Rogers Corporation to Present & Exhibit at IMS in Atlanta


Reading time ( words)

Rogers Corporation announced that Technical Marketing Manager, John Coonrod, will present Thermal Management for High Frequency Printed Circuit Boards from 11:45 – 12:00 p.m. on Tue., June 8 and Stripline Circuitry for Millimeter-Wave and Very High Speed Digital from 11:15 – 11:30 p.m. on Wed., June 9 in the MicroApps Theater at the International Microwave Symposium (IMS) in Atlanta.

In addition, Rogers will be showcasing its latest 5G and autonomous vehicle materials and other products in Booth #1621 during IMS, the world’s largest RF and Microwave show, which takes place from Tues. June 8 – Wed., June 9. These products include XtremeSpeed™ RO1200™ laminates and bondplies, RT/duroid® 6035HTC laminates, as well as recently launched SpeedWave™ 300P ultra-low loss prepreg.

XtremeSpeed RO1200 circuit materials are engineered to meet the unique electrical and thermal/mechanical demands of high speed designs. These circuit materials enable system designers the flexibility to design leading edge systems that maximize data throughput and minimize latency in performance demanding applications. With a low dielectric constant of 3.05, and a maximum dissipation factor of 0.0017 @10GHz, XtremeSpeed RO1200 materials provide outstanding signal integrity, reduced signal skew, and reduced cross-talk. Combined with superior thermal/mechanical performance, low CTE, and a halogen free UL 94 V-0 rating, these materials are well suited for the most demanding high layer count applications.

RT/duroid 6035HTC laminates feature a relative dielectric constant of 3.5 at 10 GHz, making them suitable for a wide range of circuits, including amplifiers, couplers, filters, and power combiners/dividers employed in avionic and other military and hi-reliability systems. The laminates incorporate a unique filler material to achieve superior heat-transfer characteristics compared to other high frequency circuit materials with similar dielectric constant. With outstanding thermal conductivity of 1.44 W/m∙K as well as low loss, with a loss tangent of 0.0013 at 10 GHz, for excellent high frequency performance, this combination of high thermal conductivity and low dielectric loss translates into improved amplifier performance.

SpeedWave 300P prepreg provides excellent thermal reliability for the most demanding high layer count designs requiring multiple sequential laminations. It also delivers superior fill and flow capability around heavy copper features, a low z-axis expansion for plated through-hole reliability and is CAF resistant. This UL 94 V-0 rated material is compatible with modified FR-4 fabrication processes and lead-free PCB assembly processing and is ideal for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs.

About Rogers Corporation

Rogers Corporation (NYSE:ROG) is a global leader in engineered materials to power, protect and connect our world. Rogers delivers innovative solutions to help our customers solve their toughest material challenges. Rogers’ advanced electronic and elastomeric materials are used in applications for EV/HEV, automotive safety and radar systems, mobile devices, renewable energy, wireless infrastructure, energy-efficient motor drives, industrial equipment and more. Headquartered in Chandler, Arizona, Rogers operates manufacturing facilities in the United States, Asia and Europe, with sales offices worldwide. 

Share

Print


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.



Copyright © 2021 I-Connect007. All rights reserved.