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Inkjet solder mask has for many years been a distant, near-impossible, goal for the PCB industry. Hopes have been raised on several occasions, only to fade when the ink either won’t jet or won’t pass end-user qualification. It is now evident that Taiyo’s many years of development in cooperation with equipment manufacturers have resulted in a successful formulation.
Watch the full interview with Don Monn of Taiyo America here.
Nolan Johnson, I-Connect007
Nolan Johnson spoke with Brian Wojtkiewicz at PCB West about Taiyo’s latest developments in solder mask technology. They discussed the company’s advances in flexible circuits, HDI, and much more. In particular, Brian discusses the importance of reliability in fabrication and assembly. "We’re always in the fabricators’ shops. I’m out in the field talking to them, helping the operators understand the process, and making things work better because then we don’t have issues down the road," he says.
I-Connect007 Editorial Team
In this second half of our conversation, Michael Carano discusses some of the metrics that fabricators need to consider before investing in new processes, especially process control technologies, and some of the challenges board shops face updating brownfield sites.
Pete Starkey, I-Connect007
“Summer is over, now it's back to work!” This was the opening line of the invitation to the 18th EIPC Technical Snapshot webinar, Sept. 14, following the theme of advances in automotive electronics technology, introduced and moderated by EIPC President Alun Morgan. The first presentation, entitled "The fully printed smart component—combining additive manufacturing and sensor printing," came from Jonas Mertin, a thin-film processing specialist at the Fraunhofer Institute for Laser Technology.