-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
Article Highlights
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
EIPC Presents Technical Snapshot Webinars
October 13, 2020 | EIPCEstimated reading time: 2 minutes
During the Autumn of this year, EIPC will be organising three webinars which will be of particular interest to those involved with automotive, telecom and high-speed technology. We will have three well-known PCB industry speakers, each of whom has their own view on the technology challenges facing this industry.
This first session will focus on automotive technology and some of the key factors driving the global Automotive Printed Circuit Board industry. They will look at how the whole supply chain of PCB manufacturing can be ready for that change which will need input on materials, processes, measurement systems, reliability, and environmental impact and are there some new technologies for PCB manufacturing which will support these new demands.
The webinar on 14th of October will start at 15.00 hrs CEST.
The presenters this day will be:
Lenora Clark from ESI Automotive
Her presentation topic: An exploration of advanced semiconductor packaging’s effect on automotive electronic hardware design and assembly
- In the presentation there will be discussion and review on all aspects of the electronic build, starting with how increased performance influences the semiconductor packages, how that then affects design for PCB fabrication, and finally it considers the influence on materials for perfect assembly.
Alun Morgan from Ventec
His presentation topic: "Reliability needs to be designed-in from the lowest level"
- In the presentation you will hear about cutting-edge technology demands more care to ensure reliability and resilience.
Paul Waldner from Multiline
His presentation topic: "Multilayer Printed Circuit Requirements for the Automobile Industry in the Age of High Speed”
- The PCB industry is facing the challenge of automotive and 5G product requirements based on the demand for higher speed. The material offering is wide and requires well-controlled technology for PCB manufacturing. One of the critical processes is multilayer pressing and registration which are also key challenges for high-speed products.
- We would like to present a new technology to laminate multilayers at very high temperatures with a control of temperature per panel previously thought to be impossible. Conventional Multilayer presses require huge amounts of energy pushed into a relatively high stack of to-be-laminated panels from a huge mass of metal that had to be heated up even before the panels could begin to be heated up. This meant that the temperature gradient of a stack of laminates could be as high as 40 degrees C from the outside-panels in the stack to the inside-panel. Indubond’s press technology can heat every panel in a stack to exactly the same temperature at exactly the same time.
- The presentation will also introduce the technology of registering those panels is old, but still necessary to insure the best registration of multilayers composed of differing materials no matter how hot the press. Pin-lam combined with data collection of inner-layer movements at every point in the fabrication process is worth discussing again.
- The signal integrity of high speed circuits is also helped by as near-to-perfect rectangular cross-sections of the tracks that comprise the way from sensors to processors to output devices. Multiline would like to introduce to Europe a new semi-additive process which is designed to improve signal integrity while making it easier to improve resolutions of tracks and gaps.
Registeration is free of charge to EIPC Members. The Non Member fee is € 50.- Visit eipc.org.
Suggested Items
Big Win for Defense Production Act Budget Allocation in FY24 Budget
04/23/2024 | I-Connect007 Editorial TeamOne year ago, President Biden issued a determination that chips and packaging are critical for national security. Since that time, much work has been done to continue the conversation in Washington, elevating the importance of the entire chips value chain, and including printed circuit boards and substrates, without which chips cannot operate.
Zentech’s Board of Directors Announces the Return of Matt Turpin as President and CEO
04/22/2024 | Zentech ManufacturingTurpin draws upon over 35 years of experience in the electronics industry and has an 18-year history with Zentech. He previously served as President and CEO from 2006 to 2019 after which time he has remained active in the EMS industry as an advisor to Zentech and other industry organizations.
Aaron Woolf, Dylan Peterson Join SIA Team
04/22/2024 | SIAThe Semiconductor Industry Association (SIA) announced Aaron Woolf and Dylan Peterson have joined the SIA team. Woolf will serve as director of global policy for economic security and Peterson will be a communications associate. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
It’s Only Common Sense: OCCAM—the Time Is Now
04/22/2024 | Dan Beaulieu -- Column: It's Only Common SenseOne of my favorite books is a little tome called Who Moved My Cheese? Even those of you who don’t spend a lot of time reading books have at least heard of it and know that it refers to people, especially in business, who are so stuck in their ways that they get upset when something changes. In our business, we know this kind of thinking is especially true. In fact, it always makes me laugh when one of my innovative friends finds a new way to do something and is afraid that someone will steal his idea. I always tell him that no one in our business, especially a PCB engineer, has ever thought about someone else’s innovative idea enough to steal it.
Digitalisation and ESG
04/19/2024 | Marina Hornasek-Metzl, AT&SDigitalisation and ESG are prominent and high-priority topics in the global business community. The first focuses on applying technology throughout the value chain to produce faster, smarter, and more desirable business outcomes. The latter emphasises the broader value a business is expected to create for its stakeholders from an environmental, social, and governance perspective.