Elsyca Offers Free Webinars on Simulation Tools for PCB Copper Balancing


Reading time ( words)

Elsyca has recently developed an exciting new technology for PCB CAM engineers and designers to validate their panel layout against plating targets and automatically add copper balancing. This results in panels with a more uniform layer thickness distribution and less plating related production problems.

These skills will give users a competitive advantage as it will enable them to meet customer needs more effectively than their competitors.

Elsyca also offers separate webinars for process engineers identify problems upfront and so that they may solve them before the implementation of a configuration and prior to production.

Details on upcoming webinars for PCB CAM engineers and designers can be found here.
Details on upcoming webinars for process engineers can be found here.

To watch the Elysca PCBBalance video and learn more now, visit elsycapcbbalance.com.

Share

Print


Suggested Items

Driving Down Cost with Process Engineering

04/20/2021 | I-Connect007 Editorial Team
Nolan Johnson, Barry Matties, and Happy Holden speak with Matt Mack, process engineer at ICM Controls. Matt shares a day in the life of a process engineer, along with how he approaches continuous improvement and planning for the future on the floor.

PCB Sourcing Using PCQR2

03/30/2021 | Al Block, Naji Norder, and Chris Joran, National Instruments
In a global market, it is often difficult to determine the best PCB suppliers for your technology needs, while also achieving the lowest costs for your products. Considering each PCB supplier has their own niche in terms of equipment, process, and performance, uniform test data from the IPC-9151D Process Capability, Quality, and Relative Reliability (PCQR2) Benchmark Test Standard can help find the right source for the board based on its specific technology requirements.

IPC APEX EXPO 2021 Keynote: Travis Hessman on ‘The Great Digital Transformation’

03/10/2021 | Pete Starkey, I-Connect007
Wednesday’s Premier Keynote at IPC APEX EXPO 2021 came from Travis Hessman, editor-in-chief of IndustryWeek, “a website and magazine dedicated to manufacturing leadership, operational excellence and the technologies that make it possible.” An energetic and animated presenter, a powerful storyteller and visibly passionate about digital manufacturing, Hessman made it clear at the outset that his goal was not to hype an already over-hyped industry, nor to focus on the technologies themselves, but to walk-through the process of transformation.



Copyright © 2021 I-Connect007. All rights reserved.