SMTA Additive Electronics Conference: Industry Trends


Reading time ( words)

In her column, "Flex Talk: Additive Electronics: PCB Scale to IC Scale," Tara Dunn, Omni PCB president and conference co-chair, wrote, "The standard subtractive-etch process serves the industry well. Developments in materials, chemistry, and equipment enable the traditional PCB fabrication process to achieve feature sizes, such as line and space down to 30 microns. Larger shops with more sophisticated capabilities are building this technology today."

Tara continued, "Mainstream PCB manufacturing is often limited to 50-75 microns (mm) line and space. But the electronics industry is evolving quickly. Propelled by the demand for more sophisticated electronics, PCB design is being tasked with finer lines, thinner materials, and smaller via sizes. A traditional progression is to first move to HDI technology with microvias and multiple lamination cycles for fabrication. Today’s mSAP and SAP technology offers an advanced approach, with line and space capabilities of less than 25 microns, to meet these exceedingly complex design requirements." Tara will also be attending and moderating a panel discussion at the conference.

Don't miss out; start your research. Attend the SMTA Additive Electronics Conference on October 24, 2019, to launch your expertise in additive electronics.

Share

Print


Suggested Items

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

04/16/2021 | Nolan Johnson, I-Connect007
I’m sure it’s just me being hyperaware, but I can’t shake it: Mars is where it’s at right now. Is it just me, or do you get the same feeling from the news? There are the Mars rovers—three generations of them still rolling, now—and a drone helicopter winding up for a maiden flight any day now. But that’s not all. There’s SpaceX’s StarShip, rapid-prototyping its way into a manned flight to Mars. And NASA’s whole “return to the Moon” project is simply a shakedown for the U.S. government contractors’ Mars flight hardware, too.

Top Five Takeaways from IPC APEX EXPO 2021

04/15/2021 | Chris Mitchell, IPC VP, Global Government Relations
IPC APEX EXPO 2021, which went all virtual this year, exemplified how the electronics industry has responded to the COVID-19 global pandemic: with resiliency, agility, and an unwavering commitment to build electronics better. APEX EXPO featured great content and robust discussions on topics of critical importance to the global electronics industry. From my vantage point leading IPC’s government relations programs, here are my top five takeaways from this year’s event.

IPC Supporting Newcomers in the Industry: Notes from IPC APEX EXPO 2021

04/01/2021 | Marc Carter, Aeromarc
With the wrap-up of IPC APEX EXPO 2021, it was extremely gratifying to note the emphasis placed on getting young people involved to combat the “graying out” knowledge losses facing our industry. A part of that emphasis was reflected in the award ceremony on Tuesday, March 9, which featured some people you may have seen mentioned in my “Better to Light a Candle” columns.



Copyright © 2021 I-Connect007. All rights reserved.