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High-Density Packaging (HDP) User Group is pleased to announce it is hosting a webinar that will provide its members and others in the electronic industry the latest information on standard requirements and developments in automotive electronics.
“Automotive Electronics is one of the fastest-growing segments of advanced electronics technology. We have planned an informational session that will cover the latest developments in automotive standards and automotive electronic packaging”, said Marshall Andrews, Executive Director of HDP User Group.
The Webinar will be held on June 25, 2020, at 8 AM USA Central Time.
Agenda 8:00 AM – 11:00 AM US Central Time
Welcome – Larry Marcanti, HDP
Opening of the Webinar by the Moderator
Jan Vardeman, President, and Founder of Techsearch International recognized around the world as a leading consulting company in the field of advanced semiconductor packaging technology.
Mobility Trends and Their Impact on The Automotive Supply Chain
- ZVEI – DR Stefan.Gutschling
Power PCB requirements for Automotive Applications
- Ventec Laminates – Alun Morgan
Automotive Packaging Trends – Challenges & Solutions
- Infineon – Thorsten Meyer
The regulatory landscape for vehicle electronics and primary evaluation tools for PCB reliability demands in the new e-mobility market.
- UL – Art Creidler
Considerations in Automotive PCB manufacture
- TTM – Raj Kumar
Round Table & Questions
- Webinar Close
The Webinar is in the English language.
Please register for webinar log-in and call details by emailing your contact info (name, Company Info, Email) to one the following people:
firstname.lastname@example.org, email@example.com, or firstname.lastname@example.org