AT&S Board Proposes Paying Dividend of €0.39 per Share for FY 2020/21


Reading time ( words)

The Management Board of AT&S decided today, subject to the approval of the Supervisory Board, to propose a dividend of € 0.39 for the financial year 2020/21 (PY: € 0.25 per share) to the 27th Annual General Meeting on 8 July 2021.

AT&S pursues a transparent dividend policy based on investment cycles and profit for the year. This proposal for the distribution of profits reflects the positive development in the  past financial year and the upcoming investments in additional capacities and new technologies.

The annual results for the financial year 2020/21 will be published on 18 May 2021 and the Annual Report on 10 June 2021.

Share

Print


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.



Copyright © 2021 I-Connect007. All rights reserved.