Article Highlights
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/01/2022 | Andy Shaughnessy, Design007 Magazine
EIPC Summer Conference 2022: Day 2 Review
06/29/2022 | Pete Starkey, I-Connect007
EIPC Summer Conference 2022: Day 1 Review
06/28/2022 | Pete Starkey, I-Connect007
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
06/24/2022 | I-Connect007
Catching up With Author Ed Chambliss: Fixing a ‘Broken’ Business Model
06/22/2022 | Dan Beaulieu, D.B. Management Group
PCB :: Materials

Latest Articles

Rex Rozario: The PCB Industry’s True Renaissance Man

In this exclusive multi-part interview that was conducted recently, I-Connect007's Barry Matties will introduce you to all of the people that Rex Rozario is, and where he, his team, and Graphic PLC are headed to next.

World Wide PCB on the “Purification” of the China Market, Industry Changes and More

Francis Tsoi of World Wide PCB Equipment tells Barry Matties that although growth in the China PCB market may be slowing, the government has used this time to transition the industry towards automation, better environmental regulations and the ability to make high-end PCBs in large volumes.

The Institute of Circuit Technology Tewkesbury Seminar, 1st March 2016

The Annual General Meeting of the Institute of Circuit Technology (ICT) was held at Puckrup Hall, near Tewkesbury in Gloucestershire, England, on 1st March 2016, and was followed by a well-attended evening seminar with presentations on a novel laser-induced deposition process, an analysis of the market for PCBs, and a review of three development projects in which the Institute had participated. The programme was introduced and moderated by ICT Technical Director Bill Wilkie.

Weiner’s World

Gene Weiner discusses PhiChem's upcoming open house event at its global HQ and R&D center in Shanghai during SEMICON China 2016, CPCA 2016 and productronica China 2016. He also focuses on the IPC Ambassador Council's plans to produce an executive forum in conjunction with IPC APEX EXPO 2017, IPC's association with NextFlex, SEMI's launch of the ESiPAT SIG, and much more.

DuPont, Taconic and PFC Team Up For High-Speed Flex

At DesignCon, I sat down with three flex circuit specialists: Glenn Oliver of DuPont, Tom McCarthy of Taconic, and Steve Kelly of PFC Flexible Circuits. Our discussion covered a lot of territory, most notably the findings they described in the paper they were about to present later that day at DesignCon, and the future of flex, as they see it.

Copper Via-Fill Technology in Development

The use of via-in-pad technology is increasing rapidly in today’s PCB designs. The need for miniaturization, combined with the rapidly decreasing pitch of component footprints, drives printed circuit board designers here. Via-in-pad requires the vias to be filled, planarized and then over-plated with copper.

The Quiet Mainstreaming of HDI Manufacturing

Advances in technology continue to push the envelope of what’s possible. And nowhere has the impact of those advances been felt more profoundly than in the evolution of the current class of mobile devices. Although design engineers have driven this evolution, primarily through addressing market demand for new form factor innovation, the push to meet the associated manufacturing challenges has been responsible for a revolution in PCB manufacturing.

High-Performance Laminates

High-performance laminates are characterized as base materials that in one or more aspects exceed the performance of FR-4, CEM, or paper/phenolic laminates. In this article, Karl Dietz talks about the different types of laminates, their dielectric requirements, and how they are being manufactured.

ECI on the Many Benefits of Automated Process Lines

In this recent interview, I spoke with Peter Bratin, PhD, of ECI Technology about how PCB shops can benefit from upgrading the control and analysis of plating line solutions to 4.0 and how the data collected by these systems can help prevent future issues from occurring.

Mr. Laminate Tells All: CEM-3 Reinvents Itself (Again)—or, Atari Game Boards on eBay?

CEM-3 was unusual as the reinforcement was a combination of woven fiber-glass fabric and fiber-glass paper. The resin system was a dicy-cured epoxy resin yielding a Tg the same as FR-4 at the time, of 110–120°C range. Because it was all epoxy and all fiberglass, the properties were electrically identical to those of FR-4.


What a Long, Strange Trip it’s Been—and It’s a Long Way from Being Over

Harvey Miller has been in the PCB industry for more than 40 years, and he’s probably seen it all. I recently sat down with Harvey at a wine bar in Palo Alto to learn more about his history in the industry and where he sees it going forward. Harvey arrived wearing jogging shorts and running shoes. No surprise after what his doctor recently shared with him.

New CEO Jeff Waters Outlines his Roadmap for Isola

Jeff Waters, Isola’s newly appointed CEO and president, comes to the laminate supplier after more than 25 years in the semiconductor industry, working for companies like Texas Instruments and National Semiconductor. Only a few days into his new job, I met with Jeff to discuss the transition and what we can expect from Isola under his leadership.

All About Flex: Flexible Circuit Antennas

In our world of fabricating custom electronics, a circuit can generally be defined as “a path between two or more points along which an electrical current is carried.” The printed circuit board industry designs and fabricates an incredibly diverse set of rigid and flexible circuits. But it is also true this industry produces many parts that do not carry current between discreet points.

How North American Fabricators Benefit from Attending HKPCA

Two New Englanders in Shenzhen. It sounds like the title of a play, doesn’t it? Headlining the bill is Peter Bigelow of IMI, who explains to me why even small American manufacturers benefit from attending large Chinese shows like the HKPCA. He’s joined by fellow New Englander Alex Stepinski of Whelen Engineering, who discusses drill concepts and the transition to zero discharge.

First EIE and CCI Eurolam on Direct Imaging, Printers and Partnership

In this interview, Gregory Stoeckli, CEO of First EIE, shares the realities of direct imaging requirements, while Lawson Lightfoot of CCI Eurolam discusses the success of the new distribution partnership the two companies have formed. Something we all agreed upon: A somewhat slower machine that is both highly flexible and affordable is a great fit for high-mix, low-volume producers.

All About Flex: High-Temperature Performance Flexible Circuits

Markets requiring thermal exposure at elevated temperatures include down-hole oil drilling, semiconductor processing, medical diagnostics and a multitude of military/aerospace requirements. But a limitation of flexible circuitry has been performance at extremely high temperatures.

A Conversation with IPC's President John Mitchell

I recently met with IPC President John Mitchell at the HKPCA show in Shenzhen, China to discuss a variety of topics, such as the China market, what’s stopping PCB manufacturing from coming back to America, education, 3D printing and what the association has planned for 2016.

Uyemura USA’s George Milad on Updating Final Finish Specs

George Milad talked about his subcommittee and what they have accomplished in a relatively short period of time. Their modus operandi of conference calls on a biweekly basis may be of interest to other committees and subcommittees that want to improve their turnaround time and get something done quickly.

An Interview with Gene Weiner at HKPCA

Barry Matties and Stephen Las Marias recently met with industry veteran Gene Weiner, president of Weiner International Associates to get his take on the HKPCA show, industry trends and his outlook for 2016.

CES 2016 Wrap-Up, Part 2: The Road Less Traveled

There was plenty to see on the show floor at CES 2016. But we found an entirely new universe of products to learn about and explore. We found such a dimension in the semi-private suites located on the upper floors of the Venetian, the Westgate, Mandalay Bay and other hotels. I'll spend a day in these suites next year!


CES 2016 Wrap-Up, Part 1

CES 2016 is now history and most of us are home, or at our next port-of-call. I have seen various attendance numbers but it’s somewhere in the range of 175,000; it was busy, crowded and impossible to see everything. Here is my review of some of the most innovative devices and technologies at CES.

Catching Up with HSIO’s James Rathburn

I have interviewed James Rathburn a number of times in the past few years and he always has something new to say. One of the industry’s leading technology inventors, Jim is always finding himself on the cutting edge of our technology. The recent acquisition of the former HEI operation in Tempe, Arizona exemplifies the path his company, HSIO, is taking towards a goal of being the industry’s true technology leader.

Weiner's World

In this article, industry veteran Gene Weiner looks back at some of the industry highlights in 2015, and ponders on the challenges and opportunities to expect this year. He also highlights recent industry events, including the 2015 International Printed Circuit & APEX South China Fair and SEMICON Japan.

Pete’s Top Ten PCB Articles for 2015

It's been a long year, hasn't it? It certainly seems like more than 365 days. And every year, our technical editor and industry veteran Pete Starkey picks his choice of the 10 best PCB technical articles for the year. Check them out.

iNEMI: Leading the Way to Successful Electronics Manufacturing

iNEMI CEO Bill Bader talks about the consortium’s goals and mission, its collaborative projects, as well as its roadmap for the electronics manufacturing industry. Bader also highlights iNEMI’s milestones in line with the major trends that have happened in the electronics industry, including the transition to lead-free, addressing tin whisker growth, and the move towards HFR-free PCB materials.

As Vias Shrink, Opportunities for Laser Drilling Expand

While lasers have long been employed for via drilling in PCB fabrication, mechanical drilling still remains the predominant production technology. However, as via diameters shrink to support various advanced packaging techniques, mechanical drilling becomes more expensive, and ultimately technologically unfeasible. A variety of laser technologies are now poised to step in to extend production via drilling down to the micron level.

MacDermid’s Research Team Talks New Cyanide-free Immersion Gold at SMTAI

While at SMTAI in Chicago recently, I met with two of MacDermid’s research team, Jun Nable, research project manager, who has been with MacDermid since 2007, and Cherry Santos, associate research fellow responsible for formulation work for metal plating solutions. We talked about the posters they were presenting and why they chose SMTAI.

Honeywell Paper Investigates Avionics Vibration Durability

Dr. Joseph Juarez, principal mechanical engineer at Honeywell International, discusses with I-Connect007's Andy Shaughnessy his SMTA paper, which addresses avionics vibration durability between tin-lead and lead-free solder, the years of testing he conducted, the importance of doing a good soldering job, and some of the surprising findings of his research.

Catching up with Winonics’ Mark Eazell

I have always thought of Winonics as one of the hidden gems of the North American PCB industry. Their well-equipped and well-laid-out facility in Brea, California is one of the more impressive looking PCB facilities in North America today. Winonics is one of three PCB companies owned by JR Controls, the other two being Cosmotronic and Bench2Bench. I had the opportunity to talk with Mark Eazell, the general manager at Winonics, who also oversees the operation of all three JR Controls’ PCB companies.

productronica 2015: Isola Supports Developments in Automotive Electronics

Helmut Kroener gives a perspective on Isola’s European market, whose major segments are industrial and automotive electronics. Driver assistance systems are a huge growth market and demand cost-effective low-dielectric-constant materials capable of 100 gigahertz operation.


Specialist Coatings for Specialist Applications

Taiyo America’s Josh Goldberg agreed to spend a few minutes with I-Connect007's Pete Starkey at productronica recently, where he indeed climbed out of the box and explored the broader market for high-performance polymer coatings in the electronics industry.

productronica 2015: Ventec's Latest Developments in the UK

Ventec continue to invest in the pursuit of ultra-cleanliness in pre-preg fabrication and packaging in their UK distribution operation, and announce a range of complementary consumable materials - foils, drill boards and release films - as proven in their Ventec-Option laminating and drilling service, leveraging their purchasing power and sharing the cost benefits with their laminate customers.

All About Flex: Embracing the Mess

Marketing in the world of printed circuits is an important discipline, but I have learned it is better to be prepared with a nimble reaction than to expect the marketing department to consistently be successful in predicting the future. The path to the goal is often achieved much more quickly by making an early decision followed by a course correction rather than waiting for all the information.

Navigating the Global Materials Supply Chain: A Roundtable Discussion

At SMTAI recently, I-Connect007's Andy Shaughnessy sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group; and Jack Pattie, president of Ventec USA. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen and Bob Willis, from the National Physics Laboratory (NPL).

On Scene: ICT Darlington Seminar, 24 November 2015

Darlington, in the north-east of England, has become an established venue for the Institute of Circuit Technology’s annual Northern Seminar, a not-to-be-missed opportunity for the UK’s PCB technologists to keep abreast with current developments and to network and exchange ideas and experiences with their peers. Coordinated by ICT technical director Bill Wilkie, and generously supported by Merlin PCB Group, the programme consisted of papers on funded projects and project funding, and updates on chemical process technology.

productronica 2015: MATU\AWP: Understanding Market Needs for Process Efficiency

The engineers in MATU/AWP represent hundreds of years of industry experience in developing the right machines for the right applications for the right customers! Design technology of the highest calibre - an in-depth understanding of achieving process efficiency, process economy and environmental friendliness in wet-processing and closed-loop copper recycling equipment.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs.

productronica 2015: Rogers Scales Up Production and Integrates Arlon's Product Range

John Hendricks gives a perspective on the European market for special-purpose laminates, and comments upon Rogers’ acquisition of Arlon and the integration of their complementary product range into the Rogers portfolio.

productronica 2015: Isola Supports Developments in Automotive Electronics

Helmut Kroener gives a perspective on Isola’s European market, whose major segments are industrial and automotive electronics. Driver assistance systems are a huge growth market and demand cost-effective low-dielectric-constant materials capable of 100 gigahertz operation.

All About Flex: Flexible PCB: What’s in a Name?

Flexible PCB is a common term that is synonymous with flexible circuits. While the term “PCB” is generally used to describe rigid printed circuitry, “flexible PCB” is a little contradictory because “boards” aren’t really flexible. Some companies, like All Flex, design and manufactures flexible PCBs, but not rigid PCBs. There are many similarities between the two, but also significant differences.


Designs on Flex: Underwriters Laboratory and Flexible Printed Circuits

Underwriters Laboratory is a worldwide safety consulting and certification company headquartered in Northbrook, Illinois. UL certifies, validates, tests, inspects, audits, and advises on safety of electrical and electronic products.

Mr. Laminate Tells All: Where in the Holy Halogens did 900, 900, 1500 Come From?

The 900, 900, 1500 is not a combination to an enormous safe that contains the remains of Jimmy Hoffa, nor is it the weight of three elephants at the San Diego Zoo in kilograms. The 900, 900, 1500 is the maximum parts per million (ppm) of bromine and chlorine and the total bromine and chlorine in a material that can be defined as “halogen-free” in the electronics industry today. But where did these requirements come from? Clearly, 900 ppm of bromine or chlorine is obviously not halogen-free. Some would argue that it is not even low-halogen at all.

Catching up with Cosmotronic’s Gary Abel

Cosmotronic’s history spans a number of decades, from the hot-as-hell boom days of the '60s and early '70s when Southern California was leading the world in electronics, from weaponry to avionics to apace exploration. Today, as innovation has become more focused on personal electronics, Cosmotronic has been there, leading the way and serving a customer base that is uniquely similar to the one they had back in the day.

Recruiting for Growth - An Interview with Jack Pattie, President & CEO of Ventec USA

Ventec USA is growing its successful US team, whilst others seem to be suffering from closures, stock downgrades and market challenges. I caught up with Ventec USA President Jack Pattie to find out why they are busy bucking trends.

American Standard Circuits Taking Business to New Heights

PCB007 Managing Editor Patty Goldman sat down with American Standard Circuits President Anaya Vardya at the recent SMTAI show and conference in Rosemont, IL. Anaya wanted to share all the great new things going on at his company. Among the topics they discussed: new equipment, new processes, new people, and what it all means for ASC’s growth.

All About Flex: Plated Through-holes in Flexible Circuits

There is probably no more important feature than the plated through-hole (also called via or via hole) with regard to the reliability and integrity of a flexible circuit. The through-hole provides electrical connection between insulated layers and enables electrical functionality on double-sided and multilayer flexible circuits.

The Economics of Reducing Cycle Time in PCB Fabrication

As circuit board fabricators are constantly pressured for cost reductions, speed is definitely one thing worth paying for in 2015. This article highlights examples of industry practices that successful fabricators in the quick-turn market embrace that can help those companies who want to reduce cycle times in their operations.

Flex Circuit Shielding Design Options

Shielding may not be your company’s number one design concern when thinking about your interconnect designs. But if you have to shield circuits for EMI, then you will need to depend on your supplier to assist you with their favorite shielding technique and experience.

Interim CEO Jeff McCreary Discusses Recent Changes at Isola

Isola’s Interim President and CEO Jeff McCreary explains to Barry Matties the impetus for the personnel reduction taking place at Isola, the closing of their northern California facility, and why there’s no need to panic. He also shares his view of what the industry may expect from Isola going forward and what the company is looking for in a new CEO, the name of which McCreary expects to announce in the next few months.

Catching up with Nujay Technologies: A Conversation with Urvi and Nesh Dholakia

I have been following value added vendor Nujay Technologies for a number of years now because I like their story and their positive and helpful attitude. Their mission, if you will, is to provide their customers with whatever they need. They are also willing to talk to their customers and prospective customers to find out what their biggest challenges are when it comes to finding and purchasing PCBs. Thus, they embody the classic definition of a business, which is to find a need and fill it.


The Application of Advanced Ultrasonics in Metal Plating Processes

Most surface modification chemical treatments by their very nature contain hazardous and oxidising chemicals; there is a major concern that these chemicals are used maliciously with the intent to manufacture explosives or formulate poisons to harm the public. Cyanide-based plating solutions and high concentrations of hydrogen peroxide used in current techniques are a significant use of these materials in industry.

Semico Impact Conference 2015: The Coming of Age of Hardware Technologies

For most of us who are deeply involved in the electronics hardware market, we are used to talking about new products and technologies, the future of things to come, and probably most importantly, the challenges or issues that we, as an industry, are facing.

Testing Flexible Circuits, Part 2: Raw Materials and Components

Even though the raw materials may individually meet certain specifications, it is important to determine if the final product configuration meets those specs. So testing done at the finished circuit level is also needed. Tests specific to the finished circuit will be the topic of our next column on testing.

The Reindustrialisation of Europe

With an inquisitive mind and a head for challenges, besides the ability to think outside the box and the courage to dare to be different and strive to be first, Spirit Circuits MD Steve Driver can be relied upon to grab the attention of an audience of PCB professionals. As keynote speaker at the Institute of Circuit Technology Hayling Island Seminar, he lived up to his reputation with a motivational presentation, the two themes of which exemplified his latest entrepreneurial venture.

Final Surface Finishes for Automotive: No One-Size-Fits-All Solution

Regardless of whether your application is automotive, medical or military, there are many factors to consider when selecting a final surface finish. Cost, lead or lead-free requirements, end environment, shelf life, fine-pitch components, RF applications, probe-ability, thermal resistance and shock and drop resistance, to name a few. There is not a one-size-fits-all finish. Understanding the advantages and disadvantages of each surface finish allows the designer to select the finish that best fits each particular application.

Material Witness: Using Scaled Flow Data

Resin systems whose density is not very near 1.35 do not quite fit into the official IPC test method because all the stack weight data used assumes epoxy resin of a standard 1.35 density. Any resin whose density varies from that value requires a new set of calculated weights for various stack-ups in order to provide precise data. This is especially true of filled systems whose resin density now includes a ceramic component as well as the organic resins themselves and may have densities higher than standard.

HDI Technology - Flex Circuits

The flex circuit industry in North America is moving rather quickly. The packaging densities are moving to smaller and the electrical requirements much faster. In order to keep pace with the industry requirements of HDI, North American flex vendors need to invest in equipment, resources and R&D.

Cars, Cars, Cars!

The September 2015 issue of The PCB Magazine focuses on automotive electronics, and includes discussions on the automotive electronics market today, where it's heading tomorrow, and what it all means to companies wanting to participate; latest innovations in automotive electronics technologies; and what to expect in our car of the future.

Characterization of PCB Material & Manufacturing Technology for High-Frequency

Concepts like Industry 4.0, Internet of things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement—a considerable amount of data and increased data transfer rate. The aim of this paper is to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.

Flex Market Evolution

Flex circuits are designed to solve electronic packaging and assembly problems, solve interconnection issues, assist in miniaturization, and provide a dynamic electro-mechanical solution. They are configured with repeatable conductors that foolproof assembly errors. Flex is used in designs where standard printed circuit boards, connectors and cable assemblies just don’t provide the right electrical or mechanical solution.


Plating and Quality are Close Partners

A good plating manager is a seasoned veteran with many years of hands-on experience and probably an engineering degree. Bob Tarzwell sees firsthand how PCB manufacturers, without the proper plating shop set-up operations, knowledge and experience, adapt and accept poor practices as normal while they continue with poor quality processes—even after attempted corrective input from vendors and consultants.

Supply Chain Challenges and Opportunities

Let’s start by defining exactly what a supply chain is. It’s not a nautical term for an anchor chain, or a dynamic part of a chainsaw that never runs out of chain. No, it’s a key term used in the organization of resources which may form a system between entities. Now this sounds a little closer to something that may be utilized in producing an electronic end-item, in our case, a printed circuit board.

Latent Short Circuit Failure in High-Rel PCBs due to Cleanliness of PCB Processes and Base Materials

Latent short circuit failure of power PCBs has been associated with fiber contamination of the dielectric material. Tests and inspections have shown various sources of contamination in laminate, prepreg and on etched innerlayers. It has been demonstrated by IR tests that contamination can cause breach of insulation due to electromigration.

The War on Process Failure Continues in August Issue of The PCB Magazine

The August issue of The PCB Magazine is focused on the war on process failure. This subject of process failure turns out to be quite broad and affects essentially everyone in our industry, from the raw material suppliers to the circuit designer to the PCB processor to the assembly folks and on to the OEM. We all have a hand in it, both causing and solving problems and benefiting from solutions. You will find several appropos and useful articles in this issue.

Dry Film Photoresist Thickness Selection Criteria

Dry film photoresist suppliers typically indicate for which process a certain resist type is suitable; however the fabricator still has to select the resist thickness that matches his needs best. The most important thickness selection criteria that come to mind are price, resolution, and yield. This article talks about the advantages and disadvantages of choosing films that are too thin for the application.

The Drive for Transparent Circuits

DKN Research develops many types of unique electronic circuits. Some products in our portfolio include ultra-thin conductor circuits as small as 0.2 microns, metal-free circuits, and some circuits up to 20 meters long. Our staff fields many inquiries for packaging of new electronic devices. Lately, there is a lot of interest in transparent flexible circuits. The increase in interest is driven by the recent market expansion of display and optical devices.

Material Witness: The Use of Fillers in Composites

The use of finely divided ceramic fillers in composites intended for use in printed wiring boards has a long history, but most people still associate the idea with reducing the cost of the product by loading it with an inexpensive inert filler. Nothing could be further from the truth...

Accomplish Change Together (ACT)

Shifting strategies for selling PCBs and the materials to build them is the impetus for ACT. Insulectro's Ken Parent and Jason Marsh spoke to I-Connect007 Publisher Barry Matties about the ACT approach—and how it is helping their PCB fabricator customers increase sales and OEMs to get better products.

Design and Manufacture of High-Voltage Electronics

This SMART Group webinar, presented by Ian Lake, director of engineering at Applied Kilovolts Ltd, and moderated by Bob Willis, explored the current technical barriers faced in high-voltage electronics design and manufacturing processes. Although he made it clear that within the timeframe of a webinar session he could only scratch the surface of the topic, Lake gave a valuable insight into basic concepts and drivers and set a perspective on current state of the art and future trends.

Eliminate Connectors with Sculptured Flex

Any time you eliminate a component, hidden costs are eliminated, such as the cost of stocking, tracking and managing the supply chain for that part number. When designing an electronic package, don’t assume that you need a component for every connection point. Sculptured flex will give some options that can make your electronic package, lighter, less costly, more reliable, and take up less space.


A Well-Designed Laminate Supply Chain has to Own It!

Suppliers must use industry knowledge, robust systems, clever software and total visibility to build a supply chain agile enough for any PCB fabricator. Consigned stock, local customization, regional hubs, short manufacturing cycles, controlled processes and highly evolved systems are just a few of the tools needed to develop custom fit solutions that flex and move with the needs of the fabricator and their customers. You can only design the supply chain when you own the supply chain.

Coated Ultra-Thin Copper on Printed Circuit Laminates

Nano copper-based electronic ink and associated processing have been developed to create ultra-thin copper on flexible PCB substrates, allowing for much finer etch resolution and increased circuit density. The process is rapid and sufficiently low-temperature to allow deposition onto temperature-sensitive substrates such as polyimide, plastic and paper.

An Update on the Rogers Material Supply Line

As part of a recent I-Connect007 supply chain survey, we found that RF laminate material can be very difficult to obtain. Rogers Corporation was named specifically in our survey as one supplier with a limited amount of material available. In fact, their delivery time was reported as being as high as 55 days for some materials at one point. In an industry where quick turnaround time is critical, this is one supply line that killed any hope of being quick.

Innovative Technologies Drive PCB Industry Growth

PCB growth has slowed in recent years, though last year the growth rate was slightly higher than the 2% of the last three years. Estimates by IEK of Industrial Technology Research Institute of Taiwan show that the PCB industry will continue to grow in 2015 at a rate of 3-5% with an annual output of RMB 576 billion (USD 93.8 billion).

EIPC Summer Conference: Day 2

Refreshed after an excellent conference dinner, and for most, a good night’s sleep, delegates returned for the second day of the EIPC Summer Conference in Berlin, continuing the theme of improving profitability through technical leadership and innovation to meet future market requirements, with sessions on materials and processes for high performance PCBs and advanced material testing strategies to meet OEM and ODM needs.
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