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MacDermid Alpha Electronics Solutions, a global electronics chemicals process supplier, will be exhibiting at the China International Electronics Circuit Exhibition hosted by the China Printed Circuit Association. The show will be held from July 7-9, 2021 at the National Exhibition and Convention Center in Shanghai.
MacDermid Alpha will be featuring its complete portfolio of metallization technologies from the MacDermid Alpha brand for HDI designs that provide a continuous metalurgical structure for the most demanding requirements in micro via reliability. Highlighted will be the recently released processes in the IC Substrate market; Systek SAP – high performance build-up processes, Systek UVF 100 – via fill and fine line plating for 2-in-1 RDL applications, and Systek ETS 1200 – pattern plating metallization for embedded trace substrates. Also showcased will be the product offerings that enable 5G from start to finish from all three divisions and brands within the MacDermid Alpha family.
Interested participants can stop by Hall 8.1H, booth, 8M60, to talk to our industry experts about the latest offerings from MacDermid Alpha.