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The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.
This study focuses on developing a layer transition element that minimises the loss and dispersion. We will use VeCS-2 technology (blind/hybrid) construction (Figure 1).
The advantage of using a stitching via is that we can use “traditional” orthogonal routing, which is very efficient in signal layer utilization. However, in some instances, orthogonal or Manhattan routing could yield a longer trace length, which could lead to a higher loss due to the dielectric and conductive losses.
To read this entire article, which appeared in the October 2019 issue of PCB007 Magazine, click here.