Latest News

IPC Issues Call for Participation for IPC APEX EXPO 2021
Bigger, Better Wurth Electronics UK
Advanced Circuits Celebrates Grand Opening of State-of-the-Art Facility in Chandler
Taiyo America Announces New European Sales Manager
Electronics Industry Elevates its Excellence at IPC APEX EXPO 2020
IPTE to Equip “Future Packaging” at SMTconnect 2020
J. Christopher Moran Executive Director at Lockheed Martin Joins Nano Dimension’s Board of Directors
NextFlex Honored with FLEXI Award for its FlexPro Professional Development Education Program
SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid Electronics
PCB West 2020 Exhibition Floor Sold Out for 9th Year in a Row
TTM Technologies, Inc. Opens Advanced Technology Center in Chippewa Falls, Wisconsin
International Electronic Circuits Exhibition (Shanghai) 2020 Postponed
Coronavirus Expected to Cause Five-Week Product Shipment Delays, Says Electronics Manufacturing Industry
Nira Poran, International Technology Executive & Legal Counsel, Joins Nano Dimension’s Board of Directors
Altium Accelerates IoT and AI Hardware Development through Geppetto and Seeed Collaboration
Elmatica CEO Approved Member of the Swedish Cyber Defense and Export Control Groups
Mike Casper Appointed Group Applications Engineer at TAKAYA
February 2020 Issue of PCB007 Magazine Available Now
Atotech to present at the iMAPS Device Packaging Conference in Fountain Hills, Arizona USA
EnviroLeach Announces Positive Production-Level Testing for Jabil at its Vancouver Facility
Ucamco Helps Customers Dealing With Temporary Production Peaks
Rogers Corporation Reports Fourth Quarter and Full Year 2019 Results
Nano Dimension Moves its Main Commercial Activity to USA
TTM Technologies, Inc. Receives Corporate Recognition Award from IPC
iNEMI Webinar to Share Results of Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project
I-Connect007 Publishes Third Annual Show & Tell Magazine All About IPC APEX EXPO 2020
Flexible Printed Circuit Boards Market—2026: Industry Growth, Opportunities, Applications, Trends and Revenue Strategies
Uyemura Appoints Midwest Sales Manager
American Standard Now Offers Book Binder Rigid-Flex Printed Circuit Boards
LPKF Presents Equipment at Embedded World 2020
Volunteers Honored for Contributions to IPC and the Electronics Industry at IPC APEX EXPO 2020
Sunstone Circuits Now Offering ITAR on Limited Review PCBs
IPC Calls for Participation in Electronics Materials Forum
Notice of Postponement: NEPCON China 2020
Four Industry Rising Stars Recognized at IPC APEX EXPO 2020
Sign up for EMA Design Automation’s SI/PI Model Extraction Webinar
February Issue of Design007 Magazine Available Now
Nano Dimension Announces 77% Exercise of Over-Allotment Option
15th ECWC Call for Papers: "Bridging Technology Sharing Innovation"
Three Long-time IPC Volunteers Receive Dieter Bergman IPC Fellowship Award
IPC Honors TTM Technologies, Inc. and Continental Automotive with Corporate Recognition Awards
Nano Dimension Announces Closing of $3.5 Million Public Offering
Würth Elektronik Circuit Board Technology Successfully Completes Research Project on Intelligent Arm-hand Orthosis
TTM Technologies, Inc. Reports Fiscal Fourth Quarter and 2019 Results
PV Nano Cell Successfully Prints Inside VIA for High-Demanding Application
IPC APEX EXPO 2020: STEM Student Outreach Program a Success
PCB Connect Open New Office in United Kingdom
IPC Elects New Officers and Members to IPC Board
Hitachi High-Tech Analytical Science Launches New FT160 XRF Coatings Analyzer
Ventec Appoints Leigh Allinson as Technical Sales Manager, UK
CCN Acquires Introbotix
DuPont and SCHMID Announce Partnership for New PCB Plating Applications
Firan Technology Group Corporation Announces Full Year and Fourth Quarter 2019 Earnings
DuPont Introduces New Pyralux and Riston Products
Bowman XRF Appoints Sales Manager for North America
Lenthor Engineering Announces Year End 2019 Financial Results
Insulectro, Isola, EMD and DuPont Set to Engage IPC Attendees With Powerful Power Chats
Submit Your Abstract for IPC Electronics Materials Forum
Notice of Postponement—2020 International Electronic Circuits (Shanghai) Exhibition
North American PCB Industry Sales Growth Ends 2019 Up 7.8% for December 2019
RBP Chemical Technology Announces New President
Matt Kelly Joins IPC as Chief Technologist
Call for Participation for IPC E-TEXTILES 2020
Averatek Announces A-SAP License Agreement with American Standard Circuits
Gatema Buys a German High-Tech Manufacturer of Printed Circuit Boards
Aismalibar North America to Exhibit at Strategies in Light
Promex Industries to Showcase Heterogeneous Integration Expertise for Medical Devices at IMAPS Workshop for Advanced Packaging of Medical Microelectronics
Six IPC APEX EXPO Exhibiting Companies Earn 2020 Innovation Awards
Insulectro Focuses on New Design and Education Services During DesignCon
atg Luther & Maelzer to Exhibit at IPC APEX 2020
Isola Courts Engineers With Its High-Reliability Laminates at DesignCon
A Wearable Gas Sensor For Health And Environmental Monitoring
DuPont Interconnect Solutions Expands Insulectro’s Role in North America
TTM Technologies, Inc. to Sell Four China Manufacturing Plants Comprising Its Mobility Business Unit
Averatek Announces A-SAP License Agreement With Calumet Electronics
Atotech to Participate in IPC APEX EXPO 2020
Toyochem Develops Highly Flexible EMI Shielding Film for High-speed FPCs
I-007e Micro Webinars Releases Part 2 in ‘Coatings Uncoated!’ Series
FDA Approves Medtronic Micra AV, World’s Smallest Pacemaker
Zentech Manufacturing Acquires Trilogy Circuits
January 2020 PCB007 Magazine Available Now
Rogers Corporation to Highlight Next Generation Innovative Materials at IPC APEX EXPO 2020
AT&S Now in the Top League of Aircraft Suppliers
Best Technical Papers at IPC APEX EXPO 2020 Selected
Ventec’s High-Speed/Low-Loss/High-Frequency Material Technology Takes Center Stage at U.S. Expos
Averatek Releases New High-Density Process Details at IPC APEX EXPO 2020
UP Media Group Issues Call for Abstracts for PCB West 2020
Hitachi Chemical DuPont MicroSystems, Ltd.: Regarding the Decision to Maintain Two Japanese Granted Patents on Polyimide Precursor Resin Composition
Firan Technology Group Corporation (“FTG”) Achieves AS9100D Certification at FTG Fredericksburg
IPC Statement on U.S.-China Trade Deal
Ucamco Releases New Gerber Fabrication Documentation Specification
SAAB Avionics Has Approved Elmatica's Jan Pedersen as Part 21 Subpart G Auditor for PCB Subcontractors
MoDeCH Launches SPICE Model E-commerce Website
Amid Trade Row With Japan, South Korea Gains DuPont Investment to Make Chip Materials
Rogers to Highlight High-speed Laminates and Next-Gen Thin Materials at DesignCon 2020
CIMS VVR – The Revolutionary AOI Verification Concept
NextFlex Awards Over $12.5 Million in Funding for Flexible Hybrid Electronics Innovations
GS Swiss PCB Invests in New Dynachem Vacuum and Press Lamination Lines Technology
TTM Technologies, Inc. Announces Upcoming Conference Participation
SCHWEIZER Signs Distribution Agreement with Nagase for Japan
Ventec Builds Global Inventory of High-Speed/Low Loss/High Frequency Materials
Atotech to present at the NEPCON JAPAN 2020 in Tokyo
Uyemura Appoints Technology Director
Mateo’s Smart Bathroom Mat Earns a CES Innovation Award
Technica USA to Distribute Meyer Burger’s Inkjet Soldermask Technology in North America
P2i's New Halogen-Free Barrier Range Will Help OEMs Meet Environmental Targets
Meet Super PCB at IPC APEX EXPO 2020
American Standard Circuits Named a MedTech Top 10 Embedded Solutions Provider for 2020
Register Now for the EIPC Winter Conference Feb. 13-14
Nano Dimension Appoints a New Chairman
Columnist Istvan Novak Nominated for Engineer of the Year
Holiday Message from President of the THPCA
North American PCB Industry Growth Continues Strong
Toray Creates Revolutionary PPS Film for 5G Circuit Boards
Electronics Manufacturers Applaud U.S. House for Passing USMCA with Bipartisan Support
Mitsui Mining & Smelting Co. Ltd. to Sell Copper Foil Division to Nippon Denkai, Ltd.
Atotech Announces Confidential Submission of Draft Registration Statement for Proposed IPO
U.S. Congress to Approve Funds for R&D on Lead-Free Electronics in Aerospace, Defense and High-Performance Applications
Keysight, AAC Technologies Extend Collaboration to Accelerate Market Introduction of High Performance 5G Antenna Solutions
€30 Million Investment: Groundbreaking Ceremony for Technology Upgrade at AT&S Korea
Elmatica Further Expands Technology Department with New Hire
December Issue of PCB007 Magazine Available Now
New Book Highlights Approaches to Ensure Reliability in Your Assembly Process
TopLine to Exhibit at Internepcon Japan January 15-17 2020
PCC Clears Circuit-Maker’s Buyout of Shares in Hitachi PH
PREVIOUSNEXT

• 1
• 2
• 3
• 4
• 5
• 6
• 7
• 8
• 9
• 10
• 11
• 12
• 13
• 14
• 15
• 16
• 17
• 18
• 19
• 20
• 21
• 22
• 23
• 24
• 25
• 26
• 27
• 28
• 29
• 30
• 31
• 32