Review from Dr. Helmut Schweigart, Head of Reliablility & Surfaces, Zestron Europe.
"Readers will learn the advantages and disadvantages of different encapsulation materials and the importance of the application process. In order to find the right balance between benefit and effort, the author suggests using analytical approaches to configure the process and its settings. Additionally, she is always conscious of the need for sustainability when it comes to electronic assemblies."
Review from Gus Becerra, Principal Manufacturing Engineer, Marvell
"As fabrication and manufacturing technologies advance, it is necessary to evolve our methods to analyze and review designs. This book utilizes data-driven concepts in all aspects of the fabrication and assembly processes to improve design capabilities.
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Review from Michael Ford, Senior Director Emerging Industry Strategy, Aegis Software
"This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection."
Review from Mike Cummings, Technical Director, TSI
"What I like about this book is it's not based on fear marketing; rather, it is an honest appraisal of a difficult decision companies have to make toward their product service life, based on the product field data and established and proven test processes."
Review from Steve Williams
"There is something here for everyone. I highly recommend downloading this book right away!"
Review from Duane Benson, Director of Marketing, Screaming Circuits
"I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening up the hood and giving the reader that knowledge of the PC board fab process."
Review from Lambert Schutters, General Manager,
ESCATEC Penang
"We need the right tools to create the best design for the intended purpose. This book is a great introduction and guide on how to approach the process holistically."
Review from Jan Pedersen, Director of Technology, NCAB Group
"The importance of total thermal resistance has been an eye opener for me from being focused on one material’s thermal conductivity to understanding the total thermal behavior of a material stackup."
Review from Binayak Shrestha, Senior Research Engineer at C-DOT
"The most important aspect in the whole design process is getting the stackup correct. This book is one such rare gem which consolidates all the information in one single place!"
Review from Mark Thompson, Engineering Manager, Out of the Box
"I love this book. Particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and Effective Dk. I highly recommend this book for any designer or engineer looking to better understand laminate!"
Review from Joe O'Neil, Principal, OAA Ventures
"The Printed Circuit Assembler’s Guide to Solder Defects is an outstanding summary of the how’s and why’s of paste theory, defect causation and recommended best practices. This short read contains real world advice from the experts. I highly recommend it for anyone involved in the PCB Assembly process."
Review from Lee Ritchey, Founder and President, Speeding Edge
"Author Brad Griffin offers readers a very good explanation of system-level analysis of complex and high-speed electronic designs. I highly recommend this book for those who are getting started with the design of PCBs and systems that are used in data centers."
Review from Happy Holden, Consulting Technical Editor, I-Connect007
"This book provides good education, with examples and explanations to help the reader understand how the smart factory can improve performance and competitiveness."
Review from Dan Beaulieu, President, DB Management Group
"For those who are, shall we say, 'less technical' than others, it’s refreshing—not to mention face-saving, at times—to be able to understand terms like insulated metal-clad PCBs (IMPCBs), metal-clad PCBs (MCPCBs) and mixed-technology PCBs."
Review from Mike Cummings, Technical Director, TSI
"Well-written and easy to follow, this dedicated book focuses on the importance of cleaning and decontamination of electronic circuits before application. This topic is timely and important, considering the increasing importance of high-reliability electronics, security, and safety in an increasingly connected world.
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Review from Farid Anani, VP of Operations, Computrol Inc.
"This book is a must-read for those embarking on their IIoT journey; it provides a very accurate description of preparation requirements and risks to consider and avoid, not just technologically, but also organizationally."
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Review from Kelly Dack, CIT, CID+ PCB Designer, Instructor & Manufacturing Liaison
"This book explains how information embedded in a PCB design layout database can be leveraged to efficiently and dynamically output more accurate PCB design documentation."
Review from John R. Watson, Legrand North America
"At a time when electronics are not just taking small steps but rather large leaps forward, this is an appropriate book for anyone working with PCB design. With countless and ever-changing steps involved in every design, it presents a clear understanding of the process. This book will be the go-to reference for all of our designers at Legrand North America."
Review from Alex Stepinski, vice president, GreenSource Fabrication
"Happy takes a textbook-style approach using easy-to-follow language. He provides step-by-step points for the DIYer, especially for making your own chemistry controllers, while providing examples from his past experiences.
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Review from Dan Beaulieu, president, D.B. Management
"If you are serious about creating the best, most perfect data packages available today, do yourself a favor. Download and read this book. It’s simple—the better the package, the better the board.
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Review from Happy Holden, Consulting Technical Editor, I-Connect007
"I found this book to be very educational and informative. I agree with the authors that there are many advantages to using an LMP solder paste when it comes to improving the assembly and field reliability of complex HDI structures. I was particularly interested in their look at advanced density packaging for PoP and SiP, as these are rising packaging trends."
Review from Alun Morgan, Chairman, EIPC
" A comprehensive tour through the world of thermal management. Required reading for designers and end users wishing to understand the science and practice of using insulated metal substrate materials."
Review from Mark Thompson, customer technical liaison at Prototron Circuits
"From someone who has been on the board fabrication side for over 30 years attempting to explain all these things to customers, I can say this book is a 'must-have' for anyone who wants to make sure they get their product to perform the way they want it to."
Review from Gene Garat, President, Moss Bay EDA
"Engineers new to the field as well as career veterans can all benefit from this quick read, well-illustrated with plenty of examples."
Review from Dr. Helmut Schweigart, Technology Development Head, Zestron Europe.
"This micro eBook offers a comfortable approach to the selection, implementation, and testing of protective coating processes. It would be especially helpful for starters to use as a checklist for operational implementation."
Review from Terry Fox
"I found this to be an excellent tutorial on controlled impedance transmission lines, terminations, crosstalk, differential pair design and PDN noise, and Mentor’s virtual labs take learning to a whole new level!"
Review from Andy Kowaleski
"Martyn's book regarding the 'black art' of signal integrity in printed circuit boards hits the nail right on the head. I found his explanations to be accurate, easy to read and in enough depth to satisfy both beginners and seasoned veterans. All in all, highly recommended. And FREE is a BIG bonus."
Review from Dan Beaulieu
"Joe Fjelstad does a great job of explaining the ins and outs of this process, as well as the numerous prospective advantages and some possible caveats.
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Review from Alex Ippich
"A nice summary of many of the issues that engineers have to work through, without overly complicated formulas and details."
Review from Judy Warner
"Altium's micro eBook on DFM is a brief but jam-packed tool that is destined to become a PCB designer's favorite go-to resource on all aspects of manufacturability "
Review from Dan Beaulieu
"This book is long overdue. Finally, a book on AS9100 certification written in clear and concise language.""