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Latest News

Atotech Launches Pre Dip for Fine-Line Applications
03/21/2018 | Atotech
KLA-Tencor to Acquire Orbotech
03/19/2018 | Orbotech
Matrix Launches New Automation Solutions for NA Fabricators
03/19/2018 | Matrix Electronics
Arlon Electronic Materials Receives IPC-4101 QPL for Polyimide Spec Sheets
03/16/2018 | IPC
Polytron Print Tests with Gardien’s Automatic Tester
03/15/2018 | Gardien Group
Park Electrochemical Declares Cash Dividend
03/15/2018 | Park Electrochemical
Matrix Electronics Reports Successful IPC APEX EXPO 2018 Show
03/14/2018 | Matrix USA Inc.
IPC Issues Call for Participation for IPC APEX EXPO 2019
03/14/2018 | IPC
Cirexx Brings Hot Air Solder Level Back in House
03/13/2018 | Cirexx International
Topoint Likely to Post Double-digit Revenue Growth in 2018
03/13/2018 | Digitimes
Panasonic Revises Pricing for Copper Clad Laminates, Prepregs
03/12/2018 | Panasonic Corporation
Now Available: The March 2018 Edition of PCB007 Magazine
03/08/2018 | I-Connect007
AT&S Returns to the Austrian Lead Index ATX
03/07/2018 | AT&S
DfR Solutions Wins IPC APEX EXPO Innovation Award
03/06/2018 | DfR Solutions
RTW IPC APEX EXPO: DIS Introduces Enhanced Pinless Multilayer Layup System
03/05/2018 | Real Time with...IPC
Advanced Circuits Upgrades Free PCB Design Software
03/01/2018 | Advanced Circuits
Rogers Reports 2017 Net Sales of $821 Million, Up 25.1%
02/28/2018 | Rogers Corporation
Gardien Services Exhibiting at IPC APEX EXPO 2018, Booth 241
02/27/2018 | Gardien Services USA
Prototron Circuits Now Offering a Complete PCB Global Solution
02/26/2018 | Prototron Circuits
Four IPC APEX EXPO Exhibiting Companies Push Boundaries of Technology and Earn 2018 Innovation Awards
02/26/2018 | IPC
Lenthor Engineering Purchases Two Wise Wet Process Systems from Technica USA
02/26/2018 | Lenthor Engineering
Matrix to Exhibit at IPC APEX EXPO 2018
02/23/2018 | Matrix USA Inc.
American Standard to Exhibit at EPTECH Markham Electronics Show
02/23/2018 | American Standard Circuits
Cirexx Purchases Third DI system from Technica USA
02/23/2018 | Technica USA
Insulectro Energizes Booth at IPC APEX EXPO with Power Chats
02/22/2018 | Insulectro
Rigiflex Technology Purchases DI System from Technica USA
02/22/2018 | Technica USA
Rogers to Showcase Power Electronics Materials at APEC 2018
02/21/2018 | Rogers Corporation
Rogers Schedules Q4 & Full Year 2017 Earnings Call for February 27
02/21/2018 | Rogers Corporation
Perfect Point Launches Carbonite Carbide Tool
02/21/2018 | Perfect Point
Rogers to Showcase Advanced Materials at IPC APEX EXPO 2018
02/20/2018 | Rogers Corporation

Power Integrity by Example eBook Available for Download
02/19/2018 | I-Connect007
Bowman Appoints Timothy He as Lead XRF Scientist
02/19/2018 | Bowman
LG Display Selects Orbotech AOI for South Korea Facility
02/19/2018 | Orbotech
Matrix USA Partners with Advanced Engineering, Austria
02/19/2018 | Matrix USA Inc.
Sunstone Circuits Sponsors, Judges MakeHarvard Hackathon
02/16/2018 | Sunstone Circuits
Orbotech Reports Q4 and Full Year 2017 Results
02/16/2018 | Orbotech
EIPC SpeedNews: News from the European PCB Industry
02/15/2018 | EIPC
Plasmatreat North America Names Hardev Grewal New CEO
02/15/2018 | Plasmatreat North America
Insulectro to Recruit Superstar Talent at IPC APEX EXPO 2018
02/14/2018 | Insulectro
I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
02/13/2018 | I-Connect007
PTI Recognizing Benefits of DI System Purchased from Technica USA
02/13/2018 | Technica USA
Nano Dimension Launches On-Demand 3D Printed Electronics Service
02/12/2018 | Nano Dimension
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
02/12/2018 | Ventec
Aismalibar North America to Exhibit at Strategies in Light
02/12/2018 | Aismalibar
Best Technical Paper at IPC APEX EXPO 2018 Selected
02/12/2018 | IPC
Plasmatreat Names Nico Coenen Business Development Manager of Electronics
02/12/2018 | Plasmatreat
LPKF to Exhibit at IPC APEX Expo 2018
02/12/2018 | LPKF Laser and Electronics
EIPC SpeedNews: News from the European PCB Industry
02/08/2018 | EIPC
The February 2018 Edition of PCB007 Magazine is Now Available
02/07/2018 | I-Connect007
Rogers Corporation Introduces RO4460G2 Bondply
02/07/2018 | Rogers Corporation
MacDermid and Tanaka Discontinue EEJA Joint Venture
02/06/2018 | MacDermid
I-Connect007 Launches Fundamentals of RF/Microwave PCBs Micro eBook
01/30/2018 | I-Connect007
Isola Courts Engineers with High-Reliability Copper-Clad Laminates at DesignCon
01/30/2018 | Isola Group
MacDermid Enthone Electronics Solutions to Exhibit at 2018 IMAPS Device Packaging Show
01/29/2018 | MacDermid Enthone Electronics Solutions
Ventec International Group Now Trading on Taipei Stock Exchange
01/29/2018 | Ventec International Group
EIPC SpeedNews: News from the European PCB Industry
01/24/2018 | EIPC
Sun Chemical to Exhibit Solutions for Printed Electronics at LOPEC 2018
01/19/2018 | Sun Chemical
PCBCart Exhibits at NEPCON Japan
01/19/2018 | PCBCart
Gardien Group Names Masayuki Komatsu VPin Japan
01/19/2018 | Gardien Group
Rogers to Show Advanced Materials and Latest Research at DesignCon 2018
01/17/2018 | Rogers Corporation

MacDermid Enthone Electronics Solutions to Exhibit and Present Papers at IPC APEX EXPO 2018
01/17/2018 | MacDermid Enthone Electronics Solutions
Ventec Passes AS9100 Revision D Transition Audit in China and UK
01/17/2018 | Ventec International Group
EIPC SpeedNews: News from the European PCB Industry
01/16/2018 | EIPC
Rogers to Participate in Needham Growth Conference
01/16/2018 | Rogers Corporation
New Chief Technology Officer Completes Peters Management Board
01/15/2018 | Lackwerke Peters GmbH & Co. KG
The PCB Magazine is Renamed PCB007 Magazine; January 2018 Edition Now Available
01/11/2018 | I-Connect007
3D-Printed Electronics Innovator Nano Dimension Joins Techniplas Open Innovation Program
01/11/2018 | PRNewswire
Ventec's Thomas Michels Elected to EIPC Board of Directors
01/11/2018 | Ventec International Group
Prototron Circuits Chooses Frontline’s InSight PCB Pre-Cam Solution
01/10/2018 | Orbotech
MacDermid and Hitachi-Chemical Begin Dry Film Slitting Operations in Wantage, UK Facility
01/09/2018 | MacDermid Enthone Electronics Solutions
ITEQ to Set Up New CCL Factory in China
01/08/2018 | Digitimes
Ventec Highlights Advanced Ultra-Low Dk PCB Materials at DesignCon 2018
01/08/2018 | Ventec International
TUC Breaks Ground for New Advanced Technology Center
01/07/2018 | TUC
Ucamco Releases Integr8tor v2017.12
01/05/2018 | Ucamco
Orbotech Appoints Alon Rozner New Chief Financial Officer
01/04/2018 | Orbotech
Isola Group Transfers Ownership to Investment Group Led by Cerberus Capital Management
01/04/2018 | PRNewswire
Top 10 Most-Read PCB Articles of 2017
12/29/2017 | I-Connect007
Top 10 Most-Read PCB News of 2017
12/29/2017 | I-Connect007
Orbotech Presented Ultra Dimension Series at HKPCA 2017
12/28/2017 | Orbotech
The World’s Leading Digital Tech Companies Under One Roof
12/28/2017 | Reed Exhibitions
Orbotech Wins Most Successful Business Accomplishment of the Year Award
12/27/2017 | Orbotech
Top 5 Vendors in PCB Inspection Equipment Market in APAC
12/27/2017 | Technavio
TUC Announces Plant Expansion and Financial Report
12/26/2017 | TUC
IBM Selects Panasonic’s MEGTRON 6 Laminate System
12/22/2017 | Matrix USA Inc.
Molex Acquires Assets of Triton Manufacturing Company
12/21/2017 | Business Wire
Atotech Celebrates the Sale of 888th Electrolytic Copper Plater
12/20/2017 | Atotech
Insulectro Appoints Industry Veteran Benoit Pouliquen to Advisory Board
12/20/2017 | Insulectro
EIPC SpeedNews: News from the European PCB Industry
12/19/2017 | EIPC
LaserVia Sells Intellectual Property Portfolio
12/19/2017 | LaserVia Corporation
MacDermid Enthone to Co-Exhibit with Alpha Assembly Solutions at NEPCON Japan 2018
12/18/2017 | MacDermid Enthone Electronics Solutions

All Flex Introduces Automated Online System for Custom Flat Flex Cables
12/18/2017 | All Flex
Panasonic and Matrix Complete Outgassing Tests for Flex Materials
12/15/2017 | Panasonic Corporation
Ventec International Launches Latest Mobile tec-APP
12/14/2017 | Ventec International Group
Würth Elektronik and FELA Collaborate on PCB Technology Digitization
12/13/2017 | Würth Elektronik
Excellon Acquires NC Service Technology
12/12/2017 | Excellon
December Edition of The PCB Magazine is Now Available
12/12/2017 | I-Connect007
aveni Extends Copper Interconnects to 5nm and Below
12/12/2017 | Globe Newswire
Electronic Circuit Board Level Underfill Material Market Report
12/08/2017 | PRNewswire
Compugraphics Awarded ‘Manufacturing Supplier of 2017’ by Techworks Group
12/07/2017 | MacDermid Enthone Electronics Solutions
Ucamco Upgrades Gerber Format Specification Manual
12/06/2017 | Ucamco
Orbotech Inks Order from Career Technology for Pattern and Solder Mask DI Solutions
12/05/2017 | Orbotech
Taiyo America Appoints Tadahiro Miyoshi as Product Development Manager
12/05/2017 | Taiyo America
ESI Selects Allen Muhich To Be Next CFO
12/05/2017 | Globe Newswire
Ventec Proudly Supports 'Skate for the 22' Foundation
12/04/2017 | Ventec
EIPC SpeedNews: News from the European PCB Industry
12/04/2017 | EIPC
I-Connect007 Survey on New Equipment and Technologies
11/29/2017 | I-Connect007
ANCA Launches FCP4 High-Production Drill Grinder
11/29/2017 | ANCA
Nordson MARCH Launches New-Gen RollVIA Plasma System for R2R PCB Manufacturing
11/29/2017 | Nordson MARCH
EIPC SpeedNews: News from the European PCB Industry
11/28/2017 | EIPC
Heraeus Electronics and Mozaik Technology Ventures Sign Global Licensing Agreement for Photoimageable Thick Film Technologies
11/28/2017 | Heraeus
atg Luther & Maelzer to exhibit at HKPCA & IPC Show 2017
11/23/2017 | atg Luther & Maelzer
Microtek Laboratories China Completes First IPC-4101E Validation Services Test Program
11/22/2017 | Microtek Laboratories China
Ucamco Releases UcamX v2017.10
11/22/2017 | Ucamco
NI AWR Software Featured in Booth Demos, Tech Seminar at MWE 2017
11/20/2017 | National Instruments
Bowman Hosts International XRF Event
11/20/2017 | Bowman
Destiney Eads Joins Taiyo America as Staff Accountant
11/20/2017 | Taiyo America
FTG Circuits Invests in Additional Orbotech DI and AOI Solutions
11/20/2017 | Orbotech
I-Connect007 Launches The Printed Circuit Designer’s Guide to… Power Integrity by Example Micro eBook
11/15/2017 | I-Connect007
Uyemura CEO Honored for Service, Contributions
11/15/2017 | Uyemura
Elmatica: KwickFit Implements CircuitData to their PCB Panel Layout Optimizer
11/14/2017 | Elmatica

Orbotech Gets $31M Worth of Orders from Leading Japanese Electronics Components Manufacturer
11/14/2017 | Orbotech
Insulectro Leverages One Source Distribution for Printed Electronic Materials at IDTechEx Show
11/13/2017 | Insulectro
Protecno Becomes the First French PCB Manufacturer to Invest in Orbotech’s Nuvogo Direct Imaging Solution
11/13/2017 | Orbotech
IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group
11/13/2017 | Ventec International Group
MacDermid's Metallization Fills Microvias, Plates Through-Holes in One Step
11/10/2017 | MacDermid Enthone Electronics Solutions
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