Realtek, Ansys Accelerate Complex IC Design for RFIC & High-Speed IC with Advanced Simulation Workflow
November 19, 2021 | ANSYSEstimated reading time: 1 minute
Realtek has adopted a leading-edge and user-friendly electromagnetic (EM) simulation workflow developed by Ansys to accelerate complex RFIC design and improve efficiency by shrinking silicon area. Realtek uses RaptorH’s silicon-optimized modeling flow to substantially decrease simulation time and reduce wasteful overdesign by accurately predicting EM coupling in applications ranging from RFIC and high-speed IC to cutting-edge Internet of Things products.
RFIC advanced node designs must manage the growing challenge of EM interference caused by high-frequency, millimeter wave signals and occurring across different RF blocks. To improve the efficiency of design margins, Realtek IC designers rely on Ansys® RaptorH™‘s large capacity engine to analyze complete circuit blocks with high fidelity.
By adopting this silicon-optimized modeling flow, Realtek designers are accelerating EM modeling times by 3x – 10x. Additionally, they are shrinking silicon real estate by drastically reducing block-to-block EM crosstalk in extremely complex designs.
“RaptorH delivers a highly intuitive graphical user interface with a simplified setup that does not require any manual modifications to the layout or foundry tech files for performing EM coupling analysis,” said Yee-Wei Huang, vice president at Realtek. “It helped our engineering team identify EM coupling problems in our on-chip design flow. This predictive accuracy, together with its high capacity and speed, enabled our designers to minimize area and increase the value without compromising fidelity in new, extremely complex chips.”
“RaptorH plays an integral role in our industry-leading, gold standard simulation platform for modeling EM and multiphysics interactions across the latest generation of IC layout structures,” said John Lee, vice president and general manager of the electronics and semiconductor business unit at Ansys. “Providing an optimum user experience and delivering reliable results, this product’s cutting-edge S-parameter and reduced SPICE models help Realtek designers capture the behavior of very high-frequency signals to solve complex IC layout problems with increased confidence, resulting in more efficient and reliable products.”
Suggested Items
Altus Group Helps BitBox Unlock Productivity and Efficiency Gains with New Reflow Oven
04/22/2024 | Altus GroupAltus Group, a leading provider of capital equipment, has recently assisted BitBox, a UK-based electronics design, engineering and manufacturing company in upgrading its operations with the implementation of a new reflow oven from Heller Industries.
Real Time with... IPC APEX EXPO 2024: Exploring IPC's PCB Design Courses with Kris Moyer
04/18/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and IPC instructor Kris Moyer discuss IPC's PCB design training and education offerings. They delve into course topics such as design fundamentals, mil/aero, rigid-flex, RF design, and advanced design concepts. They also highlight material selection for high-speed design, thermal management, and dissipation techniques. The interview wraps up with details about how to access these courses online.
Cadence Unveils Palladium Z3 and Protium X3 Systems
04/18/2024 | Cadence Design SystemsThe Palladium Z3 and Protium X3 systems offer increased capacity, and scale from job sizes of 16 million gates up to 48 billion gates, so the largest SoCs can be tested as a whole rather than just partial models, ensuring proper functionality and performance.
Signal Integrity Expert Donald Telian to Teach 'Signal Integrity, In Practice' Masterclass Globally
04/17/2024 | PRLOGDonald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving Signal Integrity (SI) challenges in today's fast-paced technological landscape.
On the Line With... Podcast Talks With Cadence Expert on Manufacturing
04/18/2024 | I-Connect007In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.