-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
Getting to Know Your Designer
In this issue, we examine how fabs work with their design customers, educating them on the critical elements of fabrication needed to be successful, as well as the many tradeoffs involved. How well do you really know your customer? What makes for a closer, more synchronized working relationship?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
New IPC Report Details How PCB Makers Address Tech Trends
June 1, 2015 | IPCEstimated reading time: 2 minutes
PCB Technology Trends 2014, a global biennial study published this month by IPC – Association Connecting Electronics Industries, is now available. The survey-based study shows how PCB manufacturers are meeting today’s technology demands and looks at the changes expected by 2019 that will affect PCB fabricators and their suppliers of materials and equipment.
Based on data collected from 158 companies worldwide, the 173-page PCB technology trends study presents the aggregate data segmented by application for five key segments: computers and telecommunications, consumer electronics, industrial and automotive electronics, medical electronics, and military and aerospace electronics.
The study covers such issues as: clock speed, heat dissipation, operation cycles, product life expectancy, environmental operating range, lamination cycles, board thickness, layer counts, line width and spacing, via diameters, aspect ratios, use of embedded technologies, surface-mount land dimensions, I/O pitch, test density, recyclable content, component size, and numbers of leads, solder joints and components per board area.
Among the many interesting findings, the study reports that nearly half of the responding PCB manufacturers for computer and telecommunications applications expect their highest clock speeds in 2019 to exceed 25 gigahertz. This segment had the highest clock speed predictions. The military and aerospace segment reported that heat dissipation is a design-limiting factor in half of their devices currently, which is the highest of the five applications studied, and they expect that percentage to rise in the next four years. More than one-third of responding companies in the military and aerospace segment are currently embedding passive components in their boards. Embedding of passive and active components is expected to increase substantially by 2019 for all five applications studied.
PCB Technology Trends 2014 is available free to companies that participated in the survey. Other companies may purchase the report by visiting IPC’s online store. The price for IPC members is $675 and $1,350 for nonmembers. For more information or to purchase the report, click here.
About IPC
IPC is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,600 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
Suggested Items
Indium Corporation to Present, Exhibit at EPP InnovationsFORUM
03/28/2024 | Indium CorporationIndium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Indium Corporation, Industry Partners to Showcase Products “Live@APEX”
03/26/2024 | Indium CorporationIndium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.