PCB :: Materials

Latest News

Park Electrochemical Introduces M-Ply, the Newest Member of the Meteorwave Family
06/22/2017 | Park Electrochemical
SelectConnect Technologies Offers White Paper on Sensor Manufacturing Using LDS
06/19/2017 | SelectConnect Technologies
Rogers to Host Investor Day August 17
06/16/2017 | Business Wire
Sun Chemical to Present Its Full Range of Advanced Materials at 2017 FLEX
06/15/2017 | Sun Chemical
Shengyi Technology Obtains UL Listing for FR-4 Grade S1190M
06/15/2017 | Shengyi Technology
Stretchable Electronics: Near-Term Commercial Success Stories
06/13/2017 | IDTechEx
Ventec International Expands UK Clean-Room Manufacturing Capacity
06/13/2017 | Ventec USA
Orbotech at JPCA 2017: Innovative Production Solutions for mSAP, Advanced HDI and Flex
06/09/2017 | Orbotech
FCCL Maker Taiflex Records Slight Increase in May Revenue
06/08/2017 | TAIFLEX Scientific Co. Ltd
UL-Certification for Ventec’s IMS Products Extended to Alternative Copper-Base Options
06/07/2017 | Ventec
MacDermid Enthone to Exhibit at JPCA
06/06/2017 | MacDermid Enthone Electronics Solutions
Shengyi Technology Approved as Authorized Lab by UL
06/05/2017 | Shengyi Technology Co.
Isola Exhibits RF/Microwave Laminates at International Microwave Symposium (IMS) in Honolulu
06/01/2017 | Isola
Intrinsiq Materials and NovaCentrix Unveil Ultra-Thin Printed Copper-Clad Polyimide using Photonic Sintering for HDI Applications
05/31/2017 | Intrinsiq Materials Inc.
Engineers Develop Innovative Direct Patterning Plating Technology
05/31/2017 | ACN Newswire
Rogers Launches HeatSORB Thermal Management Material
05/30/2017 | Rogers Corporation
Uyemura Expands US Pacific Rim Service Capacity
05/24/2017 | Uyemura
Ventec International’s Thomas Michels to Speak at the EIPC Summer Conference
05/23/2017 | Ventec International Group
I-Connect007 Launches ‘The Printed Circuit Designer’s Guide to…Secrets of High-Speed PCBs – Part 2’ Micro eBook
05/18/2017 | I-Connect007
Shengyi Technology Earns UL Listing for FR-4 with RTI of 150°C
05/18/2017 | Shengyi Technology Co.
IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands
05/17/2017 | IPC
Rogers to Exhibit High Performance Circuit Materials at IMS 2017
05/17/2017 | Rogers Corporation
Eltek Reports Revenues of $8.5 Million in Q1 2017
05/17/2017 | PRNewswire
Microtek Laboratories China Completes First IPC-4101D Validation Services Test Program Worldwide
05/17/2017 | Microtek Laboratories China
Creative Materials to Display at 2017 FLEX
05/16/2017 | Creative Materials, Inc.
Coast to Coast Circuits to Exhibit at IMS Show in Hawaii June 6-8
05/16/2017 | Coast to Coast Circuits
Panasonic Announces Price Revisions for Copper Clad Laminates, Prepregs, and Mass Laminations
05/16/2017 | Panasonic Corporation
Taiwan Union Technology Receives First IPC-4101 QPL Certification
05/15/2017 | IPC
NCAB Group USA to Hold PCB Technology Open House in Irving, Texas Office
05/10/2017 | NCAB Group
EIPC SpeedNews: News from the European PCB Industry
05/05/2017 | EIPC


MacDermid Enthone Electronics Solutions Releases Affinity ENIG 2.0
05/04/2017 | MacDermid Enthone Electronics Solutions
Mentor FloTHERM XT Release Simulates Complex Geometries Quickly, Accurately
05/03/2017 | Mentor
Sun Chemical to Showcase Technology Portfolio at IDTechEx Printed Electronics Europe 2017
05/03/2017 | Sun Chemical
Aismalibar Increases Production Capacity for FASTHERM Laminates
05/02/2017 | Aismalibar
Advanced Circuits Receives Metro Wastewater Gold Award for the 10th Year
05/01/2017 | Advanced Circuits
Isola Exhibits High-Reliability Copper-Clad Laminates at Del Mar Electronics & Manufacturing Show
05/01/2017 | Isola
CriticalPoint Capital Appoints Brad Foster as President of EMD Specialty Materials (dba Arlon EMD)
05/01/2017 | Arlon EMD
Rogers Introduces Kappa 438 Thermoset Laminates
04/27/2017 | Rogers Corporation
Copper Foil Maker Co-Tech Positive About 2017 Outlook
04/25/2017 | Digitimes
AT&S Tech Enables Evaluation of Fully Integrated GaN-based Multilevel Power Converter
04/25/2017 | AT&S
Insulectro Adds DuPont Pyralux Laminates to the Ready-to-Ship Pumafast Inventory Program
04/25/2017 | Insulectro
Ventec International Appoints Kyle Pattie as Account Manager, Eastern USA
04/24/2017 | Ventec International Group
Copper Foil Maker Co-Tech Reports Increased Profits for Q1 2017
04/21/2017 | Digitimes
Uyemura’s New Board Chemistry Allows Direct Plating on Copper
04/18/2017 | Uyemura
Zero Defects International Introduces Taiyo PCB Inspection System
04/17/2017 | Zero Defects International
Colonial Circuits Adds Second atg Flying Probe Test System
04/13/2017 | atg Luther & Maelzer GmbH
IEC Expands Sales and Service Partnership with ATG
04/10/2017 | IEC
Stevenage Circuits Approves Use of Electra Polymers Direct Image Soldermask
04/10/2017 | Stevenage Circuits
SelectConnect Technologies Publishes White Paper on Laser Direct Structuring
04/05/2017 | SelectConnect Technologies
FCCL Maker Taiflex Reports 13% Growth in March Revenue
04/05/2017 | TAIFLEX Scientific Co. Ltd
SelectConnect Technologies Launches 3Discussions Blog
03/23/2017 | SelectConnect Technologies
MacDermid Enthone to Present 'Copper Filled Thermal Vias for Heat Management' at SMTA Conference
03/23/2017 | MacDermid Enthone Electronics Solutions
CCL Supplier Elite Material Sees Strong Profits in 2016
03/20/2017 | Digitimes
iCD Adds Coplanar Waveguide Planner to iCD Design Integrity Software
03/15/2017 | Barry Olney, In-Circuit Design
FCCL Maker Taiflex Posts 31% Revenue Growth for February
03/13/2017 | TAIFLEX Scientific Co. Ltd
Ventec Launches VT-5A2: Next Generation, Best-in-Class High Tg Thin-Core and Pre-Preg Material
03/13/2017 | Ventec
Ucamco Seeks Comments on Including Fab Documentation in Gerber
03/08/2017 | Karel Tavernier, Ucamco
FCCL Maker Taiflex Sees Earnings Hit 4-year Low in 2016
03/03/2017 | Digitimes
IEC Expands Sales and Service Partnership with Kodak
03/01/2017 | International Electronic Components Inc.
Print Electronics to Use Electra Polymers Direct Image Soldermask for New Direct Imaging Nuvogo 800 System
02/28/2017 | Electra Polymers Ltd


Aismalibar North America to Exhibit at Strategies in Light
02/27/2017 | Aismalibar
Rogers Reports Revenue Growth in 2016 Fourth Quarter and Full Year
02/23/2017 | Rogers Corporation
Cogra Approves Electra Polymers Direct Image Soldermask for New Direct Imaging System
02/20/2017 | Cogra
Cipsa Circuits Approves Electra Polymers Direct Image Soldermask for Orbotech Nuvogo 780
02/13/2017 | Cipsa Circuits
Insulectro Brings Power Chats to Booth at IPC APEX EXPO
02/13/2017 | Insulectro
Arlon EMD and Doosan Electro-Materials BG to Exhibit at IPC APEX EXPO 2017
02/08/2017 | Arlon EMD
Aismalibar Increases Production Capacity for Flextherm Conformable IMS Laminates
02/08/2017 | Aismalibar
Insulectro and Isola Combine Exhibits to Create Materials Super Booth at IPC APEX
02/08/2017 | Insulectro
Insulectro Announces Pumafast Inventory Program to Ensure In-Stock Deliveries
02/08/2017 | Insulectro
MacDermid Enthone Electronics Solutions Releases M-Copper EF Process
02/07/2017 | MacDermid Enthone Electronics Solutions
EIPC SpeedNews: News from the European PCB Industry
02/07/2017 | EIPC
PD18 : Preventing Production Defects and Product Failures
02/07/2017 | IPC
Sun Chemical to Introduce Newest Addition to Imagecure Soldermask Product Family at IPC APEX
02/07/2017 | Sun Chemical
Insulectro Purchases 38,000 Square Foot Distribution Center in San Jose
02/07/2017 | Insulectro
Saturn Electronics Installs New Micronic Drill Machine
02/06/2017 | Saturn Electronics Corporation
Aerospace Supplier Quality System Certification (AS9100 Rev C) Audit Success at Ventec's UK Facility
02/06/2017 | Ventec
Arlon EMD Expands Distribution with AMS Products
02/03/2017 | Arlon EMD
IPC Designer’s Council–Orange County Chapter to Hold Lunch 'n Learn Meeting
02/01/2017 | IPC Designers Council, Orange Co. Chapter
Innovative Circuits has Immediate Success with Hakuto Mach 6630NP Dry Film Laminator from Matrix Electronics
02/01/2017 | Innovative Circuits, Inc.
EMC and Technica USA to Present Full Line of EMC Materials at DesignCon 2017
01/31/2017 | Technica USA
Rogers to Showcase Advanced Connectivity Material Solutions at IPC APEX EXPO 2017
01/30/2017 | Rogers Corporation
Lunch ‘n Learn Meeting of the IPC Designers Council OC Chapter
01/30/2017 | Scott McCurdy, Freedom CAD Services
Ventec International Expands USA Manufacturing Capacity With Investment in New Equipment
01/30/2017 | Ventec
DIC Forms Capital and Business Alliance with Taiyo Holdings
01/27/2017 | DIC Corp.
Royal Circuits Invests in Additional HASL Machines from New Technology Overman
01/25/2017 | Royal Circuit Solutions
New Perspectives for Ucamco’s Integr8tor
01/23/2017 | Ucamco
Matrix USA to Display Full Product Line at IPC APEX 2017
01/23/2017 | Matrix USA Inc.
EIPC SpeedNews: News from the European PCB Industry
01/20/2017 | EIPC
New Vehicles using Aismalibar Materials on Display at the North American International Auto Show
01/19/2017 | Aismalibar
Ventec to Showcase Innovations in PCB Materials for High-Speed/Low-Loss Applications at APEX 2017
01/17/2017 | Ventec International Group


Panasonic Commercializes Low Transmission Loss Flexible Multi-layer Circuit Board Materials
01/17/2017 | Panasonic Corporation
Rogers to Exhibit its Advanced Circuit and Thermal Management Materials at DesignCon 2017
01/16/2017 | Rogers Corporation
Global PCB & Laminate Industries Outlook 2017
01/16/2017 | BPA
Matrix USA to Display New Hakuto 630NP Series Dry Film Laminator at IPC APEX 2017
01/16/2017 | Matrix USA Inc.
Advanced Copper Foil Secures a Non-Provisional Patent for New Product: Poly-Supported Copper Foil
01/13/2017 | Advanced Copper Foil
Panasonic Commercializes High Heat Resistance Circuit Board Material for Automotive Use
01/11/2017 | Panasonic Corporation
Ventec’s Martin Cotton to Showcase Ultra-Low Dk PCB Materials for High-Speed Low-Loss Applications at DesignCon 2017
01/10/2017 | Ventec International Group
Isola Signs Distribution Agreement with Tech Knowledge
01/09/2017 | Isola
Top 10 Most-read PCB Articles of 2016
01/03/2017 | I-Connect007
MacDermid Enthone Electronics Solutions to Present Papers at IPC APEX EXPO 2017
12/21/2016 | MacDermid Enthone Electronics Solutions
Doosan Electro-Materials BG Signs Distribution Agreement with Arlon EMD
12/21/2016 | Arlon EMD
PV Nano Cell to Begin Trading Today on the OTCQB Market
12/16/2016 | PRNewswire
AT&S to Present Latest Technologies and Products at Nepcon 2017
12/16/2016 | AT&S
EIPC to Address Raw Material Price Hikes at Winter Conference
12/14/2016 | EIPC
Rogers Launches Laminates for Automotive Radar Sensor Applications
12/12/2016 | Rogers Corporation
2016 International Printed Circuit & APEX South China Fair
12/09/2016 | HKPCA
Atotech Launches ST-Line
12/08/2016 | Atotech
Global PCB & Laminate Industries Outlook 2017
12/06/2016 | BPA
EIPC SpeedNews: News from the European PCB Industry
12/02/2016 | EIPC
Ventec International Group to Focus on High Thermal Performance Materials for Automotive/LED at HKPCA
11/29/2016 | Ventec International Group
PCB Makers Hike Prices Due to Increased CCL Cost
11/22/2016 | Digitimes
CCL Maker Elite Material Reports Net Profit of $26M for 3Q 2016
11/21/2016 | Digitimes
HKPCA & IPC Show to Spotlight Automotive Electronics
11/16/2016 | HKPCA
EIPC SpeedNews: News from the European PCB Industry
11/16/2016 | EIPC
Molex Showcases Soligie Circuits and Sensors at Printed Electronics USA 2016
11/16/2016 | Business Wire
Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs
11/16/2016 | IPC
HDP User Group Launches New High Frequency Measurement Project
11/15/2016 | PRWEB
Ventec International Names Chris Bowles Technical Account Manager, USA
11/15/2016 | Ventec International Group
Insulectro Displays Komodo Medical Sleeve at IDTechEx Show
11/15/2016 | Insulectro
From the CEO: Rogers Announces Q3 2016 Financials
11/14/2016 | Rogers Corporation


IPC Standards Committee Reports – Printed Board Design, Testing, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
11/14/2016 | IPC
Insulectro Leverages One Source Distribution for Printed Electronic Materials at IDTechEx
11/14/2016 | Insulectro
MacDermid Performance Solutions Businesses Collaborate on PEC Solutions
11/11/2016 | MacDermid Performance Solutions
Rogers Reports Sales of $165.3 Million in Q3
11/09/2016 | Rogers Corporation
Ventec Secures Exclusive UK Distribution Rights for Advanced Copper Foil Inc. Copper-Aluminium Foil Products
11/08/2016 | Ventec International Group
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