DYCONEX Celebrates 30 Years in Business


Reading time ( words)

2021 is a very special year for Dyconex. Together with customers and employees they are celebrating their 30th anniversary. 

Driven by leading-edge customers over the past 30 years, DYCONEX has continuously been at the forefront of developments in printed circuit board (PCB) manufacturing and has repeatedly set important technological milestones, beginning with the introduction of high-reliability rigid-flex multilayer boards (DYCOflex®). DYCONEX is a world leading manufacturer of highly reliable, high-quality and flexible PCBs for the medical industry, especially for medical implants. Biocompatible interconnect solutions are also one of the company's strengths. In addition, DYCONEX also produces rigid and rigid-flex substrates for various other industries. 

The continuous innovation process is part of the DYCONEX DNA and is both the engine and the guarantee for the ongoing global competitiveness of the company. In addition to all technical developments, they are very proud of employees who permanently ensure enduring improvements. 

Investment efforts in the latest technologies and the ongoing outstanding commitment of employees in process and product development allows them to maintain a role as a forerunner in technology over the last three decades.

Dyconex notes, "We are thankful to our customers for their trust in us and to our outstanding, highly innovative and passionately committed workforce, that we have become the top-selling Swiss printed circuit board manufacturer since 1991 and the global market leader in the field of highly reliable flexible substrates for the MedTech industry."

Share

Print


Suggested Items

A Conversation with Canice Chung, TTM Technologies

12/09/2014 | Barry Matties, I-Connect007
We had the opportunity to sit down with Canice Chung, Executive Vice President of TTM Technologies, Inc. to discuss the current trends and challenges of PCB Manufacturing in China.

A Conversation with Laurent Nicolet, Schmid Group

12/07/2014 | Barry Matties, I-Connect007
During the HKPCA & IPC Show 2014, Laurent Nicolet, VP - PCB Business Unit of Schmid Group took a few minutes to discuss the automation technology that was on display and share the changes he's seen in the China market.

Thin PCBs for Smart Phones: Technology and Reliability Considerations

11/19/2014 |
The next generation of smartphones will demand very thin multilayer boards to reduce product thickness. This paper shows three different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level--the any-layer copper filled microvia technology which is to be considered state-of-the-art for high-end phones and the ALIVH-C/G technology well established in Japan.



Copyright © 2021 I-Connect007. All rights reserved.