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IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products

04/18/2024 | PRNewswire
Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

Material Insight: The Importance of Standards for the Chip Packaging Industry

04/12/2024 | Dr. Preeya Kuray -- Column: Material Insight
I had the great pleasure of recently attending the National Institute of Standards and Technology’s (NIST) CHIPS R&D Chiplets Interfaces Technical Standards Workshop. The purpose was to bring together technical experts across industry and academia to deliberate one of the most pressing technological matters of 2024: chip packaging standards.

Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions

04/10/2024 | Infineon
Infineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.

Indium’s Sze Pei Lim to Present on Semiconductor Packaging at ICEP Japan

04/02/2024 | Indium Corporation
Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024).
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