Article Highlights
PCB :: Fabrication Process

Latest Articles

Cadence’s Brad Griffin Digs Deep Into DDR

During DesignCon 2015, our roving reporter, Kelly Dack, stopped by to visit with Brad Griffen in the Cadence booth. What follows is their very interesting conversation that revolves around the evolution of DDR.

2015 EIPC Winter Conference, Munich: Day 1 Review

Ninety delegates, eleven countries represented and a thought-provoking two-day programme on themes of reliability in PCB fabrication and assembly, copper cleaning and advanced material solutions, advanced imaging and soldermask, and how to make PCBs smart and ready for Industry 4.0. Add the further attractions of a keynote by Walt Custer and the chance to visit a military aircraft assembly plant: the formula for another highly successful EIPC Conference, this time close to Munich Airport.

OSP and Selective Electroless Nickel for Mixed-Metal Finish PWBs and BGA Substrates

The documentation relating to the requirements for alternative surface finishes have been well publicized at many industry forums. Pressure to eliminate lead in electronics assemblies is forcing fabricators and OEMs to reevaluate their surface finish and joint attachment procedures.

A Conversation with Andy Michniewicz

Gul Technologies (Gultech) is not your traditional offshore supplier. It is a true industry leader when it comes to technology. A few months ago, I sat down to talk with Mayne-McKenney’s Andy Michniewicz. His company represents Gultech here in North America and they were just starting a project to expand Gultech’s market reach on this side of the globe. I found that interview interesting enough that I wanted to follow up and see how things were going now that a few months have passed.

DSG Invests in the Future

Mauro Dallora, COO of Dongguan Somacis Graphic PCB Co. Ltd (DSG) shares how they have increased revenue and share their plans to double it.

Polar Takes on China's Test Equipment Counterfeiters

Recently, while in China, Barry Matties spoke with Jonson Jiang, country manager of Polar Instruments. They discussed the company's latest impedance test equipment offerings and the challenges Polar faces in China, including companies that create counterfeits of their testing equipment. Can legitimate companies rely on China's government to fight counterfeiting?

Three Industry Giants From WKK Gather Around for Discussion

During the recent HKPCA show we sat down with Hamed El-Abd, Lionel Fullwood, and Gene Weiner. Our discussion covered an array of topics, from politics to new PCB factories and what it takes to stay competitive in today's market.

A Conversation with Gaby Waisman, Orbotech, Ltd.

During the recent HKPCA and IPC Show, held in Shenzhen, China, I sat down with Gabby Waisman, President, Orbotech Pacific. We discussed the exciting electronics market in Asia, the market for Laser Direct Imaging (LDI), AOI and AOR among other things.

A Conversation with Canice Chung, TTM Technologies

We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.


Aluminum Base Circuit Technology: Structures and Manufacturing Methods

Aluminum is an attractive material for use in the manufacturing of electronic assemblies due to its low cost, good thermal properties, and stability. But due to its innate thermal spreading ability, it's not easily used when solder is required to make interconnections to components. This article describes ways to manufacture electronic assemblies using aluminum as a base and eschewing the use of solder.

Disrupting PCB Imaging with Inkjet Technology: Challenges & Opportunities Explained

Why are 95% of the circuit boards driving digital devices still imaged with film, the same way they have been for the past 50 years? This paper from Henk-Jan Zwiers of Mutracx will address this question by exploring the challenges of digital PCB imaging and the emergence of inkjet imaging, a technology that has the potential to revolutionise the industry.

Electrical Testing of Passive Components

This paper, from a group of authors from Gardien Services, discusses the new processes required by electrical test centers and labs and how the ET arena has adapted to provide accurate testing of buried resistors and accommodate the buried capacitive cores to not receive false errors from the grid testers and flying probes.

Graphite-based Direct Metallization for Fabrication of Complex Interconnect Designs

According to author Michael Carano, colloidal graphite direct metallization processes have proven their usefulness as a replacement for electroless copper. Continuous improvements in the stability of the graphite dispersion has made the process an enabler for flex and HDI interconnect designs.

Viking Moves On

Technical Editor Pete Starkey says the warmth of the welcome at Viking more than compensated for a three-hour trek through the traffic and southern England's miserable weather: "There was a buzz of excitement about the place and the development workshop was a hive of activity, with a crowd gathered around the CircaPrint digital ink-jet printer, the print-head scanning smoothly in a glow of purple light."

New Developments in ENIG and ENEPIG

Surface finish is about connectivity. It is the surface which forms the connection between the board and a device. Today, there is an impressive lineup of surface finish products. Among those finishes are ENIG and ENEPIG. George Milad and Don Walsh explain the newest technology developments.

New Compact PCB Plotter Available

LPKF Laser & Electronics' ProtoMat S62 circuit board plotter delivers advanced PCB prototyping capabilities with reduced board production time and increased overall accuracy. Combining a maximum milling speed of 150 mm/sec, a system resolution of 0.25 µm and a 62,000-rpm spindle motor, the plotter produces fine traces for all types of PCBs, including RF and microwave boards.
PREVIOUSNEXT
Copyright © 2020 I-Connect007. All rights reserved.