Nuvvon Abolishes the Myth that Solid Polymer Electrolytes Have Poor Ionic Conductivity
October 20, 2022 | Business WireEstimated reading time: 1 minute
It is generally assumed that solid polymer electrolytes have poor ionic conductivity at room temperature. Nuvvon has turned this notion on its head. Third-party verified data of their unique solid polymer electrolytes is presented to prove it.
Solid-state battery companies developing oxide and sulfide products suggest that solid polymer electrolytes have struggled with achieving the necessary ionic conductivity at room temperature. One attempted workaround is to increase the operating temperature, which is sub-optimal as it requires external heating. Another is the addition of liquid plasticizers, such as ionic liquids, to increase conductivity. But the amount of liquid plasticizer required for room temperature operation results in poor mechanical properties and subpar thermal aging.
Nuvvon has developed solid polymer electrolytes that overcome this problem. Nuvvon’s polymer electrolytes are completely dry and do not require the addition of ceramic nanomaterials. Nuvvon’s solid polymer electrolytes can also withstand high temperatures (>100oC) without mechanical degradation and demonstrate high ionic conductivity across a wide temperature range (2.2*10-4 S/cm at 0 oC, 4.6*10-3 S/cm at 25oC, 6.6*10-3 S/cm at 80 oC).
Nuvvon’s breakthrough in solid polymer electrolytes enables, for the first time, completely solid-state pouch cells that operate across a wide temperature range without external systems for cooling, heating, or pressure.
Suggested Items
PCB Market Size to Grow by $29.06B from 2024-2028
05/17/2024 | PRNewswireThe global printed circuit board (PCB) market size is estimated to grow by USD 29.06 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 6.6% during the forecast period.
epoxySet Launches EC-1015HP - High Temperature, Crack Resistant Epoxy Potting
05/13/2024 | epoxySetepoxySet introduces the EC-1015HP epoxy potting compound. This heat cure system is designed for temperature cycling from -55 to 180°C with significantly better crack resistance than traditional rigid epoxies. As a low viscosity encapsulant, it is used for large and small potting applications with fragile components.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
The Chemical Connection: Reducing Etch System Water Usage, Part 1
04/05/2024 | Don Ball -- Column: The Chemical ConnectionWater conservation has become an important component of the overall system design for most manufacturing operations today. Changing climate conditions and increasing populations are beginning to strain the freshwater supplies in many areas of the country. As a result, as equipment suppliers, we see an increasing number of requests for options that reduce water usage in proposed wet processing systems. Etching systems tend to use more water because of the need for close temperature control to maintain steady etch rates and the rinsing requirements for complete removal of corrosive etchants from the surface of the product before the next process step. This column contains some simple suggestions for reducing water usage in etch systems that won’t strain the budget too much.
Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan
04/02/2024 | Indium CorporationIndium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024).