Article Highlights
EIPC Technical Snapshot Review: Packaging Trends and a PTFE Masterclass
10/27/2021 | Pete Starkey, I-Connect007
Soldering to Aluminum With Mina
10/21/2021 | Nolan Johnson, I-Connect007
Made in the USA
10/19/2021 | Barry Matties, I-Connect007
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/15/2021 | Nolan Johnson, I-Connect007
Making Process Decisions in a Greenfield
10/14/2021 | Jessi Hall, Schweitzer Engineering Laboratories
PCB :: Fabrication Process

Latest Articles

Inside Spirit Circuits

I was recently treated to a factory tour with Spirit Circuits’ Managing Director Martin Randall, to learn more about their process line and how it has evolved over time. In the discussion following, I learned about Spirit’s involvement in the China market and how they’ve structured their business to handle quick turn prototypes locally and high volume abroad.

High-Throw Electroless Copper– New Opportunities for IC Substrates and HDI Manufacturing

The one constant in electronics manufacturing is change. Moore’s Law, which successfully predicted a rate of change at which transistor counts doubled on integrated circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool.

Using the Type 1 Gauge Study to Assess Measurement Capability

Measurement capability is a critical aspect of ensuring product quality, therefore a measurement system must be assessed before being used on products. Understanding how to assess measurement capability becomes critical. The Type 1 Gauge study is typically the first step in a measurement system analysis program. Type 1 Gauge parameters are explained, and a worked example using electroless nickel immersion gold (ENIG) is provided.

A Thermal Conductivity Measurement Method, Adapted to Composite Materials Used in the PCB Industry

Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axes, especially when a good accuracy is expected. Few base material suppliers’ datasheets show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.

Round Robin of High-Frequency Test Methods by IPC-D24C Task Group (Part 1)

Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. It is common for these different approaches to yield varying values of key properties like permittivity and loss tangent.

Made in Brazil: The Evolution and Revolution of Impedance Control in PCB Production

The PCB industry in Brazil has gone through several changes over the last decade. Our customers have been demanding better quality and higher-reliability products more than ever before, but few things have changed as much as impedance control. PCBs with impedance control requirements have become the engine of the market, and finding solutions to fit the customer’s needs is extremely challenging.

Viking Test Services: Much More than Test

Recently, 007 Technical Editor Pete Starkey and I toured Viking Test’s facility in Hants, UK where we met Managing Director Jake Kelly to learn about the history of the company, their recent involvement in the Indian PCB market, and what he thought of the EIPC Summer Conference.

Testing Todd: Test & Measurement—The Case for Validation

Test and measurement (T&M) are terms that can strike fear into the most robust of minds. Many engineers create designs and products of the future with specific results predicted for performance.

Faster, More Accurate AOI is More Important than Ever

Among PCB manufacturers, there is a common perception that AOI has not changed much since it was introduced decades ago. Over the last few years, however, new advanced technologies have made AOI solutions smarter, faster and much more accurate. AOI system data have even been integrated with newly developed automatic 3D shaping tools.

Patty's Perspective: Delving into Test and Inspection

I’ve always been a wet processing person, if not always in a PCB shop, at least at heart. My undergraduate degree is in chemistry and I cut my teeth working on electroless copper processes (just a metaphor, mind you!). Testing, testing and more testing in R&D can be sooo boring and repetitive.


Catching up with Sunrise Electronics’ Ashok and Jigar Patel

I had been hearing about Sunrise Electronics for many years, so when Ashok asked me to come and see them for myself, I jumped at the chance. It was one of the most amazing plant tours that I’ve been on in a long time. I wanted to know more, so we sat down and had a chat.

Standard of Excellence: The Future is in Fine lines

The age of much finer lines and spaces is upon us. After years of slowly moving towards this technology our customers are now demanding that all of us provide them with fine lines and spaces. Our new trend in electronics is for denser and denser circuitry on smaller and smaller real estate.

The Newest Flex Shop in the U.S.

I-Connect007 sales team member Angela Alexander and I recently got a tour of Lenthor’s new Silicon Valley flex board shop and then sat down with President and CEO Mark Lencioni to discuss the new flex facility, the markets, management, and the future.

Weiner’s World

The way that I see the problem relates to overcapacity for fabricators in the consumer segment of devices with flat panel displays—mobile and otherwise—as well as a decline in notebook PCs, TVs and other household and portable electronic devices. Additional culprits include the improved packaging designs as well as more powerful chips replacing multiple ICs—both requiring less board real estate.

The 21st Century PCB Factory– Designed to Eliminate Offshore Cost Advantages

Over 15 years have passed since North America and Europe ceased being the center of worldwide PCB fabrication and were supplanted by a Chinese market with low-cost labor, lax environmental requirements, and strong government support. In just a few short years, the superior offshore cost advantages of this new dynamic put volume PCB production in the West out of business, aside from the military and specialty technology applications contained in the few shops that continue to exist today.

Happy’s Essential Skills: Design for Manufacturing and Assembly, Part 2

Advances in interconnection technologies have occurred in response to the evolution of component packages, electronic technology and increasing complex functions. Therefore, it comes as no surprise that various forms of printed wiring remains the most popular and cost effective method of interconnections.

Happy’s Essential Skills: Design for Manufacturing and Assembly, Part 1

Advances in interconnection technologies have occurred in response to the evolution of component packages, electronic technology and increasing complex functions. Therefore, it comes as no surprise that various forms of printed wiring remain the most popular and cost-effective method of interconnections.

Sensible Design: Coatings—Five Essentials for Designers

In an ideal world, PCB designs would not have an inherent weak point for corrosion; unfortunately, in the real world, they do. When a weak point is revealed, you are better equipped to deal with it. Often the spacing of components, board finish and distance to ground planes can be optimised for corrosion resistance.

All About Flex: Imaging Methods for Etch Resist, Part 3: LDI

When LDI technology was first introduced around 20 years ago, throughput was an issue. LDI was often restricted to low volume or prototype runs. Subsequent advances in equipment as well as faster acting photoresist have made it practical for high volume circuit fabrication.

All About Flex: Common Flex Circuit Surface Finish Requirements

Copper is a unique metal and has been proven with the test of time in an incredible array of printed circuit and electrical wiring applications. It is highly conductive, has good flexibility properties, can withstand high temperatures and has good chemical resistance. Copper is also is in abundant supply and is fairly inexpensive.


RTW IPC APEX EXPO: Taiyo America Talks Inkjet Solder Masks and 3D Printing

Josh Goldberg of Taiyo America speaks with I-Connect007 guest editor Steve Williams about some of the latest innovations happening in his company, including inkjet solder masks, and how they lend to small runs and rapid prototyping type of development work, especially with the idea of doing an additive manufacturing process.

EIPC Summer Conference 2016, Day 2: Strategies to Maintain Profitability in the European PCB Industry

Delegates awoke to a gloomy Scottish morning on the second day of the EIPC Summer Conference 2016. One or two who maybe overindulged in the whisky on the previous evening had some difficulty in finding time for breakfast before the conference proceedings, but the atmosphere in the meeting room was brighter than the weather outside, as Professor Martin Goosey introduced the day’s programme.

The Sum of All Parts: The Fabricator-Assembler Connection

After discussing the relationship between PCB fabricators and those who design the boards (see my previous column ), it is imperative to do the same for the relationship between assemblers and fabricators. This brings about a whole new set of potential complications.

Ken Moffat of American Standard Circuits Talks Aerospace Accreditation, DfM, and More

At the recent SMTA West Penn Expo & Tech Forum, I had the opportunity to speak with Ken Moffat, of American Standard Circuits, based in Chicago. Among the topics we discussed was the importance of attending local chapter shows like this one, and ASC’s value-added services such as DfM, especially in the metal-backed and RF arenas.

All About Flex: Plating Process Options for Flexible Circuits

Plating copper through-holes or vias is a requirement for double-sided and multilayer circuits. In a previous column we discussed the plating process; specifically copper seed coating using electroless copper and Shadow plating, which is then followed with an electroplating process.

EIPC Summer Conference 2016, Day 1: Strategies to Maintain Profitability in the European PCB Industry

Resplendent in the kilt, EIPC chairman Alun Morgan welcomed a large and enthusiastic gathering of printed circuit professionals from all over Europe and as far afield as the USA, Canada and Russia, to the EIPC Summer Conference 2016 in Edinburgh, Scotland's cosmopolitan capital city.

Happy’s Essential Skills: Producibility and Other Figures of Merit

Metrics are data and statistically backed measures. It is always expedient to base decisions on data and metrics, for example, in PCB design. These measures can be density, first-pass yield connectivity or in this context, producibility. These measures are the basis for predicting and planning a printed circuit design. But what if a metric doesn’t exist? Then you can create the next best measure, the Figure of Merit.

Book Review: Beating the Workplace Bully

There’s the woman who conned her co-worker into buying her coffee on the first day and then made it a daily event. Or the boss who was always threatening to fire his staff and telling them, “There’s blood in the water.” Or the supervisor who told her new employee on the first day that it was not her choice to hire her, because she had only worked in a small firm and “did not have the sophistication this corporate position needs. You don’t even dress properly.” This great book is full of such terrible people.

RTW IPC APEX EXPO: Matrix Highlights How Dry Film Laminator Addresses Fine Line Challenges

Fred Long, business development manager at Matrix USA, talks to I-Connect007 guest editor Dan Feinberg about how a new pressure system in the Hakuto Dry Film Laminator provides even heat and pressure along the entire length of the pressing cycle system to address the challenges of circuits with finer lines.

Institute of Circuit Technology Annual Symposium

On June 1, Technical Director Bill Wilkie introduced the 42nd Annual Symposium of the Institute of Circuit Technology, at the Motorcycle Museum in Birmingham, UK, commenting upon the success of the recent Foundation Course and acknowledging the sterling efforts of his course tutors, although recognising that some of his longest-standing experts were now retiring.


Trouble in Your Tank: Primary Imaging for Pattern Plating, Part 2—Development

The proper development of the primary photoresist is critical to the overall success of the imaging process and in turn the processes that follow—either etching to form innerlayers or the electroplating processes on outer layers. In this step, the unexposed photoresist (after resist lamination and exposure) is washed away via the developing process.

The Shaughnessy Report: The Designer Roundtable Roundup

Every year, I attend SMTA Atlanta, just across town. You have to love a local trade show. No airlines, no jet lag, and no hotels. It’s a small show; it would fit in a school gymnasium. But for me, the highpoint of SMTA Atlanta is the Designers Roundtable. This year the roundtable had 15 attendees, up from 12 last year. Two of the new attendees were under 35, which surprised all of us "graybeards."

Multilayer's Viny Mulani on what it Takes to Survive Offshoring

As the leader of one of the surviving PCB shops in the United States, Multilayer Technology's President Viny Mulani has a unique perspective. He sat down with I-Connect007's Barry Matties recently at IPC APEX EXPO 2016 to discuss what kind of machinery he’s looking to invest in to keep more business from moving offshore.

New Management and Strategies at eSurface

At the recent Geek-A-Palooza, I spoke with Alex Richardson and Rick McCann of eSurface Technologies, to learn about the condition of the company, their new semi-additive approach, and a couple of big announcements.

Global Technology Development: HDP User Group European Meeting 2016

Delighted and honoured to be invited again to attend the open session of the High Density Packaging User Group (HDPUG) European Meeting, I made my way to the picturesque Grand Duchy of Luxembourg, a tiny principality bordered by Belgium, France and Germany, and ranked among the world's top-three nations in both wealth and wine consumption, to learn about the latest in collaborative research and development by member companies engaged in the manufacture of products utilising high-density electronic packages.

Happy’s Essential Skills: Learning Theory/Learning Curves

Learning is not instantaneous! Nor is progress made in a steady manner, but at a rate that is typified by one of two basic patterns. In some cases, plateaus will be seen in learning curves. These are caused by factors such as fatigue, poor motivation, loss of interest, or needing time to absorb all the material before progressing to new. This column will not go into details of how learning is achieved, but will summarize some of these theories.

Weiner’s World

Gen Consulting Company (GCC) has issued the Radiant Insights report “Global HDI Printed Circuit Board Market Forecast and Analysis 2016-2021.” The report provides a detailed analysis of worldwide markets for HDI printed circuit boards from 2011–2016, and provides market forecasts for 2016–2021 by region/country and subsectors.

All About Flex: Flexible Circuit Fabrication and Cleanroom Manufacturing

Facility cleanliness is a vital part of process control for flexible circuit fabricators. As higher density requirements continue a relentless drive toward finer traces and spaces, particles and foreign material can cause problems in a number of operations.

MACFEST—Manufacturing Advanced Coatings for Future Electronic Systems

Now in its second year, MACFEST is a collaborative research project involving partners A-Gas Electronic Materials, C-Tech Innovation, MTG Research, the Institute of Circuit Technology, the University of Leicester and Merlin Circuit Technology.

Case Study: Reducing Defects Caused by Excess Handling and Mishandling

Most folks associate quality improvement initiatives with upfront expenses and ongoing cost increases. Fortunately, when done efficiently and with enough forethought and planning, quality improvement programs can pay for themselves in the form of increased throughput, reduced labor steps, and reduction in materials consumption.


Standard of Excellence: LED and Metal-Backed Technology—Today and in the Future

Probably one of the hottest, or should I say coolest, technologies today is LED. I would also venture to say it is one of the fastest growing as well. All you have to do is look around you can see evidence of this everywhere from holiday lights in your home and Jumbotrons at sports arenas, to highway and business signage. The lighting industry is now dominated by LED technology.

BOOK REVIEW: Printed Circuits Handbook, Seventh Edition, 2016 (McGraw-Hill)

The Printed Circuits Handbook has been a classic reference to the industry for many years, and the new edition will assure its place for years to come. The 7th Edition features 71 chapters, four more than the last edition, structured in 12 parts, and authored by 38 contributors—a list of accomplished authors that could double as a who’s who in the world of circuit boards.

All About Flex: Imaging Methods for Etch Resist, Part 2: Photoimaging

This is the second of three columns describing typical methods for creating an etch resist for fabrication of printed circuits. Photoresist can come in the form of a liquid that gets coated on the substrate or as a dry film that is laminated. Liquid and dry film resist can be positive-acting or negative-acting.

PE on 3D objects

I recently sat down with Mike O’Reilly of Optomec to discuss 3D printing onto existing substrates and small polymer-based additive manufacturing pieces and how that impacts PCB manufacturing. Mike also discuss the benefits of printing with conductive epoxies versus the traditional solder process, and where Optomec fits in to the burgeoning 3D market, going forward.

Beyond FR-4: High Performance Materials for Advanced Designs, Part 2

In Part One we covered basic FR-4 and variants that have been used in the commercial and military market for the past few decades, but in this column we will delve into the newer materials that target a specific application and/or market segment.

Happy’s Essential Skills: Project/Product Life Cycle

The product, and or project (process) life cycle (PLC) is fundamental to a corporation intent on developing new products or processes. It sometimes is called the new product introduction (NPI) process but that is only half of the life cycle. There is product support, enhancement and eventually, obsolescence.

The Sum of All Parts: Planning for a First-Time-Right PCB Design

The development of highly integrated and high-speed, chip-based circuit boards brings several functional benefits. But at the same time, these can introduce additional challenges to the actual board itself. Therefore, developing an effective plan for designing, developing, testing and producing the final PCBs is a good business practice.

The Future of Computer-Integrated Manufacturing in the PCB Industry

Computer-integrated manufacturing is already a proven reality in the PCB industry for those prepared to make the investment, and results in improved quality and reduced costs. The biggest barrier to its general adoption is the reluctance of some equipment manufacturers to communicate in a uniform data format.

Stepping up to Laser Processing for Flex, Part 3: Readiness and Site Preparation

With so many processes to keep track of in a flex manufacturing line, it can be easy to get lost in the details and begin to rely on your suppliers to address any issues that might crop up. However, given that laser processing equipment and flex materials are both impacted by your facilities, your attention to and investment in clean, stable, and robust facilities and support equipment will quickly pay off in less downtime, higher yield, and—perhaps most importantly—fewer headaches!

Orbotech’s Latest Technology at IPC APEX EXPO

Orbotech presented their latest new technologies at IPC APEX EXPO 2016. The Nuvogo 1000 is a higher power version of their multi wavelength direct imaging machine, as well as their new automated optical shaping technology which can add copper deposition to an otherwise defective PCB. I met with Orbotech’s Micha Perlman in their booth on the show floor, to learn more.


All About Flex: Imaging Methods for Etch Resist, Part 1

Imaging is a major process step in creating a copper circuit or flexible PCB. In single-sided circuit fabrication, the imaging process creates the resist pattern that protects the copper from the etchant. It is critical that this pattern precisely define the circuit traces, as issues with imaging will transfer to the subsequent processes.

Koen Hollevoet Explains Rogers' New PEEK-based Material for Extreme Temps

Rogers has been developing a new material called XT/duroid laminate, which is based on polyether ether ketone (PEEK) material and can withstand some of the harshest temperatures and environments. I met with Koen Hollevoet, Business Development Manager at Rogers Corporation, at IPC APEX EXPO 2016 to further discuss this material and learn how it might benefit the PCB market.

IEC: Celebrating 50 Years in Business

I caught up with Shawn Stone of IEC recently, to discuss plating, laminates, printed electronics and IEC’s many strategic alliances, including their most recent agreement with ITEQ to distribute their copper-clad laminate line throughout North America. This alliance will give IEC, a company his father started more than 50 years ago, its first North American footprint.

Ventec International Group Expands North American Focus

Ventec International Group is looking to expand their U.S. operations, and they’ve begun this process by bringing Chris Alessio on board as VP of sales and operations of Ventec USA. I met with Chris and Ventec USA President Jack Pattie at IPC APEX EXPO 2016 to discuss their approach and possible opportunities for the North American laminate market.

Nano System, Two Years On

Established in July 2014, Nano System Inc. focuses on the design and manufacture of laser drill systems for the PCB industry. I-Connect007's Stephen Las Marias caught up with Nano System President Sam Sekine last month at IPC APEX EXPO to discuss the latest product and business developments at his company.

Rogers: 'To PIM-test Our Material, You Have to Build a Circuit'

Passive intermodulation (PIM) is a circuit anomaly that has been occurring in cellular base station antennas, causing tremendous frustration and cost to antenna OEMs. As the supplier of the materials being used by these OEMs, Rogers Corp., and more specifically, Product Manager Tony Mattingly, must come up with a solution.

Happy’s Essential Skills: Using Web Resources

The World Wide Web is a real boon to information retrieval. The key is getting to relevant information and not being overwhelmed by the sheer number of references. When confronted with a process problem, the urgency of a solution requires that you know how to use Web resources expeditiously.

Flex Talk: PCB Sourcing? One Size Does Not Fit All

When analyzing a set of PCBs to improve yields and maximize profits, the first place to start is with a critical review of each PCB design. Are there any attributes that are pushing your manufacturer’s standard design rules? If so, is this necessary to the design or is there another approach that could improve the manufacturer’s yields, reduce cost, and ultimately increase profit?

Orbotech’s Gaby Waisman: 'The Future is Digital'

I sat down with Orbotech President Gaby Waisman at CPCA in Shanghai recently, and he offered a comprehensive explanation of why digitalization is truly the future, especially with regard to increasing throughputs. We also discussed Orbotech’s company vision and products, as well as its role in “helping to drive the industry into fully digitalized imaging technology.”

IPC’s Phil Carmichael on Asia, New Standards, and the Future

At the very busy IPC APEX EXPO in Las Vegas recently, IPC’s head of operations for Asia, Phil Carmichael, spent a few minutes in the I-Connect007 booth with me and Stephen Las Marias, managing editor of SMT Magazine, discussing all things Chinese. Among the topics we covered were the association’s current role in Asia, and the new corporate social responsibility standard currently being developed, something IPC is very excited about.


LPKF Launches New Laser Drilling System for Flex Printed Circuits

At Laser World of Photonics Exhibition in Shanghai recently, I had a chance to speak with Florian Roick, strategic product manager with LPKF. The company is celebrating a big anniversary this year with the launch of a laser drilling machine to support the specific requirements of the flexible circuit industry.

All About Flex: Why Copper is Ideal for Flexible Circuitry

Copper is the second-most conductive metal (in pure form). The copper used on flexible circuits can be formed by a number of methods such as electro-deposition (ED), rolling/annealing, or a combination of the two. The conductivity of copper by volume on a flexible circuit is not exactly the same as pure copper, but it is quite close.

The ESI Solution: High-Throughput Roll-to-Roll UV Laser Drilling of Thin, Flex Materials

ESI’s Flex Product Manager, Patrick Riechel, speaks with I-Connect007's Pete Starkey at the recent CPCA event last month in Shanghai. Among the topics covered: How ESI addresses issues associated with machining roll-to-roll flex circuits, laser technology, and more.

Morgan and Starkey on CPCA 2016, Automation, and the Upcoming ECWC14

On the last day of CPCA in Shanghai recently, I was delighted to catch up with my friend and industry colleague, EIPC Chairman Alun Morgan, for a discussion on the show we were both currently attending, as well as the upcoming 14th Electronics Circuits World Convention (ECWC14), to be held in April 2017, in Korea.

Martin Cotton Explains Ventec’s Plan for Growth

I always enjoy talking to Martin Cotton, global director of OEM technology and marketing for Ventec and a longtime PCB designer. I ran into Martin at DesignCon and asked him to discuss Ventec’s plans for the future and how he figured into the equation.

The Importance of Choosing Equipment Suppliers Carefully and Investing in the Future

Burkle Process Technologies, a long-time PCB equipment supplier to high-end manufacturers in the world, is seeing their business continuing to grow despite the perceived slowdown in the industry in China. They ensure this by working closely with customers, making premium products to understand future technology needs, and offering the highest quality in laminating machines and technical support.

PCB Shops in Brazil: Are you Kidding Me?

Let´s face facts: Who would ever think of listening to an opinion about the PCB industry coming from someone in Brazil?

ESI: Drawing on a Deep History to Create a Vision for the Future

I had an opportunity to sit down for a chat with ESI’s Vice President and General Manager Michael Darwin at the recent HKPCA show. Darwin shared some of the challenges that come with managing the culture of a 70-year-old company, and a little about where they plan to focus their efforts going forward.

Francis Tsoi on the Future: What's in Store for Technology, Automation in China's PCB Industry?

I caught up with Francis Tsoi, CEO of World Wide Group whilst at CPCA in Shanghai recently, where we enjoyed a lively discussion on a number of critical topics surrounding China’s PCB industry: namely, what is on the horizon with regard to technology and automation?

PhiChem Open House a Success!

Delighted to be invited to an exclusive preview of the new PhiChem global headquarters and R&D centre in Shanghai’s Baoshan suburb, I joined the VIP group assembled at the PhiChem booth at the CPCA show, made welcome by PhiChem President Dr. Jin Zhang.


Patricia (Patty) Goldman Inducted into IPC Hall of Fame

We at I-Connect007 are thrilled that our own Patty Goldman has been awarded the highest level of volunteer recognition that IPC can give to an individual, the Raymond E. Pritchard Hall of Fame Award. The award is given in recognition of superior achievement, extraordinary contributions and distinguished service to IPC and the advancement of the electronics industry.

Happy’s Essential Skills: Design of Experiments

Design of experiments (DOE) is one of the most powerful and influential engineering tools for product yield improvements, new products or processes development, or for problem solving. As mentioned in my last column, process problems led me to a career in printed circuits, and quickly solving those problems led me to a bonus stock award and a great life. Even though I knew nothing about printed circuit manufacturing processes, I was able to quickly find the root causes of all the problems and fix them. My secret? Total quality control (TQC), statistics, and DOE.

Rex Rozario, Part 4: A 10,000-ft. view of his Business Ventures, the Industry, and Life

In our final installment, Rex describes the common thread woven through all of his successful business ventures and varied interests: confidence and the fortitude to follow his dreams until they are realized. Rex also takes a look back at the evolution of the global PCB industry, and explains his approach to profitability, which includes building (and rewarding) a successful team.

Rex Rozario, Part 3: The Future Beckons

In Part 3 of our multi-part interview with industry veteran Rex Rozario, we begin with the future. Having achieved success in China, could Rex and the Graphic team have their sights trained on the U.S.? Also in this installment, Rex weighs in on China’s future, and we discuss the value of automation. Is it for everyone?

Rex Rozario, Part 2: The Beat Goes on: New Developments at Exeter, the Music Scene, and China

In Part 2 of I-Connect007’s multi-part interview with PCB industry icon Rex Rozario, we continue to discover more about what has made Graphic PLC the company it is today. Rex explains the work they’re doing with Exeter University, Graphic’s success in China, and his own personal experience in the UK music scene.
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