Aismalibar Adds Arkeo Stack to Library of Software Tools
February 9, 2021 | AismalibarEstimated reading time: 1 minute
Aismalibar thermal conductive laminates, has added Arkeo Stack software to their library of software tools aimed at offering additional “value add” for their customer base. This advanced software offers PCB manufacturers the option of having Aismalibar create or evaluate a proposed build for a specific PCB design requirement. The software will calculate the thermal impedance for each layer as well as the complete build ensuring it will produce the required results.
Jeff Brandman, president of Aismalibar North America, says, “Those of you who know Aismalibar, know that we are always striving to find better ways to help our customers. That’s why we are so proud to add Arkeo Stack to our library of software tools that provide our customers with more value-benefits of working with us and with our fine line of Aismalibar Thermal conductive laminates.”
The Arkeo Stack software is preloaded with all the latest industry materials including IMS and heat sink materials. Offering accurate thermal impedance calculations, it also offers the ability to model thermal impedance values for sub-assemblies. The software includes all the necessary IMS thermal material information to be able to accurately design a stack up where thermal performance is key. Utilizing the APSIM impedance modelling platform the software also offers detailed impedance calculations.
Arkeo Stack is a fully automated, stack up generation software tool that quickly builds accurate and cost-conscious stack ups. Having your build created or double checked by Aismalibar reduces engineering time and costs while creating consistent, reliable builds. Arkeo Stack has a custom report generator that builds reports to suit the specific needs of your company during the processing and testing of your IMS printed circuit board.
This service is proudly offered to customers who purchase Aismalibar thermal conductive laminates. The service is designed to assist you to achieve the perfect stack up using thermal conductive materials. Aismalibar’s field application engineers have extensive experience in thermal management and PCB manufacturing and are ready to assist you with your PCB stack-up to achieve best results.
About Aismalibar
Aismalibar has over 60 years of experience manufacturing high end copper and metal clad laminates for the printed circuit board industry. During the last two decades, Aismalibar has been focused on offering the best solutions to reduce the operational temperature of printed circuit boards. For more information, visit www.aismalibar.com.
Suggested Items
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
03/18/2024 | AT&SThe Styrian microelectronics specialist AT&S is taking World Recycling Day as an opportunity to review the progress that has been made in recent months at its sites around the world in terms of the efficient use of resources:
Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.