your Future” until the end of the final day of the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany. Pete Starkey presents the highlights of Happy's presentation.
LA/Orange County SMTA Expo and Tech Forum Review
Dan Feinberg recently attended the LA/Orange County SMTA Expo and Tech Forum, which was held in Long Beach, California. He provides an overview of the activities, from the show floor to the presentations.
AltiumLive Frankfurt 2019: Carl Schattke Keynote
“How many here can remember manually taped artworks?” No more than three hands were raised in an audience of over 230 at the AltiumLive 2019 European PCB Design Summit in Frankfurt, Germany, as IPC Advanced Certified Interconnect Designer Carl Schattke introduced his keynote, entitled “Making and Breaking the Rules.” Schattke had learned PCB layout as his father’s apprentice, hand-taping several hundred PCB designs in the 1970s.
Future Trends in Flying Probe Testing
Peter Brandt, director of sales for Europe and Japan at atg, sits down with Pete Starkey and Barry Matties, gives his views on market requirements and testing technologies, and explains how flying probe testing is becoming the industry standard at all levels of production—and in many cases, the only practicable solution.
EIPC Winter Conference—Speakers and Papers
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.
Flex Standards Update With Nick Koop
This month, I interviewed Nick Koop—director of flex technology at TTM Technologies, a veteran “flex guy” and instructor, and a leader of several IPC flex standards committees. Nick provides an update for the committees he’s involved with and discusses some of the challenges that he sees as more designers enter the world of flex.
Vertical Conductive Structures, Part 4: Tuning Your Signal Performance
The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.
Words of Advice: The OEM Systems Designer
In a recent survey, we asked the following question: What advice would you give an OEM systems designer? Here are a few of the answers, edited slightly for clarity.
Why Does the PCB Industry Still Use Gerber?
Every so often, I hear technologists ask why so many PCB designers still use Gerber. That is a fair question. Ucamco has over 35 years of experience in developing and supporting cutting-edge software and hardware solutions for the global PCB industry. Our customers—small, medium, and large PCB fabricators—include the electronics industry’s leading companies, and many of them have been with us for over 30 years. We are dedicated to our industry and excellence in everything we do, which includes our custodianship of the Gerber format.
Meet Ray Prasad, SMT007 Columnist
Meet Ray Prasad, one of our SMT007 columnists! Prasad’s columns explore DFM, manufacturing processes, yield improvement, quality control, IPC standards, and much more.
Design For Excellence: Karen McConnell on Standards
During the IPC Summer Meetings, I spoke with Karen McConnell, senior staff CAD CAM engineer with Northrop Grumman Mission Systems. Karen is a veteran PCB designer as well as an IPC committee chair and mentor. She offered an update on some of the IPC committees she chairs, the need for more mentor programs in this industry, and why you can call something a ham sandwich if you define it correctly in the standard.
Meet George Milad, I-Connect007 Columnist
Meet George Milad, one of our newest I-Connect007 columnists! George’s columns will cover PCB plating, IPC specifications, and more. George is the recipient of the 2009 IPC President’s Award, chairs the IPC Plating Committee, and is a permanent member of the IPC Technical Activities Executive Committee.
So Many Standards Committees, So Little Time
During the IPC Summer Meetings and Panelpalooza in Raleigh, North Carolina, I met with Leo Lambert, vice president and director of technology at EPTAC. We discussed IPC’s recent efforts to revamp the way standards are developed and interpreted as well as changes to training and education committees and a variety of methods for eliminating errors and duplicated comments when revising standards.
Communication, Part 4: The Top 5 Causes of Engineering Delays
In Part 4 of this series on how PCB fabricators and designers can better communicate, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits address the top five causes of engineer delays.
Why Designers Need to Be at the SMTA Additive Electronics Conference
In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.
Happy Holden Previews His AltiumLive Frankfurt Keynote
I recently sat down for an interview with Happy Holden, who is slated to give a keynote speech at this year’s AltiumLive event in Frankfurt, Germany. Happy gives a preview of his presentation, which is focused on smart factories and automation, and why artificial intelligence might improve PCB design and fabrication in the future.
Chuck Bauer: SMTAI 2019 Founder's Award Recipient
At the recent SMTAI conference and exhibition, Chuck Bauer, Ph.D., senior managing director at TechLead Corporation, received the Founder's Award, a prestigious award given to a member who has made exceptional contributions to the industry and provided ongoing support and service to the SMTA.
Decreasing Bend Radius and Improving Reliability—Part I
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.
ODB++: Transforming Ideas Into Products
The ODB format originated with the objective of delivering on this need. The format was originally introduced for use by PCB fabricators, eliminating the need for a collection of CAM files in multiple formats—such as Gerber, Excellon, IPC-356, or even IPC-350, which was an early attempt to simplify this process. The key to the success of ODB was that it obtained industry acceptance.
Standards: Why We Have Them and Live by Them
Have you ever designed a board but received feedback that it couldn’t be manufactured unless changes were made? Or maybe you’ve designed a complex board and sent it to the factory only to find out that the manufacturer didn’t build the board to your expectations? PCBs are becoming more complex, factory options are growing, and expectations for product life cycles are becoming longer.
SMTAI 2019: Happy Holden’s On-the-Scene Report
Last week concluded the 2019 SMTAI conference in Rosemont, Illinois. Overall, I think the show was successful and covered all aspects of SMT processes.
The Institute of Circuit Technology Autumn Seminar
Meriden has been established as a popular Midlands venue for Institute of Circuit Technology (ICT) meetings. On September 19, a multitude of Fellows, Members, and Associates gathered for the Institute’s autumn seminar, which was organised and hosted by ICT Technical Director Bill Wilkie. The agenda included five informative technical presentations, describing current research and development on significant topics relevant to the industry.
Insertion Loss Performance Differences Due to Plated Finish and Circuit Structure
Data will be presented for loss versus frequency for six different plated finishes commonly used in the PCB industry, and opinions will be offered as to why the loss behavior differs for the different plated finishes and for the different circuit configurations. Because the insertion loss of high-frequency circuits also depends on substrate thickness, circuits fabricated on substrates with different thicknesses will be evaluated to analyze the effects of substrate thickness on insertion loss.
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