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Latest News

Keep Up to Date With “Industry Leaders Speak Out: COVID-19 Outbreak” Forum
03/31/2020 | Nolan Johnson, I-Connect007
Ucamco Releases Final Version of the Gerber X3 Specification
03/20/2020 | Ucamco
RBP Chemical Technology Announces the Release of ONYX™ Direct Metallization System for PCBs
03/11/2020 | RBP Chemical Technology
PCB West 2020 Exhibition Floor Sold Out for 9th Year in a Row
02/26/2020 | UP Media Group
American Standard Now Offers Book Binder Rigid-Flex Printed Circuit Boards
02/18/2020 | American Standard Circuits
LPKF Presents Equipment at Embedded World 2020
02/17/2020 | LPKF Laser & Electronics
IPC Statement on U.S.-China Trade Deal
01/15/2020 | Chris Mitchell, IPC VP, Global Government Relations
CIMS VVR – The Revolutionary AOI Verification Concept
01/13/2020 | CIMS
NextFlex Awards Over $12.5 Million in Funding for Flexible Hybrid Electronics Innovations
01/09/2020 | Business Wire
P2i's New Halogen-Free Barrier Range Will Help OEMs Meet Environmental Targets
01/03/2020 | PR Newswire
High-Power UV-LED Systems for 3D Printing, Maskless Photolithography
12/09/2019 | Novus Light Technologies Today
2019 International Electronics Circuit Exhibition Opens in Shenzhen
12/04/2019 | HKPCA
RBP Announces the Release of MetalTreat Chelate Eliminator-8
12/04/2019 | RBP Chemical Technology
Element Solutions Inc Launches Innovation Prize to Reward Technological Curiosity in Relevant Materials Science
11/25/2019 | Element Solutions Inc.
A Young Engineer’s Perspective on Joining the Industry
11/21/2019 | I-Connect007 Editorial Team
IPC Welcomes Alison James as New Senior Director, Europe
11/18/2019 | IPC
productronica Names 2019 Innovation Award Winners
11/13/2019 | Messe München
Conductor Analysis Technologies, Inc. Announces Shipments of Second Gen OM Thermal Stress Systems
11/07/2019 | Conductor Analysis Technologies
Miva Technologies and MivaTek Global to Exhibit at Productronica 2019
10/31/2019 | MivaTek Global
Perfect Point Announces Release of New FPC & Adhesive Based Material Endmill
10/30/2019 | Perfect Point
Call for Papers: EIPC Winter Conference 2020
10/04/2019 | EIPC
CHPT Successfully Tapping Into Satellite PCBs Segment
04/16/2019 | Digitimes
Nordson MARCH Launches New Automated Plasma treatment system
03/28/2019 | Nordson MARCH
DYCONEX Develops Miniaturized Active NFC Sensor
03/26/2019 | DYCONEX
MicroCraft Adds 8 Probe System with Full Automation
12/31/2018 | MicroCraft
EIPC SpeedNews: News from the European PCB Industry
12/03/2018 | EIPC
Altium Announces Altium 365 at Altium Live
10/05/2018 | I-Connect007 Editorial Team
EIPC Seeks Technical Papers for 2019 Winter Conference
09/24/2018 | EIPC
Rogers Introduces MAGTREX 555 High Impedance Laminates
06/13/2018 | Rogers Corporation
From CPES2018: NanoCnet Unveils New Generation of Silver Nanomaterials
05/25/2018 | intelliFLEX


Atotech to Present New Flex, Flex-Rigid Products at C’Tex 2018
05/15/2018 | Atotech
Nano Dimension Launches On-Demand 3D Printed Electronics Service
02/12/2018 | Nano Dimension
Tramonto Circuits Achieves 94.96% Overall On-Time Delivery in 2017
01/03/2018 | Tramonto Circuits
Matrix USA Introduces New Electrostatic Panel Cleaner
11/06/2017 | Matrix USA Inc.
Creative Materials Unveils One-Component B-Stageable Epoxy Adhesives
09/15/2017 | Creative Materials, Inc.
John Pardini Named Global Account Manager for IMS Materials at Ventec International
09/11/2017 | Ventec International
Rogers Introduces CLTE-MW Laminates for 5G and Other Millimeter Wave Applications
08/25/2017 | Rogers Corporation
EIPC SpeedNews: News from the European PCB Industry
05/08/2017 | EIPC
Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil
01/13/2017 | Advanced Copper Foil
AISMALIBAR North America to Exhibit at Ford Advanced Lighting Innovation Expo
09/16/2016 | Aismalibar
Insulectro Advances Signal Integrity Product Arsenal at PCB West
09/13/2016 | Insulectro
Bay Area Circuits Releases Version 3 of Its Free PCB Design Software
08/24/2016 | Bay Area Circuits, Inc.
Mentor Graphics Launches New Xpedition Enterprise Platform
08/15/2016 | PRNewswire
August Issue of The PCB Magazine Available Now
08/08/2016 | The PCB Magazine
IEC Unveils New Enhanced Website
06/15/2016 | IEC
Orbotech Launches Nuvogo Fine at JPCA 2016
06/01/2016 | PRNewswire
Orbotech AOS Solution Aims to Increase PCB Yield
05/18/2016 | PRNewswire
Frontline Launches InCAM Flex
05/18/2016 | Frontline PCB Solutions
IPC APEX EXPO 2017 Calls for Papers, Technical Courses
05/11/2016 | IPC
Rogers Introduces 92ML Thermally Enhanced Laminates and Prepregs
05/04/2016 | Rogers Corporation
LPKF to Debut Latest Laser System at International Microwave Week
04/20/2016 | LPKF
ASC to Exhibit at SMTA West Penn Expo and Tech Forum
04/19/2016 | American Standard Circuits
atg Luther & Maelzer Launches New Bare Board Grid Test System
04/15/2016 | atg Luther & Maelzer
LPKF Launches Entirely New Flex Drilling & Cutting Laser
03/01/2016 | LPKF
LPKF Launches Entirely New Flex Drilling & Cutting Laser
02/05/2016 | LPKF
Frontline Releases InCAM 2.32
01/22/2016 | Frontline PCB Solutions
ESI Unveils Newest Addition to Its PCB Via Drilling Product Portfolio
12/07/2015 | ESI
EIPC Speednews: News from the European PCB Industry
12/04/2015 | EIPC
Schmoll Introduces New MDI Product at productronica 2015
11/20/2015 | Burkle North America
Have You Seen I-Connect007's Coverage of productronica 2015?
11/17/2015 | I-Connect007


All Flex Launches Web-Based 'Build-A-Heater' Configurator
11/02/2015 | All Flex
HKPCA & IPC Show Returns in December
10/29/2015 | HKPCA
SHENMAO Introduces BGA and Micro BGA Bumping Solder Paste
10/12/2015 | SHENMAO America, Inc.
Ucamco Launches 3 Wavelength Series of Ledia Direct Imaging Systems
09/24/2015 | Ucamco
Matrix and Hakuto Launch Innovative Dry Film Laminator in N.A.
08/05/2015 | Matrix USA Inc.
Everett Charles Technologies Introduces HC500F High Current Probe
08/03/2015 | Everett Charles Technologies
Amundson Launches Arkeo Stack and Arkeo Panel
07/08/2015 | Amundson Technologies
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