Vertical Conductive Structures, Part 4: Tuning Your Signal Performance


Reading time ( words)

The objective of this article is to demonstrate the possibility of using a stitching element as an alternative to the point-to-point connections that are used with traditional via technology. Point-to-point connections have the best performance in terms of signal integrity (one via less in the connection that distorts the signal). A via is mainly a capacitive element that causes signal loss/ dispersion.

This study focuses on developing a layer transition element that minimises the loss and dispersion. We will use VeCS-2 technology (blind/hybrid) construction (Figure 1).

The advantage of using a stitching via is that we can use “traditional” orthogonal routing, which is very efficient in signal layer utilization. However, in some instances, orthogonal or Manhattan routing could yield a longer trace length, which could lead to a higher loss due to the dielectric and conductive losses.

Joan-vert-fig1.jpg

To read this entire article, which appeared in the October 2019 issue of PCB007 Magazine, click here.

Share

Print


Suggested Items

EIPC Technical Snapshot: 5G and Loss Minimisation

03/26/2021 | Pete Starkey, I-Connect007
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!

Happy’s DIY Solution to Chemical Control

12/09/2020 | Happy Holden, I-Connect007
I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.

EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech

11/30/2020 | Pete Starkey, I-Connect007
Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.



Copyright © 2021 I-Connect007. All rights reserved.