Intel's Oregon Investments Fuel US Silicon Innovation Leadership
October 24, 2023 | IntelEstimated reading time: 2 minutes
Intel shared its plans to advance its semiconductor technology development facilities at the Gordon Moore Park at Ronler Acres in Hillsboro, Oregon. The campus is Intel’s innovation hub for leading-edge semiconductor research, technology development and manufacturing in the United States. This undertaking is possible with support from the state of Oregon, city of Hillsboro and Washington County, and in anticipation of support from the U.S. CHIPS and Science Act.
"Intel has been dedicated to driving innovation and advancing technology in Oregon for almost five decades, and we are set to lead the charge in restoring America's leadership in semiconductor R&D and manufacturing, backed by Oregon and the U.S. CHIPS Act. This investment further solidifies our commitment to the Silicon Forest and rebalancing the global semiconductor supply chain,” said Dr. Ann Kelleher, Intel executive vice president and general manager of the Technology Development Group.
Why It’s Important: The investments in Intel’s Oregon R&D and manufacturing operations are pivotal to the company’s technology leadership goals. They are part of Intel’s plans to invest more than $100 billion in the U.S. over a five-year period, CEO Pat Gelsinger said at September’s Intel Innovation event.
Plans include:
- Ongoing advancement of the company’s existing technology development facilities at the Gordon Moore Park campus. This substantial upgrade will usher in the latest in process technology and tools, putting the campus at the forefront of innovation.
- The world’s first high-numerical aperture extreme ultraviolet (high-NA EUV) lithography tool is planned to dock this year.
- Initiation of the application process for permits to enable a potential future multibillion-dollar expansion to Intel’s R&D and manufacturing capacity.
These investments, comparable to investments being made in other U.S. Intel sites and contingent on support from the U.S. CHIPS Act, would support several thousand new permanent and construction jobs and help ensure that Oregon and the Pacific Northwest remain the hub of U.S. semiconductor R&D and technology development for years to come.
Oregon Gov. Tina Kotek joined Intel executives today in Hillsboro in celebration of Intel’s major commitment and in support of the company’s unified vision for driving future innovation, technology development and manufacturing capabilities in the state.
"Intel's significant investments in Oregon reflect a shared vision of success and innovation,” Kotek said. “As the governor of this great state, I am excited about the positive impact that Intel's expansions and partnerships will have on Oregon's technology landscape and the future of our workforce. This collaboration highlights our state's commitment to fostering economic prosperity and diversity through education and innovation."
Suggested Items
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).