Using Agile Analog’s Process-agnostic Analog IPs Can Help Solve Current Semiconductor Capacity Challenges
May 5, 2022 | Agile AnalogEstimated reading time: 1 minute
The current Fab capacity challenges within the Semiconductor industry have resulted in ASIC and Fabless companies evaluating multiple foundries in order to meet chip production forecasts for the next several quarters. Agile Analog’s process agnostic Composa™ technology addresses the problem of portability of the analog IP cores that have traditionally required re-engineering to suit each different silicon process technology.
“This process specific re-spin each time a different foundry is used consumes valuable engineering effort that could be better focussed on value-added differentiating design work,” explained Barry Paterson, VP Product Marketing at Agile Analog. “When customers integrate our analog IP cores in their designs, we can automatically generate new versions of the IP using the PDK for a different process to enable access to capacity.
The capability to enable access to any process technology also helps customers when moving to next generation of a product family that is typically on a smaller process node. The majority of enhancements usually occur in the digital implementation while the analog IP that provides foundation analog functionality, data conversion and power conversion typically remains constant. Maintaining the analog IP performance and features while having it regenerated by Agile Analog for a smaller process node allows customers to focus their valuable analog design engineers on innovative and differentiating design work rather than having to process port all analog circuits.
Suggested Items
Australian Flow Batteries and The SCHMID Group Announce Groundbreaking Memorandum of Understanding
04/17/2024 | SCHMID GroupAustralian Flow Batteries Pty Ltd (AFB), a leader in innovative energy solutions and economical, safe, and reliable power storage, and SCHMID Energy Systems GmbH a company of the German SCHMID Group, a global technology leader with a rich history in delivering innovative solutions across multiple industries including Electronics, Renewables, and Energy Storage sectors, are thrilled to announce the signing of a Memorandum of Understanding (MoU)
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
Microchip Technology Acquires Neuronix AI Labs
04/16/2024 | Microchip Technology Inc.Innovative technology enhances AI-enabled intelligent edge solutions and increases neural networking capabilities.
Incap Estonia Teamed Up With Solaride to Fuel Youth Excitement for The World of Engineering
04/11/2024 | IncapIncap Estonia partnered with Solaride to ignite enthusiasm among young people for the world of engineering and sustainable technology. Together, they organised an inspiring day for students from grades 7 through 12 in Saaremaa. Held at Incap’s Kuressaare factory, this event brought together over 130 young minds eager to explore the innovative world of technology and learn more about advanced electronics manufacturing.
Plastronics and the New IPC Guidelines for In-mold Electronics (IME)
04/11/2024 | Barry Matties, I-Connect007In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.