Webcast on Innovations in Medical Implant Chemistry

Reading time ( words)

Mike Carano, VP of technology and business development, and Witold Paw, R&D manager, of RBP Chemical Technology will hold a webcast on innovations in medical implant chemistry. The webcast will provide an overview of the custom formulated processes that the in-house team of scientists and chemists have created at RBP Chemical.

The webcast is scheduled on June 25 at 12:00pm CST. Topics for discussion will include:

  • Chemical solutions for Nitinol, stainless steel, cobalt chrome and titanium alloys.
  • Minimizing base metal removal while effecting a smooth and passivated device.
  • Finding common defects of Nitinol wire and how to troubleshoot.
  • Removing oxides on Nitinol without attacking the base material.
  • Chempolishing vs. electropolishing—which is more practical?

For more information or to register, visit www.rbpchemical.com/webcasts.



Suggested Items

Book Excerpt: ‘Thermal Management: A Fabricator's Perspective,' Chapter 3

01/26/2021 | Anaya Vardya, American Standard Circuits
Conceptually, a metal-core board is exactly like it sounds—the metal is in the middle of the PCB sandwiched between layers on both sides. Just about any PCBA that will contain active heat-generating components can benefit when designed on a metal-core PCB. On a conventional PCB, the standard FR-4 layers are relatively poor thermal conductors, and heat is normally dissipated from active components using vias and thermal pads, as discussed earlier.

Chapter 2 Excerpt from the Book ‘Thermal Management: A Fabricator's Perspective’

12/21/2020 | Anaya Vardya, American Standard Circuits
Insulated metal PCBs (IMPCB) or metal-clad PCBs (MCPCB) are a thermal management design that utilizes a layer of solid metal to dissipate the heat generated by the various components on the PCBs. When metal is attached to a PCB, the bonding material can either be thermally conductive but electrically isolative (IMPCBs or MCPCBs), or in the case of RF/microwave circuits, the bonding material may be both electrically and thermally conductive. The reason that RF designers usually have the bonding material thermally and electrically conductive is that they are using this not only as a heat sink but also as part of the ground layer. The design considerations are quite different for these different applications.

Book Excerpt: Thermal Management With Insulated Metal Substrates, Part 4

12/10/2020 | Didier Mauve and Ian Mayoh, Ventec
The following is an excerpt from Chapter 4 of "The Printed Circuit Designer's Guide to... Thermal Management With Insulated Metal Substrates," written by Ventec International Group’s Didier Mauve and Ian Mayoh. In this free eBook, the authors provide PCB designers with the essential information required to understand the thermal, electrical, and mechanical characteristics of insulated metal substrate laminates.

Copyright © 2021 I-Connect007. All rights reserved.