Latest Electronics Industry News

Global Semiconductor Equipment Billings Jump 38% YoY in Q3 2021
12/01/2021 | SEMI
Stanford Physicists Help Create Time Crystals with Quantum Computers
12/01/2021 | Stanford University
Comtech Awarded 5G Contract with Canadian Tier-One Carrier
12/01/2021 | Business Wire
Qualcomm, Google Cloud Collaborate on Neural Architecture Search for the Connected Intelligent Edge
12/01/2021 | Qualcomm Technologies, Inc.
CEOs Call on Congress to Strengthen U.S. Semiconductor Research, Design, Manufacturing
12/01/2021 | SIA
Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry
12/01/2021 | PRNewswire
SEMICON West 2021 to Gather Visionaries to Explore New Semiconductor Supply Chain Strategies, Opportunities
11/30/2021 | SEMI
Cigniti Enhances its 5G Assurance Focus with innovate5G Partnership
11/30/2021 | Business Wire
IoT CMP Vendors Add eSIM Management Capabilities to Simplify Logistics, Localize Connectivity
11/30/2021 | Berg Insight
Introducing Intel’s Long-Term Retention Lab
11/30/2021 | Intel
Siemens Partners with Hyundai Motor Company and Kia Corporation for Digital Mobility Transformation
11/30/2021 | Siemens
New Device Modulates Visible Light with the Smallest Footprint and Lowest Power Consumption
11/29/2021 | Columbia Engineering
A New Artificial Material Mimics Quantum Entangled Rare Earth Compounds
11/29/2021 | Aalto University
Nokia, Ooredoo Group Sign Strategic 5-year Agreement, Including 5G
11/29/2021 | GlobeNewswire
Peplink Sees Large Growth in 5G Demand as Partnership with M2M Connectivity Expands
11/26/2021 | GlobeNewswire
A*STAR, STMicroelectronics Team Up on Silicon Carbide R&D for EV Market, Industrial Applications
11/26/2021 | GlobeNewswire
Micron, UMC Announce Global Settlement
11/26/2021 | Micron
Ultrathin Solar Cells Get a Boost
11/26/2021 | Rice University
Intel Teams with Snowflake
11/26/2021 | Intel
NexOptic Optimizating on Qualcomm Technologies’ Snapdragon Mobile Platforms
11/25/2021 | GlobeNewswire
Intel Powers New Amazon EC2 Instance
11/25/2021 | Intel
Mavenir Announces Commercial Availability of 4G Open RAN-based Outdoor Small Cell
11/25/2021 | Business Wire
Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement
11/24/2021 | ANSYS
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas
11/24/2021 | Samsung
Next Generation Efforts in Wireless Communications Move Forward
11/23/2021 | Business Wire
2022 Will Mark a New Era for Wireless Innovation
11/23/2021 | PRNewswire
Siemens Reconfirms Commitment to Shipbuilding 4.0 with CESENA Opening
11/23/2021 | Siemens
Study: Semiconductor Supply Chain Remains Vulnerable Without Federal Investment
11/23/2021 | IPC
North American Semiconductor Equipment Industry Posts October 2021 Billings
11/23/2021 | SEMI
Rice Research: AI Technology No Silver Bullet for Hiring the Best Employees
11/22/2021 | Rice University

Keysight, Proventia Collaborate to Optimize Electric Vehicle Battery Test Solutions
11/22/2021 | Keysight Technologies, Inc.
Ericsson to Acquire Vonage for $6.2 Billion
11/22/2021 | PRNewswire
Qualcomm Sets New Growth Targets and Financial Guidance Through Fiscal 2024
11/22/2021 | Qualcomm Incorporated
Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications
11/22/2021 | Cadence Design Systems, Inc.
Ford, Purdue Patent Charging Station Cable for Quick EV Charge Research
11/19/2021 | Purdue University
Finnish Tampere Deck Arena Now Nokia Arena
11/19/2021 | GlobeNewswire
Realtek, Ansys Accelerate Complex IC Design for RFIC & High-Speed IC with Advanced Simulation Workflow
11/19/2021 | ANSYS
Intel’s Habana Labs Announces Turnkey AI Training Solution
11/19/2021 | Intel
Siemens Adds NVH System Prediction Capabilities to Simcenter Portfolio
11/19/2021 | Siemens
DuPont, Kempur Microelectronics Announce Collaboration
11/18/2021 | DuPont
Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack
11/18/2021 | Cadence Design Systems, Inc.
Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification
11/18/2021 | PRNewswire
Pushing the Limits of Electronic Circuits
11/18/2021 | MIT
SIA Applauds Bicameral Agreement on Path Forward for USICA
11/18/2021 | SIA
Nokia Announces Entry into Software-as-a-Service for CSPs with Multiple Services
11/17/2021 | GlobeNewswire
Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library
11/17/2021 | Cadence Design Systems, Inc.
Siemens Extends Support of Multiple IC Design Solutions for Samsung Foundry’s Process Tech
11/17/2021 | Siemens
Weak Bonds a Strength in Making Borophene
11/16/2021 | Rice University
Qualcomm, BMW Group to Extend Their Long-Lasting Technology Collaboration to Automated Driving
11/16/2021 | PRNewswire
Stanford Professors to be Honored for Excellence in Semiconductor Research
11/16/2021 | SIA
Lattice Acquires Mirametrix
11/16/2021 | Lattice Semiconductor
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm, 4nm Process Technologies
11/15/2021 | ANSYS
Athonet Announces Bring Your Own RAN Program for Private Networks
11/15/2021 | PRNewswire
Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards
11/15/2021 | Cadence Design Systems, Inc.
DOCOMO Develops Blade-free Drone Fitted with High-res Camera and LEDs
11/15/2021 | JCN Newswire
Keysight’s 5G Test Platforms Selected by Ti Group for Wireless Device Conformance Validation
11/12/2021 | Business Wire
Nokia Calls for Accelerated Digitalization and Green Energy Uptake
11/12/2021 | GlobeNewswire
Empower Semiconductor Signs Global Distribution Agreement with Mouser Electronics
11/12/2021 | PRWEB
Siemens’ AM Network to Facilitate Additive Manufacturing Workflow, Collaboration at Schaeffler
11/12/2021 | Siemens
Untangling Quantum Information at Columbia
11/11/2021 | Columbia University

FORESEE SPI NAND Flash: A Must-have Chip for 5G Devices
11/11/2021 | PRNewswire
Samsung, Orange Collaborate to Advance 5G Networks to a New Level
11/11/2021 | Samsung
Storing Energy in Plants with Electronic Roots
11/11/2021 | Linköping University
SEMICON West 2021 Hybrid to Highlight Solutions to Global Challenges, Smart Technologies, Talent
11/11/2021 | SIA
Surrey Researchers Reveal the Hidden Behaviour of Supercapacitor Materials
11/10/2021 | University of Surrey
OE-A Business Climate Survey – Printed Electronics Industry Proves Resilience
11/10/2021 | OE-A
Renesas Expands 5G mmWave Beamformer Portfolio With Transmitter Output Power Capability
11/10/2021 | Business Wire
Samsung Develops Industry’s First LPDDR5X DRAM
11/10/2021 | Business Wire
IBM Study: CIOs' Influence is Growing as Technology Becomes Core to Surveyed Enterprises
11/09/2021 | IBM
Altair Relaunches Startup Program
11/09/2021 | Altair
Ansys Selected by Panasonic Automotive for Future Mobility Technology
11/09/2021 | ANSYS
KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan
11/09/2021 | PRNewswire
IDC FutureScape: Top 10 Predictions for the Future of Digital Infrastructure
11/08/2021 | Business Wire
Navitas Introduces Third Generation GaN Power IC with GaNSense Technology
11/08/2021 | PRNewswire
Ambarella Closes Acquisition of Oculii
11/08/2021 | GlobeNewswire
Gatik, Walmart Achieve Fully Driverless Deliveries
11/08/2021 | Business Wire
SEMI: Global Silicon Wafer Shipments Reach Record High in Q3 of 2021
11/08/2021 | SEMI
Researchers Discover Predictable Behavior in Promising Material for Computer Memory
11/05/2021 | Georgia Tech
5G mmWave Large-Scale Rollout: IDTechEx Discusses If and When
11/05/2021 | PRNewswire
Siemens Named 'Leader' in Industrial Internet-of-Things Software Platforms Q3 2021 Report
11/05/2021 | Siemens
Samsung, Alphawave IP Announce Acceleration of Deep Partnership
11/05/2021 | GlobeNewswire
Qualcomm Collaborates with NEC to Develop 5G Open and Virtualized Solutions
11/05/2021 | Qualcomm Technologies, Inc.
SensiML Teams with onsemi for Industrial Edge AI Sensing Applications
11/04/2021 | PRNewswire
Annual DRAM Revenue for 2022 Expected to Reach US$91.5 Billion
11/04/2021 | Business Wire
Intel Powers New Azure Confidential Computing VMs
11/04/2021 | Intel
Enhanced Touch Screens Could Help You ‘Feel’ Objects
11/04/2021 | Steve Kuhlmann, Texas A&M University College of Engineering
IBM, NeuReality Team Up to Build the Next Generation of AI Inference Platforms
11/03/2021 | Meirovitch PR
Keysight Enables NEC Europe to Verify Performance of Open RAN Equipment
11/03/2021 | Business Wire
Kebotix on Cusp of 'Promising' OLED Breakthrough
11/03/2021 | PRNewswire
JMA Wireless, Kyocera to Accelerate 5G Deployment Across Japan
11/02/2021 | PRNewswire

Army Grants to Bolster Unique, New Semiconductor Fab Facility
11/02/2021 | University of Arkansas
proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring
11/02/2021 | PRNewswire
DENSO Contributes to a Decarbonized Society by Providing SiC Power Semiconductors
11/02/2021 | JCN Newswire
Why Is Sound the Best Way to Connect Headless IoT Devices – Trillbit
11/02/2021 | Business Wire
NICE AI, Robotics Technology Reduces Complexities for Key UK Government Agency
11/02/2021 | Business Wire
Q3 Global Semiconductor Sales Increase 27.6% YoY
11/02/2021 | SIA

Excerpt: The System Designer’s Guide to… System Analysis, Chapter 3

The third chapter of this book, "Limitations of Today's Electronic System Design," focuses on the variety of limitations that today’s electronics system designers face as data becomes evermore complex and the industry seeks alternatives past Moore’s law.
New Material Could Pave Way for Better, Safer Batteries
11/01/2021 | Brown University
Elbit Systems Expands Reliance on Sustainable Energy
11/01/2021 | Elbit Systems
SIA Commends Inclusion of Modified FABS Act in Reconciliation Package
11/01/2021 | SIA
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