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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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AT&S Releases Annual General Meeting Results
July 9, 2021 | AT&SEstimated reading time: Less than a minute
The 27th Annual General Meeting of AT & S Austria Technologie und Systemtechnik Aktiengesellschaft (AT&S), which was held virtually, adopted a dividend of € 0.39 per share for the financial year 2020/21.
The ex-dividend day is 27 July 2021, the record day is 28 July 2021 and the dividend payment day is 29 July 2021. Deloitte Audit Wirtschaftsprüfungs GmbH was appointed the statutory auditor of the financial statements and consolidated financial statements for the financial year 2021/22.
In addition, to repurchase shares in the Company and any related cancellation of shares, today’s Annual General Meeting authorized the Supervisory Board to make amendments to the Articles of Association resulting from the cancellation of shares and to revoke the related resolution of the Annual General Meeting of July 4, 2019. All other agenda items presented for resolution were also adopted by the shareholders represented at the Annual General Meeting.
Suggested Items
TTM Celebrates the Grand Opening of Its First Manufacturing Facility in Penang
04/25/2024 | TTM Technologies, Inc.TTM Technologies, Inc., a leading global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), officially opened its first manufacturing plant in Penang, Malaysia with an investment of USD200 million (approximately RM958 million).
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Elevating PCB Design Engineering With IPC Programs
04/24/2024 | Cory Blaylock, IPCIn a monumental stride for the electronics manufacturing industry, IPC has successfully championed the recognition of the PCB Design Engineer as an official occupation by the U.S. Department of Labor (DOL). This pivotal achievement not only underscores the critical role of PCB design engineers within the technology landscape, but also marks the beginning of a transformative journey toward nurturing a robust, skilled workforce ready to propel our industry into the future.
IPC Design Competition Champion Crowned at IPC APEX EXPO 2024
04/24/2024 | IPCAt IPC APEX EXPO 2024 in Anaheim, California, five competitors squared off to determine who was the best of the best at PCB design.
Real Time with... IPC APEX EXPO 2024: all4-PCB, A Premier Solution Provider for the PCB Industry
04/22/2024 | Real Time with...IPC APEX EXPOIn the PCB industry, all4-PCB, is a top-tier equipment supplier and process solution provider. Ralph Jacobo highlights the active market and the demand for high-quality equipment, discusses their existing customers, investment in advanced substrates, and smaller board shops.