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Green Circuits Unveils Innovative Stacked Capacitors Assembly Process

03/21/2024 | Green Circuits
Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.

Manu Skyttä, New President and CEO of Aspocomp Group Plc, Will Assume Duties on May 20, 2024

03/19/2024 | Globe Newswire
Manu Skyttä succeeds Mikko Montonen, who, as previously announced, has agreed with the Board of Directors to step down from the role of President and CEO of the company. Mr. Montonen has committed to staying on as the company's President and CEO until May 20, 2024.

Management Change at Mycronic

03/19/2024 | Mycronic
As a result of the preparations ahead of a possible listing of Axxon on a stock exchange in China, effective March 19, 2024, Ivan Li leaves Mycronic’s executive management but remains as Head of Axxon, the core of Mycronic´s High Volume division.

Intel Appoints Stacy Smith to Board of Directors

03/14/2024 | BUSINESS WIRE
Intel Corporation announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel’s board of directors, effective immediately. Smith will serve as an independent director and join the board’s Audit & Finance Committee.

PCBAA Welcomes CHIPS Program Investing in American Made Substrates

03/05/2024 | PCBAA
The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
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