RTW IPC APEX EXPO 2019: LPKF Highlights Laser Processing Tech, Glass Drilling Capabilities
Guest Editor Joe Fjelstad sits down with Stephan H. Schmidt, LPKF president, who provides an overview of the company's laser processing machine and their capabilities, and highlights the new glass drilling capabilities.
RTW IPC APEX EXPO 2019: New IPC Technical Education Program Manager
Brook Sandy-Smith discusses her new role as IPC technical education program manager, which is also a brand-new IPC position. She further explains the benefits of membership, when a member should contact her, the IPC STEM Outreach Program, and upcoming events.
AltiumLive Munich: Day 2 Keynotes
Having enjoyed the conference dinner and robot battles of the previous evening, a good night’s sleep, and a hearty breakfast, Altium’s family of over 220 electronics engineers and designers eagerly returned to the conference room. Many jostled to secure the best seats for the second day of the European AltiumLive design summit in Munich, keen to make the most of the “learn, connect, and get inspired” opportunity it offered.
CES 2019 Showstoppers, the Show Floor, and Some Neat Stuff
CES 2019 is over, and those of us who spent four to five days trying to see and hear as much as possible are in recovery mode. There were over 182,000 attendees, and 6,600 of us were media all trying to get to as much of the 2.9-million-square-feet exhibit space as possible.
Atotech at HKPCA on Announcements and Advancements
Edy Yu, managing editor for PCB007 China, caught up with Daniel Schmidt, Atotech’s director of global marketing, during the 2018 HKPCA and IPC Show in December. Edy and Daniel discussed Atotech’s new announcements at the show including their new solutions for 5G, high-speed, and high-frequency applications, and more.
Dispatches from CES 2019: The Future in the Kickoff
Press kickoff briefings at the Consumer Electronics Show (CES) are no stranger to big claims and hyperboles. At the “CES 2019 Trends to Watch” presentation on Monday morning, Steve Koenig, Consumer Technology Association’s (CTA’s) VP of market research, made some pretty big claims about what we should expect to see at the show, but those claims don't seem at all to be hyperbolized.
CES Press Day: NVIDIA, Samsung, and Intel
Three major companies—NVIDIA, Samsung, and Intel—had lengthy, interesting presentations on CES press day, and each had with their own agenda.
Rainer Beerhalter Discusses His AltiumLive Munich Presentation
Rainer Beerhalter is a physicist, and according to his design bureau’s website, “founder, owner, and mastermind” of B GMBH. Rainer attended the first AltiumLive in Munich in 2017, and he’s returning to this year’s event in Munich January 15–17. I asked him to tell us about the class he’ll be teaching in Munich, and why he decided to come back for the sophomore AltiumLive show.
Chris Nuttall Discusses NCAB Group's IPO and Future Plans
Editor Nolan Johnson sat down with Chris Nuttall, COO and VP of technology at NCAB Group, to discuss software tools, predictive reports, and the company's recent IPO.
The Shape of Things to Come: Curved, Flexible, Stretchable, and Three-Dimensional Electronics
The seamless integration of electronics into flexible, curved, and even stretchable surfaces is being requested for several markets, such as automotive (dashboards, lighting, sensors), smart buildings (lighting facades, air quality, solar panels), medical (health patches, X-ray, analysis), and smart clothing (position tracking, sports).
Successful Flex Circuit Design and Processing Guidelines
With the use of sensors and technology in everything from mobile phones to refrigerators, automobiles, and wearable medical devices, circuit boards are a component in many different types of products. In today’s world of electronics, any product with an on-off switch contains a circuit board.
Meet All Flex’s New President and CEO Matt Keithly
All Flex Flexible Circuits and Heaters recently appointed Matt Keithly as their new president and CEO. In this exclusive interview, Keithly discusses his background, the direction of the company, and topics related to flexible circuits and other areas of All Flex’s business.
Strategies to Manage Your China Business Through Turbulence
While the United States may be the world’s most open market, China remains the most competitive, and is still viewed by most U.S. and EU companies as the "last great opportunity for growth.” Many companies want to gain entry to the Chinese market share for their products or services. Thus, the competition for sales of products or services is correspondingly intense. Here's how to succeed in the world's second largest economy.
Copper Pillar Plating Systems: High Speed, Low Heat
The industry is seeing ever-more stringent requirements of interconnect technologies (ICT) from die through final assembly, in particular digital and analog high frequencies, undistorted signal propagation and efficient heat propagation are concerned.
Flex Talk: Additive Electronics—PCB Scale to IC Scale
SAP, mSAP, SLP—what kind of crazy acronyms have we adopted now, and how much do you really need to know? In terms of consumer electronics, there is a good chance that the smartphone attached to your hand at all times contains a PCB fabricated with this technology—or at the very least, the next-generation smartphone that you purchase will utilize mSAP technology.
RTW SMTAI: NCAB Discusses Its Sustainability Programs
Doug Drayer, General Manager, Central Region, at NCAB Group, details the company's three-pronged sustainability programs and ISO 26000. He also talks about the company’s recent successful listing in the Stockholm Stock Exchange, and the importance of working with the customers especially during the design process.
Smartphone Substrate-Like PCBs Will Revolutionize the IC Substrate and PCB Markets
The smartphone is one of the high value-add products that carries a very high demand for miniaturization. Customers expect larger screens, cameras with high resolution, and various other functions, in lighter and thinner phones.
The Changing Shape of the HDI Market
With more mobile device designers looking to utilize the benefits of FOWLP and other direct attach package types, a new generation of HDI PCBs is already in the market. Targeting less than 30 mm features and based on mSAP techniques, these substrate-like PCBs make use of the latest high-end manufacturing processes and materials, to enable the next evolution in advanced HDI boards.
GP Ventures’ Tom Kastner on PCB Mergers and Acquisitions
Tom Kastner, president of GP Ventures, he has his finger on the pulse of the industry's mergers and acquisitions (M&A) more than anyone. In this interview, Kastner provides insights on the right time to buy, how to evaluate your company's worth, and when it is too late.
What's FLITE About? An Old Man's Observations
FLITE—Female Leaders in Tech, Everywhere—aims to raise the visibility of females in technology, manufacturing, and engineering by celebrating their achievements and learning from their experiences. I-Connect007 Technical Editor Pete Starkey sit in on FLITE's networking event at the recent What's New in Electronics (WNIE) Live show to find out more about this enterprise, which turned out to be an inspirational eye-opener.
Building a Better Board: It Always Comes Back to Communication
For our experts meeting on the August’s theme of reliability, we reached out to Colonial Circuits and asked them to participate in a conference call with our I-Connect007 editorial team consisting of Dan Feinberg, Andy Shaughnessy, Patty Goldman, and Happy Holden. Joining the call from Colonial Circuits was Mark Osborn, president and CEO, Kevin Knapp, quality manager, and Rodney Krick, manufacturing manager.
From Trend to Game Changer: Which Technology Will Make the Cut?
At the recent EIPC Summer Conference, Hans Friedrichkeit of the PCB Network gave an engaging presentation on artificial intelligence and future technologies, which was well received by attendees. Who better than Hans to offer insight on which future megatrends might truly become game changers? Publisher Barry Matties sat down with Hans to get his take on trends such as 5G, autonomous cars and 3D printing.
Reliability Takes on a New Urgency
Consumers wanted a reliable car that wouldn’t break down on the road; a computer that wouldn’t crash; a phone network that wouldn’t drop our calls; the plane we were hurtling across the sky in to stay in the air and land safely, with the wheels down. In retrospect, those seem rather simple wants, and the industry certainly wants to deliver.
Atotech on Challenges and Opportunities in PCB Manufacturing
Abel Ruivo, Atotech Deputy Business Director of Electronics for Greater China, and Daniel Schmidt, head of Global Marketing for Electronics at Atotech Group, spoke with I-Connect007 about the various challenges of PCB manufacturing in China, as well as about the opportunities in the sector.
Solder Mask: You’ve Come a Long Way, Baby!
For the July 2018 issue of PCB007 magazine, I-Connect007's editing team met with Electra Polymers’ Shaun Tibbals and Antony Earl to discuss what’s new with solder mask, including direct imaging and inkjet printing of solder mask, and what PCB manufacturers and OEMs need to know.
Advanced Copper Plating Process for Any Layer Via Fill Applications with Thin Surface Copper
Copper-filled microvias are a key technology in HDI designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard PTHs, copper-filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost.
MacDermid Enthone Talks Wet Processing Trends in 2018
I-Connect007’s Patty Goldman, Barry Matties, Andy Shaughnessy, and Happy Holden were recently joined by MacDermid Enthone team members Jordan Kologe, technical marketing specialist; Ted Antonellis, applications manager for electronics specialties; and Don Cullen, marketing director for electronics solutions and MacDermid performance solutions. The discussion topic was the wet processing end of PCB manufacturing.
EIPC 50th Anniversary Conference: Alun Morgan Announcement
As the 2018 EIPC 50th Anniversary Conference came to a close in Dusseldorf, Germany, Barry Matties met with Chairman Alun Morgan to look back at how far the EIPC has come in the past 50 years and say goodbye to Michael Weinhold, longtime director and industry veteran, who announced his retirement at this year’s event.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 1
Just like old times—meeting with John Ling, with whom I had previously travelled to industry events for over two decades, and who still carries the role of EIPC marketing manager, to fly together from Birmingham UK to Dusseldorf in Germany for the EIPC 50th Anniversary Summer Conference.
Michael Weinhold: Time to Say Goodbye
This year’s EIPC summer conference marked the 50th anniversary for the organization, and with it, the retirement of longtime EIPC member and industry leader Michael Weinhold. I spoke with Michael on his 50+ years in the industry, and on behalf of everyone at I-Connect007, we wish Michael a pleasant retirement and the best going forward.
Flex Time: Why is Rigid-Flex So Expensive?
One question that I hear fairly often, particularly after an initial quotation, is “Why is rigid-flex so expensive?” In this article, I’ll share with designers the cost drivers in rigid-flex relative to standard rigid boards and flex circuits with stiffeners. A typical rigid-flex PWB will cost about seven times the cost of the same design on a hard board, and two to three times an equivalent flex circuit with stiffeners.
Book Review: Listen Up or Lose Out
There can never be enough books about the art and virtue of listening. As a sales trainer, I've learned that there is nothing more challenging than teaching people how to be quiet and listen. So, it was with great anticipation that I read this new book by the Boltons. Never has there been a better time to try to teach people, not just salespeople to turn down the devices, focus, and start intentionally listening to one another.
EIPC 50th Anniversary Conference Day 2: The Past, the Present and the Future, Pt. 2
Alun Morgan wrapped-up the proceedings, thanking delegates for their attention, speakers for sharing their knowledge and sponsors for their generous support. Special thanks and good wishes to Michael Weinhold for his enormous contribution over the years, and to Kirsten Smit-Westenberg and Carol Pelzers for their calm and professional organisation and management of another superb event.
Catching up with… Artnet Pro
I recently sat down with Artnet Pro Co-owner Meir Polack to discuss his company's move to represent Altix in North American, South America and parts of Asia. Artnet has traditionally sold pre-owned Orbotech and Camtek equipment, especially LDIs, but due to the increasing competitiveness of this high-end market they decided to seek out the best alternative in new DI equipment.
EIPC 50th Anniversary Conference Day 1: The Past, the Present and the Future, Pt. 2
Part 2 of I-Connect007 Technical Editor Pete Starkey's article on the recent EIPC 50th Anniversary Conference in Dusseldorf, Germany, continues with recap of technical presentations by Emma Hudson, Shannon Juan, Alex Ippich, and Russell Morgan. Read on.
Catching up with Fineline-Global N. American CEO Eran Navick
After entering the North American marketplace just six months ago, printed circuit board provider Fineline-Global is making its mark. As the largest value-added PCB supplier in the world, Fineline prides itself on being any able to meet any challenge for any company in any part of the world. I recently had the chance to sit down with Eran Navick, the company’s North American CEO to catch up on how things are going.
May the G Force Be With You
We are about to begin the transition from the present cellular standard 4G LTE to the next generation, 5G. As in the past, most people will wonder, “What does 5G mean to me, and what is LTE anyway?” After all, if you can make your connection reliably and you can send and receive data at reasonable speeds, why should you really care?
Book Review: Becoming Facebook—The 10 Challenges that Defined the Company That’s Disrupting the World
Besides being an excellent history book into one of the most fascinating companies in the world, it is also a great business book. Full disclosure, I wanted to read this book because I wanted to know the Facebook story. I did not expect any of the lessons in this book to apply to me and my own small business or the small businesses that I work with, but I was wrong. The book is filled with valuable lessons that can be applied to any company, no matter the size.
APCT Moves into Rigid-Flex with Cartel, Cirtech Acquisition
When I spoke with APCT President Steve Robinson a year ago, he said he was interested in adding flex and rigid-flex capabilities, and working closely with designers and engineers. With the recent acquisition of Cartel and their subsidiary Cirtech, APCT now has a flex and rigidflex facility, along with military and aerospace certifications. At DesignCon 2018, I asked Steve to discuss these acquisitions and what they mean for APCT and their customers.
Day-to-Day: ZTE and the Potential Impending Trade War Saga
Nanya Technology, Taiwan's biggest DRAM chipmaker, will apply for a permit to provide chips to ZTE. The company said it has been notified about restrictions on shipments to ZTE, and that the ban would have limited effect on its operation. The company said on May 9 that it is preparing to apply for a permit to continue shipping chips to ZTE Corp. as export restrictions took a new turn due to a US-China trade spat.
‘Can Do’ in CAM Outsourcing: CAM Engineering—Reducing Costs
While having on-demand capacity, improved automation, and fast turn-around are critical to any front-end engineering operation, achieving those goals with a cost-effective solution is imperative. Electronics are constantly under cost-reduction pressures. Functionality, capability, and complexity increase while costs decrease.