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Synopsys, Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU

05/03/2024 | PRNewswire
Synopsys, Inc. announced that Samsung Electronics has achieved successful production tapeout for its high-performance mobile SoC design, including flagship CPUs and GPUs, with 300MHz higher performance using Synopsys.ai™ full stack AI-driven EDA suite and a broad portfolio of Synopsys IP on Samsung Foundry's latest Gate-All-Around (GAA) process technologies.

Argonne, Toyota Collaborate on Cutting-Edge Battery Recycling Process

05/01/2024 | BUSINESS WIRE
The U.S. Department of Energy’s (DOE) Argonne National Laboratory has recently launched a collaboration with Toyota Motor North America that could reduce the nation’s reliance on foreign sources of battery materials.

Micron First to Ship Critical Memory for AI Data Centers

05/01/2024 | Micron
Micron Technology, Inc. announced it is leading the industry by validating and shipping its high-capacity monolithic 32Gb DRAM die-based 128GB DDR5 RDIMM memory in speeds up to 5,600 MT/s on all leading server platforms.

Danfoss Awarded Scanfil

05/01/2024 | Scanfil
Scanfil received an award from Danfoss in regards of delivery performance, quality, and customer service. We are honored to receive this award. 

TSMC Celebrates 30th North America Technology Symposium

04/29/2024 | TSMC
TSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.
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