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If you need the most current specifications for PCB materials used in rigid or multilayered printed boards, then it is time to upgrade to IPC-4101D-WAM1. This newly revised standard brings critical updates to the already valuable IPC-4101D, Specification for Base Materials for Rigid and Multilayer Printed Boards.
IPC-4101D-WAM1 delivers key updates for board designers, specifiers of board materials, and OEM’s who use and keep boards current with base materials used in PCBs. This revision:
- covers requirements for laminate or prepreg base materials used primarily for rigid and multilayer printed boards for electrical and electronic circuits
- contains 64 individual, keyword searchable specification sheets, including a brand new sheet that expands offerings for commercially available laminates and prepregs
- clarifies what is stated in the original release of IPC-4101D for the FR-4.0 materials as “None” for inorganic filler content, now states “
- adds table 3-10, Permissible Laminate Substitutions for Specification Sheets /21, /24, /26 and /30
This revision brings significant changes and clarifications. Learn more about how these updates can benefit you.
Upgrade to the IPC-4101D-WAM1
Pete Starkey, I-Connect007
As we stepped out of the hotel into the drizzling rain, we were relieved that it wasn’t snow. Looking down the escalator into the U2 platform in Munich’s Hauptbahnhof central station early on the morning of Tuesday, Nov. 15 and observing the mass of humanity pushing and shoving to cram into trains to the exhibition centre, it appeared that a significant proportion of the international electronics industry had gathered to attend electronica 2022, co-located with SEMICON Europa and recognised as the world’s leading trade fair and conference for electronics.
Nolan Johnson, I-Connect007
The industry news cycle seems to be picking up speed lately. Of course, 30 days into the quarter is about when public companies announce their results, and in the midst of this worldwide financial situation, we’ve got all eyes on anything coming out from our counterparts in the industry. I’ve noticed that global corporate results (Nan Ya PCB and TTM, in particular) do seem to be on everyone’s radar. In addition to financial news, trade shows are popping back up around the world—Europe, India, and a special report from editor Andy Shaughnessy, who took his own road trip to Raleigh, reporting on PCB Carolina, which had its own heyday this year.
IPC, in partnership with IPC Publishing Group (I-Connect007) will unveil an exciting new publication, "IPC Community," at IPC APEX EXPO 2023, as a continuation of its commitment to better serve the electronics industry and provide additional value for IPC members.