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Don't Blink: The IPC APEX EXPO Time-lapse

January 31, 2023 | Nolan Johnson, I-Connect007

It’s a tradition here at I-Connect007 to set up a time-lapse for IPC APEX EXPO. There’s something satisfying, mesmerizing even, to watch the show floor build out and see the moment when the doors open and visitors fill the exhibit hall. Based on what others have said over the years, I know I’m not the only one whose favorite part is when the carpet gets rolled out and the whole character of the exhibition changes. This time lapse starts on the Saturday prior and continues through the Thursday tear-down phase.

IPC APEX EXPO Wrap-up

January 30, 2023 | Andy Shaughnessy, Design007 Magazine

IPC APEX EXPO 2023 is over, and I think it was successful show no matter how you slice it. There was barely a break in traffic on the show floor on Tuesday and Wednesday, and even on Thursday I saw people sprinting to close one more deal. Some committee meetings had nearly 200 participants; the meetings I sat in on were anything but boring.





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Dan’s Biz Bookshelf: ‘Leading in Tough Times’

January 27, 2023 | Dan Beaulieu, DB Management

I am not unique in saying that John Maxwell is one of my favorite business authors—there are about 34 million people who share that opinion. Of all the Maxwell books I have read over the years, "Leading in Tough Times"...

Punching Out: Here’s the Deal About 2022

January 23, 2023 | Tom Kastner, GP Ventures, Ltd.

Last year turned out to be a fairly slow year for mergers and acquisitions (M&A) in the North American PCB and EMS sectors. We counted just seven completed or announced deals in the PCB sector last year, compared to 13 in 2021,...

Nolan’s Notes: An Evolution

January 18, 2023 | Nolan Johnson, I-Connect007

This month, PCB007 Magazine looks at the evolution of advanced packaging from the fabricator’s perspective. This is, as you’re aware, a global topic. Asia harbors nearly all the manufacturing capabilities for the packaging...

Fein-Lines: An Eye-Popping Eureka Park and ShowStoppers at CES 2023

January 15, 2023 | Dan Feinberg, FeinLine Associates, Inc.

CES 2023 has ended and two of the most interesting areas of probably any trade show I’ve ever attended were Eureka Park and ShowStoppers. Small booths, new and unique products, and new ideas for potential partners—all...

The Advanced Move Featuring:

Substrate Manufacturing: What Does It Take? with Jan Vardman
Heterogenous Integration Technologies Driving Advanced Packaging Solutions by Charles Woychik
MKS' Atotech: Chemically Connecting the Industry with Tobias Helbech
The Impact of Chip Packaging by Chuck Bauer
Everyone Wants Change: Who Wants to Lead the Way? with Mark Goodwin and Alun Morgan
An Advanced Packaging Year in Review by John Mitchell

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