FEATURED NEWS AND INFORMATION:
FEATURED ARTICLES AND COLUMNS:

Catching Up with Allen Keeney of Johns Hopkins University

December 7, 2021 | Dan Beaulieu, D.B. Management Group

I have always been fascinated by research labs, especially those tied to major universities. These are the true leaders of innovation and invention and at the very top of the PCB industry. So, when I met Allen Keeney, chief engineer of the Advanced Electrical Fabrication Group at the Johns Hopkins Applied Physics Laboratory (APL) in Laurel, Maryland, I jumped at the chance to talk with him. You will enjoy this look at another facet of our PCB industry.

Test and Inspection: Far Beyond Opens and Shorts

December 7, 2021 | I-Connect007 Editorial Team

Gardien Vice President Todd Kolmodin talks about test and inspection market drivers from his perspective as a test service provider. Andy Shaughnessy and Happy Holden go down the “microvia rabbit hole” with Todd, as well as explore how OEM design requirements are driving test and inspection functionality and processes. When board layer counts and feature densities force longer test times, the tradeoffs to profitability for manufacturers become time and accuracy. Minimizing time while maximizing accuracy calls for new methods, which Kolmodin explains.





MORE ARTICLES

COLUMNS:

Shall we talk about the epitome of a “woulda, shoulda, coulda” story? This is the real deal. "Built To Fail: The Inside Story of Blockbuster’s Inevitable Bust" takes us on a fascinating reverse fortune...

Fein-Lines: Who Will Maintain Control of Global Chip Manufacturing?

December 2, 2021 | Dan Feinberg, FeinLine Associates, Inc.

Will the U.S. gain back significant share of global chip manufacturing or continue to decline and become less relevant in this critical area? Back in 1990, the U.S. dominated the world in its use of chips, with about 40% of the total...

Additive Reality: You’ve Opened Up the Inkjet Printer Box, Now What?

November 29, 2021 | Luca Gautero, SÜSS MicroTec

The moment will come when some of you readers will advance from interest to complete involvement with the technology. This will be a fun ride as you will experience first-hand the concepts seen so far in this column. However, we all...

The Plating Forum: The Significance of IPC ENIG Specification 4552 Revision B

November 24, 2021 | George Milad, Uyemura International Corporation

The ENIG specification 4552 was issued in 2002. Since then, it has gone through a series of amendments and revisions in an attempt to meet the everchanging industry requirements. It started as a thickness specification that did not...

Test and Inspection Featuring:

  • Test and Inspection: Far Beyond Opens and Shorts, with Todd Kolmodin 
  • Fascinating Opportunities in Flying Probe Testing, with Peter Brandt 
  • New Methods for Quantifying Potential PCB Design Weaknesses and Manufacturing Challenges, with Gerry Partida 
  • Test and Inspection: Competitive Advantage and Cost of Doing Business, with Charlie Capers 
  • Alex Stepinski: A Philosophical View
  • The New Electrical Test—Riding the Wave, by Todd Kolmodin
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