PCB :: Materials

Latest News

Atotech Launches New Horizontal Bonding Enhancement Solution for HF Applications
New Today | Atotech
Rogers to Showcase Advanced Circuit Materials at the Del Mar Electronic & Manufacturing Show
04/23/2018 | Rogers Corporation
EIPC SpeedNews: News from the European PCB Industry
04/23/2018 | EIPC
Atotech to Demo Flex/Flex-Rigid Products at KPCA 2018
04/23/2018 | Atotech
ITEQ Wins Outstanding Delta L Characterization Award from Dell EMC
04/20/2018 | ITEQ Corporation
Rogers Schedules Q1 2018 Earnings Call
04/20/2018 | Rogers Corporation
Hitachi Chemical to Build New Factory in Taiwan to Manufacture Laminate Materials for PWB
04/18/2018 | Hitachi Chemical Co., Ltd.
FCCL Maker Taiflex 1Q18 Net Profits Down Nearly 40%
04/18/2018 | Digitimes
Matrix Reports Success of Next-Gen Dry Film Laminator
04/09/2018 | Matrix USA Inc.
Rogers Introduces New Laminates for Base Station Antenna Applications
04/04/2018 | Rogers Corporation
Rogers Launches Low-Loss Laminates, Bonding Materials, and Foils
03/28/2018 | Rogers Corporation
Rogers Unveils New Process Improvement Option for Flex Heater Dielectrics
03/27/2018 | Rogers Corporation
Microtek Laboratories China Completes First USA IPC-4101E Validation Services Test Program
03/26/2018 | Microtek Laboratories China
IPC APEX EXPO Boosts Uyemura's ENIG/ENEPIG Development
03/26/2018 | Uyemura
Atotech Launches Pre Dip for Fine-Line Applications
03/21/2018 | Atotech
Arlon Electronic Materials Receives IPC-4101 QPL for Polyimide Spec Sheets
03/16/2018 | IPC
Matrix Electronics Reports Successful IPC APEX EXPO 2018 Show
03/14/2018 | Matrix USA Inc.
IPC Issues Call for Participation for IPC APEX EXPO 2019
03/14/2018 | IPC
Panasonic Revises Pricing for Copper Clad Laminates, Prepregs
03/12/2018 | Panasonic Corporation
Insulectro Hires Jason Shuppert as Director of Supply Chain
03/09/2018 | Insulectro
NPL to Hold Webinar on Reliability and Fitness for Purpose Testing of Flexible and Wearable Electronics
03/08/2018 | National Physical Laboratory
Linda Woody, Stephen Tisdale Earn Dieter Bergman IPC Fellowship Awards
03/07/2018 | IPC
Rogers Reports 2017 Net Sales of $821 Million, Up 25.1%
02/28/2018 | Rogers Corporation
Matrix to Exhibit at IPC APEX EXPO 2018
02/23/2018 | Matrix USA Inc.
Insulectro Energizes Booth at IPC APEX EXPO with Power Chats
02/22/2018 | Insulectro
Rigiflex Technology Purchases DI System from Technica USA
02/22/2018 | Technica USA
Uyemura Introduces TWX-40 Mixed Reaction Autocatalytic Gold
02/21/2018 | Uyemura
Rogers to Showcase Power Electronics Materials at APEC 2018
02/21/2018 | Rogers Corporation
Insulectro and Isola Share Materials Super Booth at IPC APEX EXPO
02/21/2018 | Insulectro
Rogers Schedules Q4 & Full Year 2017 Earnings Call for February 27
02/21/2018 | Rogers Corporation


Rogers to Showcase Advanced Materials at IPC APEX EXPO 2018
02/20/2018 | Rogers Corporation
Power Integrity by Example eBook Available for Download
02/19/2018 | I-Connect007
RBP Webcast Tackles Printed Wiring Board Defect Troubleshooting
02/19/2018 | RBP Chemical Technology
IPC Releases IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide
02/19/2018 | IPC
Orbotech Reports Q4 and Full Year 2017 Results
02/16/2018 | Orbotech
EIPC SpeedNews: News from the European PCB Industry
02/15/2018 | EIPC
Insulectro to Recruit Superstar Talent at IPC APEX EXPO 2018
02/14/2018 | Insulectro
I-Connect007 Launches Thermal Management with Insulated Metal Substrates eBook
02/13/2018 | I-Connect007
Ventec to Demo New Thermal Management Solutions, Laminates at IPC APEX EXPO 2018
02/12/2018 | Ventec
Aismalibar North America to Exhibit at Strategies in Light
02/12/2018 | Aismalibar
Best Technical Paper at IPC APEX EXPO 2018 Selected
02/12/2018 | IPC
EIPC SpeedNews: News from the European PCB Industry
02/08/2018 | EIPC
Rogers Corporation Introduces RO4460G2 Bondply
02/07/2018 | Rogers Corporation
I-Connect007 Launches Fundamentals of RF/Microwave PCBs Micro eBook
01/30/2018 | I-Connect007
Isola Courts Engineers with High-Reliability Copper-Clad Laminates at DesignCon
01/30/2018 | Isola Group
Ventec International Group Now Trading on Taipei Stock Exchange
01/29/2018 | Ventec International Group
EIPC SpeedNews: News from the European PCB Industry
01/24/2018 | EIPC
EMC & Technica to Introduce New Ultra High Speed Materials at DesignCon 2018
01/22/2018 | Technica USA
Sun Chemical to Exhibit Solutions for Printed Electronics at LOPEC 2018
01/19/2018 | Sun Chemical
PCBCart Exhibits at NEPCON Japan
01/19/2018 | PCBCart
Rogers to Show Advanced Materials and Latest Research at DesignCon 2018
01/17/2018 | Rogers Corporation
MacDermid Enthone Electronics Solutions to Exhibit and Present Papers at IPC APEX EXPO 2018
01/17/2018 | MacDermid Enthone Electronics Solutions
Ventec Passes AS9100 Revision D Transition Audit in China and UK
01/17/2018 | Ventec International Group
EIPC SpeedNews: News from the European PCB Industry
01/16/2018 | EIPC
Rogers to Participate in Needham Growth Conference
01/16/2018 | Rogers Corporation
Ventec's Thomas Michels Elected to EIPC Board of Directors
01/11/2018 | Ventec International Group
IPC Committee Revises DSC Test Method for Tg
01/09/2018 | IPC
ITEQ to Set Up New CCL Factory in China
01/08/2018 | Digitimes
Ventec Highlights Advanced Ultra-Low Dk PCB Materials at DesignCon 2018
01/08/2018 | Ventec International
TUC Breaks Ground for New Advanced Technology Center
01/07/2018 | TUC


Isola Group Transfers Ownership to Investment Group Led by Cerberus Capital Management
01/04/2018 | PRNewswire
Top 10 Most-Read PCB Columns of 2017
12/29/2017 | I-Connect007
Top 10 Most-Read PCB Articles of 2017
12/29/2017 | I-Connect007
Top 10 Most-Read PCB News of 2017
12/29/2017 | I-Connect007
TUC Announces Plant Expansion and Financial Report
12/26/2017 | TUC
IBM Selects Panasonic’s MEGTRON 6 Laminate System
12/22/2017 | Matrix USA Inc.
Molex Acquires Assets of Triton Manufacturing Company
12/21/2017 | Business Wire
Atotech Celebrates the Sale of 888th Electrolytic Copper Plater
12/20/2017 | Atotech
EIPC SpeedNews: News from the European PCB Industry
12/19/2017 | EIPC
MacDermid Enthone to Co-Exhibit with Alpha Assembly Solutions at NEPCON Japan 2018
12/18/2017 | MacDermid Enthone Electronics Solutions
All Flex Introduces Automated Online System for Custom Flat Flex Cables
12/18/2017 | All Flex
Panasonic and Matrix Complete Outgassing Tests for Flex Materials
12/15/2017 | Panasonic Corporation
Ventec International Launches Latest Mobile tec-APP
12/14/2017 | Ventec International Group
Würth Elektronik and FELA Collaborate on PCB Technology Digitization
12/13/2017 | Würth Elektronik
aveni Extends Copper Interconnects to 5nm and Below
12/12/2017 | Globe Newswire
Electronic Circuit Board Level Underfill Material Market Report
12/08/2017 | PRNewswire
EIPC SpeedNews: News from the European PCB Industry
12/04/2017 | EIPC
Nordson MARCH Launches New-Gen RollVIA Plasma System for R2R PCB Manufacturing
11/29/2017 | Nordson MARCH
I-Connect007 Launches The Printed Circuit Designer’s Guide to… Power Integrity by Example Micro eBook
11/15/2017 | I-Connect007
Insulectro Leverages One Source Distribution for Printed Electronic Materials at IDTechEx Show
11/13/2017 | Insulectro
IPC Awards IPC-4101 Qualified Products Listing to Ventec International Group
11/13/2017 | Ventec International Group
MacDermid's Metallization Fills Microvias, Plates Through-Holes in One Step
11/10/2017 | MacDermid Enthone Electronics Solutions
Sun Chemical to Exhibit at IDTechEx Printed Electronics USA 2017
11/10/2017 | Sun Chemical
Aismalibar to Present Fastherm at productronica 2017
11/09/2017 | Aismalibar
Rogers to Participate in Baird Global Industrial Conference
11/08/2017 | Rogers Corporation
Rogers Reports Record Net Sales of $206.8 Million in Q3, Up 25.1%
11/07/2017 | Rogers Corporation
Matrix USA Introduces New Electrostatic Panel Cleaner
11/06/2017 | Matrix USA Inc.
EIPC SpeedNews: News from the European PCB Industry
11/01/2017 | EIPC
Elmatica Expects Copper Foil Shortage to Last Longer
11/01/2017 | Elmatica
Ventec to Showcase Thermal Management and Latest Laminate Solutions at productronica
10/30/2017 | Ventec International Group


Z-zero Launches Z-Planner and Field Solver Sandbox
10/25/2017 | Z-zero
2017 HKPCA & IPC Show to Feature New Highlights and Lots of Innovations
10/25/2017 | HKPCA & IPC
ESA Approval for Ventec Material in Amphenol Invotec Rigid & Flex-Rigid Production
10/23/2017 | Ventec International
Electra Polymers to Exhibit Soldermask for the Digital Era at productronica
10/18/2017 | Electra Polymers Ltd
TUC Receives IPC-4101E Validation Services QPL Certification
10/17/2017 | TUC
MacDermid Enthone Electronics Solutions to Exhibit at productronica 2017
10/12/2017 | MacDermid Enthone Electronics Solutions
Sun Chemical Enters into License Agreement to Introduce New Screen Printable Molecular Inks
10/12/2017 | Sun Chemical
FCCL Maker Taiflex Reports 32% Growth in 3Q2017 Revenues
10/11/2017 | TAIFLEX Scientific Co. Ltd
CAC, Inc. Announces the Acquisition of ABC Assets from Oak Mitsui
10/06/2017 | CAC, Inc.
'Global Wisdom. Local Presence' Theme of HKPCA & IPC Show 2017
10/02/2017 | HKPCA & IPC
COO of Elmatica Takes on Broadened Mandate
09/29/2017 | Elmatica
Abstracts Sought for IPC APEX EXPO 2018 in San Diego
09/28/2017 | IPC
MacDermid Enthone to Exhibit and Present at Taiwan Printed Circuit Association Show 2017
09/28/2017 | MacDermid Enthone Electronics Solutions
Ventec's Thermal Management Material Driving Today's Automotive Lighting Technology
09/28/2017 | Ventec International Group
FLEXcon Expands THERMLfilm HT Product Line
09/27/2017 | Business Wire
Insulectro Names Andrew Eskander Field Application Engineer for Southwest
09/27/2017 | Insulectro
EIPC SpeedNews: News from the European PCB Industry
09/26/2017 | EIPC
AISMALIBAR to Present FASTHERM at Ford Advanced Lighting Innovation Expo 2017
09/25/2017 | Aismalibar
Insulectro Inks Deal to Distribute Dupont Electronic Inks for In-Mold Applications
09/20/2017 | Insulectro
EU Commission Launches Stakeholder Consultation on RoHS Exemptions
09/20/2017 | IPC
Technic Releases TechniFlex LCL1000F/423M
09/20/2017 | Technic
Gardien Services USA Announces Tiger AVI Machine for Demonstration
09/15/2017 | Gardien Services USA
Atotech Presents New Processes at SMTA International
09/14/2017 | Atotech
MacDermid Enthone Electronics Solutions Launches MacuSpec AVF 700 Process
09/14/2017 | MacDermid Enthone Electronics Solutions
TUC Gains IPC-4101E Validation Services QPL certification for additional Products to Specification Sheet 130
09/13/2017 | TUC
EIPC SpeedNews: News from the European PCB Industry
09/12/2017 | EIPC
Insulectro Advances Signal Integrity Product Arsenal at PCB West
09/11/2017 | Insulectro
Isola Group Names Industry Veteran Sean Mirshafiei Global VP of Marketing
09/11/2017 | Isola Group
Isola Exhibits High-Reliability Copper-Clad Laminates at PCB West
09/11/2017 | Isola Group
John Pardini Named Global Account Manager for IMS Materials at Ventec International
09/11/2017 | Ventec International


Faraday Achieves 30 Years and Going Strong
09/08/2017 | Faraday
MacDermid Enthone Electronics Solutions to Present Three Papers at SMTAI
09/08/2017 | MacDermid Enthone Electronics Solutions
Rogers to Participate in Drexel Hamilton TMT Conference
09/06/2017 | Rogers Corporation
EIPC SpeedNews: News from the European PCB Industry
09/04/2017 | EIPC
Rogers Brings Latest Circuit Materials & Material Design Insights to EDI CON USA 2017
09/01/2017 | Rogers Corporation
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