Global Semiconductor Equipment Billings Jump 38% YoY in Q3 2021 12/01/2021 | SEMI
Stanford Physicists Help Create Time Crystals with Quantum Computers 12/01/2021 | Stanford University
Comtech Awarded 5G Contract with Canadian Tier-One Carrier 12/01/2021 | Business Wire
Qualcomm, Google Cloud Collaborate on Neural Architecture Search for the Connected Intelligent Edge 12/01/2021 | Qualcomm Technologies, Inc.
CEOs Call on Congress to Strengthen U.S. Semiconductor Research, Design, Manufacturing 12/01/2021 | SIA
Siemens Expands Collaboration with AWS to Facilitate Cloud-Based Digital Transformation for Industry 12/01/2021 | PRNewswire
SEMICON West 2021 to Gather Visionaries to Explore New Semiconductor Supply Chain Strategies, Opportunities 11/30/2021 | SEMI
Cigniti Enhances its 5G Assurance Focus with innovate5G Partnership 11/30/2021 | Business Wire
IoT CMP Vendors Add eSIM Management Capabilities to Simplify Logistics, Localize Connectivity 11/30/2021 | Berg Insight
Introducing Intel’s Long-Term Retention Lab 11/30/2021 | Intel
Siemens Partners with Hyundai Motor Company and Kia Corporation for Digital Mobility Transformation 11/30/2021 | Siemens
New Device Modulates Visible Light with the Smallest Footprint and Lowest Power Consumption 11/29/2021 | Columbia Engineering
A New Artificial Material Mimics Quantum Entangled Rare Earth Compounds 11/29/2021 | Aalto University
Nokia, Ooredoo Group Sign Strategic 5-year Agreement, Including 5G 11/29/2021 | GlobeNewswire
Peplink Sees Large Growth in 5G Demand as Partnership with M2M Connectivity Expands 11/26/2021 | GlobeNewswire
A*STAR, STMicroelectronics Team Up on Silicon Carbide R&D for EV Market, Industrial Applications 11/26/2021 | GlobeNewswire
Micron, UMC Announce Global Settlement 11/26/2021 | Micron
Ultrathin Solar Cells Get a Boost 11/26/2021 | Rice University
Intel Teams with Snowflake 11/26/2021 | Intel
NexOptic Optimizating on Qualcomm Technologies’ Snapdragon Mobile Platforms 11/25/2021 | GlobeNewswire
Intel Powers New Amazon EC2 Instance 11/25/2021 | Intel
Mavenir Announces Commercial Availability of 4G Open RAN-based Outdoor Small Cell 11/25/2021 | Business Wire
Ansys Receives 2021 TSMC OIP Partner of the Year Awards for Next-Generation Design Enablement 11/24/2021 | ANSYS
Samsung Electronics Announces New Advanced Semiconductor Fab Site in Taylor, Texas 11/24/2021 | Samsung
Next Generation Efforts in Wireless Communications Move Forward 11/23/2021 | Business Wire
2022 Will Mark a New Era for Wireless Innovation 11/23/2021 | PRNewswire
Siemens Reconfirms Commitment to Shipbuilding 4.0 with CESENA Opening 11/23/2021 | Siemens
Study: Semiconductor Supply Chain Remains Vulnerable Without Federal Investment 11/23/2021 | IPC
North American Semiconductor Equipment Industry Posts October 2021 Billings 11/23/2021 | SEMI
Rice Research: AI Technology No Silver Bullet for Hiring the Best Employees 11/22/2021 | Rice University
Keysight, Proventia Collaborate to Optimize Electric Vehicle Battery Test Solutions 11/22/2021 | Keysight Technologies, Inc.
Ericsson to Acquire Vonage for $6.2 Billion 11/22/2021 | PRNewswire
Qualcomm Sets New Growth Targets and Financial Guidance Through Fiscal 2024 11/22/2021 | Qualcomm Incorporated
Samsung Foundry Adopts New Tempus SPICE-Accurate Aging Analysis for High-Reliability Applications 11/22/2021 | Cadence Design Systems, Inc.
Ford, Purdue Patent Charging Station Cable for Quick EV Charge Research 11/19/2021 | Purdue University
Finnish Tampere Deck Arena Now Nokia Arena 11/19/2021 | GlobeNewswire
Realtek, Ansys Accelerate Complex IC Design for RFIC & High-Speed IC with Advanced Simulation Workflow 11/19/2021 | ANSYS
Intel’s Habana Labs Announces Turnkey AI Training Solution 11/19/2021 | Intel
Siemens Adds NVH System Prediction Capabilities to Simcenter Portfolio 11/19/2021 | Siemens
DuPont, Kempur Microelectronics Announce Collaboration 11/18/2021 | DuPont
Cadence Integrity 3D-IC Platform Qualified by Samsung Foundry for Native 3D Partitioning Flow on 5LPE Design Stack 11/18/2021 | Cadence Design Systems, Inc.
Synopsys Full EDA Flow First to Achieve Samsung Foundry 4LPP Process Certification 11/18/2021 | PRNewswire
Pushing the Limits of Electronic Circuits 11/18/2021 | MIT
SIA Applauds Bicameral Agreement on Path Forward for USICA 11/18/2021 | SIA
Nokia Announces Entry into Software-as-a-Service for CSPs with Multiple Services 11/17/2021 | GlobeNewswire
Samsung Foundry Adopts Cadence Liberate Trio Characterization Suite for 3nm Production Library 11/17/2021 | Cadence Design Systems, Inc.
Siemens Extends Support of Multiple IC Design Solutions for Samsung Foundry’s Process Tech 11/17/2021 | Siemens
Weak Bonds a Strength in Making Borophene 11/16/2021 | Rice University
Qualcomm, BMW Group to Extend Their Long-Lasting Technology Collaboration to Automated Driving 11/16/2021 | PRNewswire
Stanford Professors to be Honored for Excellence in Semiconductor Research 11/16/2021 | SIA
Lattice Acquires Mirametrix 11/16/2021 | Lattice Semiconductor
Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm, 4nm Process Technologies 11/15/2021 | ANSYS
Athonet Announces Bring Your Own RAN Program for Private Networks 11/15/2021 | PRNewswire
Cadence Wins Four 2021 TSMC OIP Partner of the Year Awards 11/15/2021 | Cadence Design Systems, Inc.
DOCOMO Develops Blade-free Drone Fitted with High-res Camera and LEDs 11/15/2021 | JCN Newswire
Keysight’s 5G Test Platforms Selected by Ti Group for Wireless Device Conformance Validation 11/12/2021 | Business Wire
Nokia Calls for Accelerated Digitalization and Green Energy Uptake 11/12/2021 | GlobeNewswire
Empower Semiconductor Signs Global Distribution Agreement with Mouser Electronics 11/12/2021 | PRWEB
Siemens’ AM Network to Facilitate Additive Manufacturing Workflow, Collaboration at Schaeffler 11/12/2021 | Siemens
Untangling Quantum Information at Columbia 11/11/2021 | Columbia University
FORESEE SPI NAND Flash: A Must-have Chip for 5G Devices 11/11/2021 | PRNewswire
Samsung, Orange Collaborate to Advance 5G Networks to a New Level 11/11/2021 | Samsung
Storing Energy in Plants with Electronic Roots 11/11/2021 | Linköping University
SEMICON West 2021 Hybrid to Highlight Solutions to Global Challenges, Smart Technologies, Talent 11/11/2021 | SIA
Surrey Researchers Reveal the Hidden Behaviour of Supercapacitor Materials 11/10/2021 | University of Surrey
OE-A Business Climate Survey – Printed Electronics Industry Proves Resilience 11/10/2021 | OE-A
Renesas Expands 5G mmWave Beamformer Portfolio With Transmitter Output Power Capability 11/10/2021 | Business Wire
Samsung Develops Industry’s First LPDDR5X DRAM 11/10/2021 | Business Wire
IBM Study: CIOs' Influence is Growing as Technology Becomes Core to Surveyed Enterprises 11/09/2021 | IBM
Altair Relaunches Startup Program 11/09/2021 | Altair
Ansys Selected by Panasonic Automotive for Future Mobility Technology 11/09/2021 | ANSYS
KLA Announces Grand Opening of $200 Million Second Headquarters in Ann Arbor, Michigan 11/09/2021 | PRNewswire
IDC FutureScape: Top 10 Predictions for the Future of Digital Infrastructure 11/08/2021 | Business Wire
Navitas Introduces Third Generation GaN Power IC with GaNSense Technology 11/08/2021 | PRNewswire
Ambarella Closes Acquisition of Oculii 11/08/2021 | GlobeNewswire
Gatik, Walmart Achieve Fully Driverless Deliveries 11/08/2021 | Business Wire
SEMI: Global Silicon Wafer Shipments Reach Record High in Q3 of 2021 11/08/2021 | SEMI
Researchers Discover Predictable Behavior in Promising Material for Computer Memory 11/05/2021 | Georgia Tech
5G mmWave Large-Scale Rollout: IDTechEx Discusses If and When 11/05/2021 | PRNewswire
Siemens Named 'Leader' in Industrial Internet-of-Things Software Platforms Q3 2021 Report 11/05/2021 | Siemens
Samsung, Alphawave IP Announce Acceleration of Deep Partnership 11/05/2021 | GlobeNewswire
Qualcomm Collaborates with NEC to Develop 5G Open and Virtualized Solutions 11/05/2021 | Qualcomm Technologies, Inc.
SensiML Teams with onsemi for Industrial Edge AI Sensing Applications 11/04/2021 | PRNewswire
Annual DRAM Revenue for 2022 Expected to Reach US$91.5 Billion 11/04/2021 | Business Wire
Intel Powers New Azure Confidential Computing VMs 11/04/2021 | Intel
Enhanced Touch Screens Could Help You ‘Feel’ Objects 11/04/2021 | Steve Kuhlmann, Texas A&M University College of Engineering
IBM, NeuReality Team Up to Build the Next Generation of AI Inference Platforms 11/03/2021 | Meirovitch PR
Keysight Enables NEC Europe to Verify Performance of Open RAN Equipment 11/03/2021 | Business Wire
Kebotix on Cusp of 'Promising' OLED Breakthrough 11/03/2021 | PRNewswire
JMA Wireless, Kyocera to Accelerate 5G Deployment Across Japan 11/02/2021 | PRNewswire
Army Grants to Bolster Unique, New Semiconductor Fab Facility 11/02/2021 | University of Arkansas
proteanTecs UCT Supports TSMC 3nm Process Technology to Accelerate Lifecycle Health Monitoring 11/02/2021 | PRNewswire
DENSO Contributes to a Decarbonized Society by Providing SiC Power Semiconductors 11/02/2021 | JCN Newswire
Why Is Sound the Best Way to Connect Headless IoT Devices – Trillbit 11/02/2021 | Business Wire
NICE AI, Robotics Technology Reduces Complexities for Key UK Government Agency 11/02/2021 | Business Wire
Q3 Global Semiconductor Sales Increase 27.6% YoY 11/02/2021 | SIA
Excerpt: The System Designer’s Guide to… System Analysis, Chapter 3
The third chapter of this book, "Limitations of Today's Electronic System Design," focuses on the variety of limitations that today’s electronics system designers face as data becomes evermore complex and the industry seeks alternatives past Moore’s law.
New Material Could Pave Way for Better, Safer Batteries 11/01/2021 | Brown University
Elbit Systems Expands Reliance on Sustainable Energy 11/01/2021 | Elbit Systems
SIA Commends Inclusion of Modified FABS Act in Reconciliation Package 11/01/2021 | SIA
