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EIPC Technical Snapshot: Automotive Technology
10/19/2020 | Pete Starkey, I-Connect007
I-Connect007 Editor's Choice: Five Must-Reads for the Week
10/16/2020 | Nolan Johnson, I-Connect007
This Month in PCB007 Magazine: The Acceleration or Deceleration of Change
10/16/2020 | Dan Feinberg, I-Connect007
Real Time with… AltiumLive 2020: Würth Virtual Factory Tour
10/13/2020 | Dan Feinberg, Technology Editor, I-Connect007
An Update on Walt Custer’s EIPC Business Outlook Webinar
10/12/2020 | Pete Starkey, I-Connect007
PCB :: Associations
HDPUG Demonstrates Benefits of Cooperative R&D
The High Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.
iNEMI Managing Director: New, Disruptive Technology on the Horizon
Dr. Haley Fu, managing director of Asia Pacific for iNEMI, and Publisher Barry Matties spoke recently. Fu gave her overview of the last eight years with iNEMI along with her opinion of what the most significant changes have been, globally and for the Asia market in particular. She predicts that in the future, the PCB will probably adopt optical architectures instead of copper, because using copper for the trace means that the land space and the property will not satisfy the future high-speed data transport rate.
IPC Plating Sub-committee 4-14: Surface Finish Specifications
IPC specifications are reference documents to be called out by designers and OEMs. Designers may take exception with one or more items in the specification to ensure that the product meets the requirements of its intended use. The acronym AAUBUS (as agreed upon between user and supplier) is part of any specification. Specifications are consensus documents. They are agreed upon by a panel of interested industry participants composed of suppliers, manufacturers, assembly houses (CMs) and end-users. The IPC Plating Sub-committee 4-14 is no exception.
The Importance of Harmonized Standards that Benefit All
I-Connect007 Technical Editor Pete Starkey caught up with Amphenol applications engineer Sean Keating at IPC APEX EXPO. Keating explains his company’s commitment to proactive participation in the establishment of standards, his personal experience working on standards committees, and his view on the importance of harmonised global standards.
An Interview with Gardien Group’s Jason Fraser
Gardien Group CEO Jason Fraser talks to Dan Beaulieu about some of the latest developments at the company, some of the technology trends driving the company's strategies, as well as provides his outlook as to where the PCB industry is headed.
IMPACT 2015: An In-Depth Look
IPC understands that presenting a unified voice for the electronics industry is essential for advancing policies that affect the industry’s long-term future and strengthens the U.S. and global economy. That is why 22 IPC member-company executives descended on the nation’s capital for IMPACT 2015: IPC on Capitol Hill, IPC’s annual advocacy event.
Material Witness: How About that Technical Roadmap!
You may remember the movie "What About Bob?" If you do, you may recall the scene in which Bob (Bill Murray) confronts his psychiatrist (Richard Dreyfuss) and emotes, “I need! I need! I need! Gimme! Gimme! Gimme!” As I thought recently about some of the drivers that IPC and others have incorporated into their technical roadmaps, I feel a bit like that befuddled psychiatrist.
IPC Validation Services 2014
Guest Editor Judy Warner talks with IPC's Director of Validation Services, Randy Cherry. Randy has been busy since launching IPC's Validation Services a year ago, with 16 QML audits completed and rapidly growing interest shown at this year's show. Randy also discusses future plans for auditing to IPC intellectual property standards 1071A and 1072, as well as to PCB standard 6012.
A Conversation (and Day) with Joe Fjelstad, Part 5
Our five-part interview series with Verdant Electronics Founder Joe Fjelstad wraps up with a look back at the point when Fjelstad’s career began focusing on circuit board technology, and he details his patented Occam process, and why this game-changing, disruptive technology has yet to become standard practice in the industry. Also explained: Why Fjelstad has been referred to as an “iconoclastic polemicist,” and how a Native American story he heard long ago has resonated throughout his career and life.
Insulectro Alliance with Freedom CAD
Ken Parent, Vice President of Sales at Insulectro, recently sat down with I-Connect007 Publisher Barry Matties for a quick chat about the strategic alliance that Insulectro is pursuing with Freedom CAD. Parent explains how this new strategic effort is working, and what it means for customers--and OEMs.
Growing Their Portfolio: Camtek’s One-Stop-Shop in Functional Inkjet Technology
I-Connect007 Publisher Barry Matties caught up with Dr. Boaz Nitzan, VP of Functional Inkjet Technologies at Camtek recently, and the two discussed the company’s expanding portfolio into inkjet printing system for PCB solder mask & legend. The new system is designed to replace conventional coating, drying, exposure and development processes currently used in PCB manufacturing.
Material Witness: Low-Flow Prepregs – Taming the Process
In this installment of Material Witness, Chet Guiles continues his discussion around Low-Flow Prepregs giving good advice about how to actually use these materials.
Zentech’s John Vaughan on the Mil/Aero Sector: “It’s Headed Up”
I-Connect007 Publisher Barry Matties and Zentech’s John Vaughan had a chance to discuss industry concerns within the mil/aero segment at IPC APEX EXPO 2015. The two also shared thoughts on the space industry, and Vaughan detailed Zentech’s involvement with National Manufacturing Day, a nationwide effort focused on STEM (Science, Technology, Engineering and Math) that simultaneously brought high school students together with 1,600 manufacturing companies from around the U.S.
Rex Rozario: Investing in Graphic PLC Through Technology and Capacity
I-Connect007 Tech Editor Pete Starkey and Graphic PLC Group Chairman Rex Rozario caught up at IPC APEX EXPO 2015. Among other items, the two discussed Graphic’s current expansion in size and equipment, as well as what Starkey describes as the company’s history of making good decisions.
Bernie Kessler: Pioneering Spirit Then and Now
I-Connect007’s Patty Goldman sat down with longtime friend and IPC Hall of Famer Bernie Kessler at IPC APEX EXPO 2015 in San Diego. Among other things, the two discussed the early days of IPC, and the beginnings of APEX EXPO.
Raising a Unified Voice for an Advanced Manufacturing Economy
The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.
Hunter Technology on Design Operations and Business Strategies
Immediately following IPC APEX EXPO 2015, Guest Editor Kelly Dack paid a visit to Hunter Technology’s facility in Milpitas, California, where he interviewed Ian Grover, vice president of design engineering, and Chris Alessio, vice president of sales and programs. Discussed are Hunter’s design operations as well as the company’s overall business strategy.
Are There Advantages to Changing Your Registration System?
I-Connect007 Publisher Barry Matties recently had a conversation with DIS's Tony Faraci at IPC APEX EXPO 2015, to learn more about their pinless registration system. What was most interesting to Barry are the potential advantages a pinless system offers and if so, why the process has not been widely adopted.
Trending at Freedom CAD: New Crop of Next‐Gen Designers
Scott McCurdy, director of sales and marketing at Freedom CAD Services, expresses his vision for what North America is bringing to the table in the world of circuit design. I‐Connect007 Publisher Barry Matties and McCurdy also discuss China, trends in product design, tools, and more.
Material Witness: Low-Flow Prepregs–Defining the Process
Let’s try to define “low flow” in terms that will make sense to both suppliers and users of the products. A low-flow prepreg is a prepreg that flows sufficiently to wet out and adhere to bonding surfaces and to fill inner layer copper details, but does not flow so much as to fill in cut-out areas in a heat sink or run unevenly out of the interface between rigid and flexible elements of a rigid-flex PWB.
Japan’s Thermosetting Plastics Association Represents at IPC APEX EXPO 2015
At the International Reception, held opening night of IPC APEX EXPO 2015, I-Connect Technical Editor Pete Starkey made the rounds and found some visitors from Japan, namely, Kazutaka Masaoka, from Thermosetting Plastics Association (JTPIA). In this brief interview conducted amongst the reception attendees, Masaoka-san and Starkey discuss Japanese vs. North American circuit board quality and business trends.
Reliability and Harmonization of Global Standards at Forefront of EIPC Efforts
At IPC APEX EXPO 2015, I-Connect007 Technical Editor Pete Starkey caught up with EIPC's Michael Weinhold and Alun Morgan, who were happy to discuss both recent and ongoing focuses for EIPC, namely, reliability. Also touched on was the importance of the alignment of global standardization processes, especially for Asia.
Ready to Hire! Blackfox Provides IPC Class 3 Training to Veterans
I-Connect007 Publisher Barry Matties caught up with Al Dill, president and CEO of Blackfox Training Institute, for an in-depth discussion on Blackfox's expansion plans for North America (Tempe, Arizona and Guadalajara, Mexico) and Malaysia (Penang). Dill also describes the highly successful veteran’s training program, which is being spearheaded at the Blackfox headquarters in Longmont, Colorado.
Bob Neves Receives Award, Talks Bergman Tribute
I-Connect007 Publisher Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.
Bob Neves Receives Award, Talks Bergman Tribute
Barry Matties sat down with Bob Neves, one of the first recipients of the Dieter Bergman IPC Fellowship award, to talk about the tribute held for Dieter on Wednesday night of IPC APEX EXPO 2015, and some of the reasons behind the newly created award.
EPTAC Expansion Includes CID Curriculum
Leo Lambert, vice president and technical director of EPTAC, discusses EPTAC's latest expansion, which includes IPC's certified interconnect designer (CID) curriculum.
2015 EIPC Winter Conference, Munich: Day 1 Review
Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.
Three Industry Giants From WKK Gather Around for Discussion
During the recent HKPCA show we sat down with Hamed El-Abd, Lionel Fullwood, and Gene Weiner. Our discussion covered an array of topics, from politics to new PCB factories and what it takes to stay competitive in today's market.
Thin PCBs for Smart Phones: Technology and Reliability Considerations
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.
Ventec USA Prepares for Growth
Technical Editor Pete Starkey writes, "IPC APEX EXPO 2014 in Las Vegas, Nevada, gave me the opportunity to catch up with Ventec USA President Jack Pattie and to meet the recently-appointed General Manager of the Ventec Fullerton Southern California facility Ray Young. The pair also gave an update on current developments and future company plans."
Viking Moves On
Technical Editor Pete Starkey says the warmth of the welcome at Viking more than compensated for a three-hour trek through the traffic and southern England's miserable weather: "There was a buzz of excitement about the place and the development workshop was a hive of activity, with a crowd gathered around the CircaPrint digital ink-jet printer, the print-head scanning smoothly in a glow of purple light."
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