Ventec, BizLink, Footprintku Announce Strategic Alliance


Reading time ( words)

Ventec is pleased to announce that it has entered into a global strategic alliance with leading interconnect solutions provider, BizLink Holding Inc., and Footprintku Inc., an online EDA library and digital transformation services provider for electronic components. This alliance is formed to provide a solution that boosts product development process efficiency and shortens development and time-to-market.

BizLink has long been a supplier of key components to the IT industry, including connectors and cables. The company is experienced in new product introduction (NPI) as well as in system integration, manufacturing, and in assembly.

BizLink’s Chairman, Roger Liang, said, "For the design of electronic products, the trend is for thinner, lighter, and aesthetically pleasing products whilst maintaining functionality and compatibility. This has prompted the demand for rapid and frequent updates of components and product styles. The ability to quickly develop products to respond to market changes has become the key to success."

Ventec International’s Chairman, Tony Lau, pointed out, "What the market needs is a platform that integrates the advantages of upstream components, mid-section design, and back-end manufacturing. The creation of such a platform, we knew, would greatly help accelerate industrial innovation." Footprintku Inc.’s Chairman, YC Hwang, continued, "In response, we propose a cloud platform using the exclusive AI and digital transformation technology of Footprintku.com to integrate the resources of all three companies. The result is a one-stop service, making it possible for product developers to quickly and efficiently find the best components and quality suppliers for their product R&D and design change stages."

This alliance is built upon Footprintku’s cloud database for electronic components as well as BizLink’s solutions and Ventec International’s materials. It integrates the capabilities of new product introduction (NPI), design services (ODM), and manufacturing assembly (EMS). This alliance will reduce the cost of and time in searching for electronic components for product developers. Furthermore, it will accelerate product evolution and facilitate industrial innovation by connecting highly flexible and customized electronic industry supply chain partners.

The alliance was officially announced at a press conference held at the Grand Hyatt Taipei on February 26, 2021.

Share

Print


Suggested Items

Benchmarking Your Process Engineering

04/29/2021 | I-Connect007 Editorial Team
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.

Isola Releases IS550H Material

04/26/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.

EIPC Technical Snapshot: Supply Chain and Material Price Pressures

04/26/2021 | Pete Starkey, I-Connect007
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”



Copyright © 2021 I-Connect007. All rights reserved.