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EIPC Technical Snapshot: Thinking Differently in a Post-Pandemic World
07/22/2021 | Pete Starkey, I-Connect007
Anaya Vardya Discusses ASC’s Move into Additive Processes
07/20/2021 | Andy Shaughnessy, Design007 Magazine
Feeling the Supply Chain Squeeze
07/19/2021 | Nolan Johnson, PCB007
Catching Up With Archer Circuits’ Echo Yang
07/06/2021 | Dan Beaulieu, D.B. Management Group
Meet Luca Gautero, New PCB007 Columnist
06/30/2021 | I-Connect007 Editorial Team
PCB :: From The Show
Heraeus Introduces New High-Reliability Solder Paste
Manu Vaidya discusses the SMT650 high-reliability solder paste Heraeus Electronics is showcasing at APEX 2021 in order to satisfy rising automotive demands.
Real Time with… IPC APEX EXPO 2021: Developments in Digital Manufacturing
Michael Ford and Pete Starkey discuss the industry trend towards digital manufacturing, the latest in 3D CAD technology, ontological data and the benefits of the new IPC standard for digital twins.
HKPCA’s Audrey Sim Details Upcoming Electronic Circuits World Convention
Nolan Johnson speaks with Audrey Sim, executive director and vice president of operations for the Hong Kong Printed Circuit Association, about the upcoming Electronic Circuits World Convention, to be held November 30 through December 2, 2020. Ms. Sim gives Nolan an overview of the conference’s history, its scope as a printed circuit industry conference, and its shift to a hybrid virtual/physical format for 2020.
IPC’s Dr. John Mitchell Commends U.S. Manufacturers and Governors
On March 31, Dr. John Mitchell, IPC president and CEO, gave Barry Matties an update on the industry response to COVID-19 since their conversation on March 20. Mitchell provides an overall update on the industry, commending U.S. manufacturers for their proactive responses.
The Smart Factory: All the Bits and Bobs
“Smart factory” is another phrase that describes Industry 4.0 programs. These programs seem to have replaced CIM and CAM, but it did not make them obsolete. While these topics are getting a lot of press, there is nothing new about them. We have been on a journey to automate manufacturing since the mid-‘70s. What has evolved are faster and cheaper computers, and more complex and integrated networking.
Alumni Week at IPC APEX EXPO 2020
When you see friends and colleagues just once a year, you would think there would be a lot of catching up to do. That’s not the case at IPC APEX EXPO. Greeting friends and colleagues is always like picking up a conversation you had with them yesterday. Everyone looks the same, acts the same (we age well and lightly!), and we talk about the same things with just slight modification—like a daily conversation would evolve.
I-Connect007 Research: Readers Share Advice on COVID-19
In our survey this week, we asked readers what advice they might have for friends and colleagues in the electronics industry regarding the COVID-19 outbreak. Because this survey question was open-ended, some respondents shared more than one piece of advice; therefore, astute readers may notice that the graph totals more than 100%.
One Year Later: IPC Education Foundation Update
In this video interview from IPC APEX EXPO, Aaron Birney, education program manager for the IPC Education Foundation, speaks with Guest Editor Steve Williams about the foundation's focus on STEM, its growth over the past year since launching at IPC APEX EXPO 2019, and how IPC members can get involved and sponsor student chapters.
2020 EIPC Winter Conference, Day 2
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.
David Bergman: CFX a Key Ingredient of Smart Factories
In this video interview from the show, Jennie Hwang and David Bergman, IPC's VP of standards and training, address the use of CFX to facilitate plug-and-play smart factories. IPC APEX EXPO 2020 offered a variety of demonstrations of CFX, IPC’s Connected Factory Exchange.
Rogers Continues to Grow and Adapt
In this video interview from the show, Guest Editor Judy Warner and Tony Mattingly, senior product manager at Rogers Corporation, discuss the state of materials at the company, as well as the Rogers innovation centers the company has opened recently.
The Success of IPC’s STEM Student Outreach Program
The IPC Education Foundation (IPCEF) hosted its STEM Student Outreach Event on February 6 at IPC APEX EXPO in San Diego. Nine local high schools attended bringing 193 students and 30 educators from Mission Hills High School, Morse High School, North County Trade Tech High School, Saint Marcos High School, E3 Civic High School, Point Loma High School, Otay Ranch High School, Mount Miguel High School, Otay Ranch High School—Girls in STEM. Twice as many students were able to participate this year, and each participating high school received a $1,000 grant and soldering station to enhance STEM-related learning at their school.
Catching up With Flexible Circuit Technologies
Dan Beaulieu catches up with Troy Koopman, president and co-founder of Flexible Circuit Technologies (FCT), and Carey Burkett, the company’s VP of business development. FCT is a full-service flex and rigid-flex supplier.
CML Poised to Be ‘More Than a Manufacturer’
The I-Connect007 Editorial Team recently spoke with Chris Minard, director of business development at CML, about how CML’s business model has evolved and some of his insights about manufacturing trends around the globe right now.
EIPC Winter Conference: Business, Technology, and Community
Managing Editor Nolan Johnson recently spoke with Kristen Smit-Westerberg about the upcoming EIPC Winter Conference, February 13−14, 2020, in Rotterdam.
IPC APEX EXPO Technical Session Preview
Brook Sandy-Smith, IPC technical conference program manager, previews the technical side of IPC APEX EXPO 2020, which includes the customary technical sessions, but also some new wrinkles like the fundamentals program and “sessions @ the intersection” to encourage more interaction.
Streamlining Inspection and Verification
Barry Matties speaks with Vladi Kaplan, VP of marketing for CIMS, about the company’s newest verification station, the benefits operators will see from its colorized real-time video, and how it makes verification much faster and much more efficient for companies pushing 100% inspection.
CES Slideshow: The Future Is Now
During the Consumer Electronics Show in Las Vegas, Nevada, the I-Connect007 Editorial Team met with some of the industry's top executives, managers, and engineers. Enjoy this slideshow from CES week.
CES 2020 Automotive: The Future Looks Like a Box
CES week has been true to the themes set forth by Steve Koenig on Sunday, and having spent most of Wednesday in the North Hall of the Las Vegas Convention Center—the automotive pavilion—I can say that Koenig was right: the electric vehicle has reached an inflection point. And along with electric propulsion came autonomous operation.
Ledia 6 Direct Imaging System Offers Enhanced Speed and Precision
Technical Editor Pete Starkey recently met with Ucamco’s Michel Van den heuvel, imaging product group director, to discuss the benefits of the Ledia 6 direct imaging system, which was introduced earlier this summer and features scan-alignment and improvements in registration and positioning accuracy.
Electra Polymers: Inkjet Soldermask is Ready, Reliable and Green
Editor Pete Starkey and Tibbals discuss Electra Polymers’ move into the inkjet soldermask market, and some of the challenges and benefits of this technology. Tibbals explains how inkjet soldermask can enable end-users to improve reliability of the final product, for instance, because this additive process allows manufacturers to control the thickness of soldermask around vias and BGAs and eliminating trapped chemistry in undercut areas.
The CPCA and China’s Electronic Circuit Industry: Past and Future
Wang Longji is the honorary secretary-general of the China Printed Circuit Association. He is a senior engineer and an industry leader and used to be the production manager of the first imported PCB manufacturing line in China. Mr. Wang is also a well-known child actor and a “national treasure;” one of his most famous characters was San Mao in “The Winter of Three Hairs.”
Pluritec Takes Industry 4.0 to the Next Level
Pete Starkey and Pluritec’s Nicola Doria, president and CEO, discuss how the structure of Pluritec has developed over the past few years, now including many respected brand names that are long familiar in the PCB fabrication segment. Doria also explains how the company is continuing its implementation of Industry 4.0 processes.
Industry Set for Shift to True 3D Printing and Photonics
Nolan Johnson sits down with Zach Peterson, owner of Northwest Engineering Solutions, who predicts two things that would challenge the current status quo for the PCB manufacturing industry: true 3D printing and additive, including discretes as well as the substrates and traces, and a completely different approach with photonics.
Nolan’s Notes: Clarity of Vision
In this issue, we update your prescription, clarify your vision of the industry, and bring your own perspective into view. With each interview, try on another outlook and look at the industry from another point of view.
Conductivity Laminate for High-frequency Applications
Editor Pete Starkey and Vitali Judin discuss how Rogers Corporation has responded to demands for high thermal conductivity combined with low loss in high-power RF applications with the newly launched. The PTFE-based TC350 Plus is capable of handling temperatures above 125°C and draws upon Rogers’ long experience with the TC350 material line-up.
Atotech’s Graphite-based Process and Chemistries Portfolio
Dr. Brüning, global product director, desmear and metallization, and electronics consultant Johan Lundqvist, update Nolan Johnson on the ViaKing graphite-based direct metallization process and explain how it fits in with customer applications. They also discuss Atotech’s portfolio of various chemistries. Johan came to Atotech in August 2019 through the acquisition of J-KEM where he held the position of CEO. Johan stated, “We are pleased J-KEM has joined the Atotech family, as it makes sense for both sides.”
EIPC Winter Conference—Speakers and Papers
I recently spoke with Kirsten Smit-Westenberg, executive director of EIPC, who is planning the EIPC winter conference set for February 2020 in Rotterdam, Netherlands. Kirsten discusses the conference topics, which are based around the needs of the next-generation electronic devices, and changes in fabrication solutions for PCBs, PCBAs, materials, and technologies.
5G is Coming With Quantum-Level Advances and Features
I am sure that, by now, all of you have heard about 5G (the fifth-generation of mobile phone and data communication standards). I am also relatively sure that many of you think that this means neat, new cellphone features, and perhaps more texting and selfie abilities. While that may be true, getting a new cellphone for those reasons would be like getting a new car because you want a different color.
Communication, Part 6: The Importance of Technology Fit
In the final installment of this series on how PCB fabricators and designers can better communicate, Bob Chandler from CA Design and Mark Thompson from Prototron Circuits discuss the importance of “technology fit” and how this concept impacts the synergy of the two parties involved.
Chuck Bauer: SMTAI 2019 Founder's Award Recipient
At the recent SMTAI conference and exhibition, Chuck Bauer, Ph.D., senior managing director at TechLead Corporation, received the Founder's Award, a prestigious award given to a member who has made exceptional contributions to the industry and provided ongoing support and service to the SMTA.
Real Time with… SMTAI 2019 Slideshow
The SMTA International 2019 Conference and Exhibition closed last week on a high note. For those who were not able to attend the event, held at Stephens Convention Center in Rosemont, Illinois, the slideshow contains a selection of photos from the exhibition show floor as well as the conference.
Alun Morgan on Thermal Management and LEDs in Automotive
Guest Editor Judy Warner met with Alun Morgan, technology ambassador for Ventec International Group, to discuss topics addressed at the Automotive Executive Forum that took place at IPC APEX EXPO 2019. Morgan describes his presentation and findings centered around thermal management in automotive, specifically LEDs, as well as the unique set of growing thermal management challenges Tier 1 suppliers are now facing in the automotive sector.
RTW IPC APEX EXPO: Orbotech West on Supporting Customer Needs
Orbotech West President Sharon Cohen speaks with Kelly Dack about Orbotech West’s restructuring to better support customer needs, their customer monitoring center, and hints at the capabilities of new products coming soon.
Advance Your Company Through Automation
At the recent IPC APEX EXPO 2019, Yash Sutariya discusses with Patty Goldman the labor shortage he has experienced in the Detroit area, the impact automation can have in the manufacturing process, and other strategies to advance your company.
RTW IPC APEX EXPO 2019: MivaTek Discusses Flatbed LED Direct Imaging Systems
Brendan F. Hogan, managing director for MivaTek Global, and Chris Hrusovsky, VP of business development, give Pete Starkey their outlook on the market for flatbed LED direct imaging systems, report spectacular sales success, and describe their new introductions for large-format, dual-tray and microelectronics systems.
Automation on Full Display at Recent China Exhibitions
With the rising cost of labor in China, the growing demand for automation has never been stronger. At the recent productronica China 2019, and accompanying shows, one hall was packed full of automation technology. This video gives you a glimpse into what was on display… and the new workforce.
RTW IPC APEX EXPO 2019: Miraco Discusses Flexible Circuit Products and Offerings
Jason Michaud is the vice president of sales and marketing at Miraco Inc. In this interview, Michaud discusses with Joe Fjelstad the history of the company, and their flexible circuit products and offerings. He also talks about how they are helping customers improve their product designs.
RTW IPC APEX EXPO 2019: MacDermid Alpha Discusses Recent Company Rebranding
Senior VP Joseph D’Ambrisi of MacDermid Alpha Electronics Solutions speaks with Steve Williams about the recent rebranding of the business, and the benefits to their customers.
RTW IPC APEX EXPO 2019: Arlon Discusses Investments and Important Role of a Niche Supplier
Arlon Electronic Materials President Brad Foster sits down with Nolan Johnson to discuss capital investments the company is making in business expansions and upgrades, and the important role a niche supplier plays in the North American quick-turn electronics market.
RTW IPC APEX EXPO 2019: Ucamco Discusses Latest Evolution of PCB Software
Ucamco Managing Director Karel Tavernier speaks with Dan Feinberg about their aim of automating the CAM process as much as possible. He also discusses the recent evolution of their PCB software.
RTW IPC APEX EXPO 2019: Insulectro Sees Growth and Opportunities in Printed Electronics
Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.
RTW IPC APEX EXPO 2019: Limata Unveils Exciting Developments in LDI
Lino Sousa, sales, Limata, explains to Pete Starkey the latest developments in Limata’s laser direct imaging technology, which eliminates the need to change the solder mask.
Accelerating and Disrupting Innovation: The Tesla Story
The time was right for Tesla to bring new thinking into the concept of electric transportation when the company observed the quantum shift in battery technology from lead-acid to lithium-ion that had been driven by developments in portable consumer electronics.
RTW IPC APEX EXPO 2019: Pluritec Partners: Information Systems, ECOSPRAY, & OCCLEPPO
Pluritec VP of Sales Lino Sousa discusses the history of Pluritec and its relationships with Information Systems and ECOSPRAY. He also announces the purchase of the assets and identity of OCCLEPPO, and describes the long-term plan for the integrated one-stop-shop.
RTW IPC APEX EXPO 2019: LPKF on Benefits of Laser Depaneling
Laser technology marches on, and marching along with it is LPKF's new line of laser depaneling equipment. Stephan Schmidt, president, talks with I-Connect007 Guest Editor Kelly Dack about the many benefits of using lasers including cleanliness and higher yields through increased array density.
RTW IPC APEX EXPO 2019: Super PCB Discusses High-end PCB Procurement Services
Kelly Dack speaks with Jessica Zhang, program manager for Super PCB, who focuses on serving customers with a small-business-type relationship. Based in Plano, Texas, Super PCB matches customer design requirements to a myriad of supplier capabilities through time-saving, direct communication with the supplier and best pricing.
RTW IPC APEX EXPO 2019: MacDermid Alpha on Affinity for ENIG
John Swanson, director of final finishes for MacDermid Alpha Electronics Solutions, speaks with I-Connect007 Guest Editor Kelly Dack about the ENIG finish process and their new product Affinity, which smooths out the challenges of the process.
RTW IPC APEX EXPO 2019: CBT and Technica’s Relationship, Roadmap, and Equipment
Pete Starkey speaks with David J. Clark, CBT project director, and Najib Khan, photoimaging product manager at Technica, who explain the background of their companies and their current working relationship. Further, they address their technology roadmap, and the unique features of their direct imaging equipment—particularly the registration accuracy that can be achieved.
RTW IPC APEX EXPO: Rogers' Anthony Mattingly Discusses the Advanced Laminate Market
Rogers Corporation's Senior Product Manager Anthony Mattingly and Editor Pete Starkey discuss the ever-evolving market for advanced laminates for technologies such as 5G. Mattingly explains how Rogers has invested heavily in infrastructure for adding about 40% more capacity in the next few years.
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed with the success of the heavy gold deposition process they discussed last year. It has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
RTW IPC APEX EXPO 2019: The Circle Is Complete
Jesse Ziomek, sales specialist for North and South America at DIS Inc., speaks with I-Connect007 Technical Editor Pete Starkey on the growth of the company in the global market, and how DIS continues to make life easier for fabricators of rigid, flex, and rigid-flex multilayers by showing them the benefits of their pinless registration systems.
RTW IPC APEX EXPO 2019: Taiyo Discusses New Solder Masks and Photoimageables
Donald Monn, Midwest regional sales manager for Taiyo America, turns the tables on I-Connect007 Technical Editor Pete Starkey and quizzes him about his knowledge of Taiyo's new crack-resistant white solder mask for automotive, and the company's standard photoimageables re-formulated for laser direct imaging (LDI) that avoid the need for UL requalification.
RTW IPC APEX EXPO 2019: Ventec's Goodwin on Global Technology Directions
Mark Goodwin, Ventec International Group CEO EMEA and USA, comments on technology directions globally and in the North American market. He also explains how Ventec's quality accreditations, technical expertise, and flexible manufacturing capacity continue to strengthen their leading position.
RTW IPC APEX EXPO 2019: Atotech Discusses Developments in Metallization Chemistries
Roger Massey, technical marketing manager at Atotech, and Technical Editor Pete Starkey discuss the challenges technologists face as circuit lines and spaces get smaller and smaller, and the latest developments in metallization chemistries to help customers address these issues.
Better Together: How HDP User Group Showcases the Industry’s Best Side
HDPUG is a non-profit trade organization comprised of members from top companies in the electronics industry, from materials suppliers and manufacturers, to OEMs and end users. Key activities include collaborating on issues facing multiple industries and bringing people together on projects who might not have met otherwise. Barry Matties met HDPUG’s European representative and project facilitator Alun Morgan at the recent EIPC Summer Conference to learn more about the group and current projects.
14th Electronic Circuits World Convention
The 14th Electronic Circuits World Convention (ECWC14) started in Seoul to the usual fanfare after the opening ceremonies of KPCA 2017. The ribbon-cutting ceremony was conducted by KPCA’s Jung Bong Hong and the representatives of the other WECC members: WECC Secretary General Rex Rozario; Jin Zhangi (CPCA); Alun Morgan (EIPC); Vikram Desai (Electronic Industries Association of India); Canice Chung (Hong Kong PCA); David Bergman (IPC); Kushal Patel (IPCA); Toshifumi Kobayashi (JPCA), and Rich Wu (TPCA).
Global Impact on European PCB Fabrication: EIPC Summer Conference 2017, Day 1
Electronics industry professionals from 13 countries, mainly from Europe and Scandinavia, others from the USA, but some from as far away as India and Japan, gathered in Meriden, the centre of England, for the EIPC Summer Conference.
Rockwell Collins’ Doug Pauls Discusses Volunteering, Mentoring and Their Road Show
I was happy to see Rockwell Collins’ Doug Pauls receive IPC’s Raymond E. Pritchard Hall of Fame award at IPC APEX EXPO, well-deserved for him, and I wanted to chat with him about it. As with so many conversations at the conference this year, the talk quickly turned to inspiring interested young people in our “graying” industry. We also discussed the nature of volunteering and what we get out of it.
Weiner’s World – March 2017
The CPCA show held at the China International PCB And Assembly Show was moderately busy even though the new venue was not quite ready (no escalators, the "water closets" not fully finished, the heat was only on for a few hours one day). It showcased products for PCB Manufacturing, Electronic Assembly Materials and Manufacturing Services.
RTW IPC APEX EXPO: atg Luther & Maelzer's Fully Automated Probe Testing for High-Throughput HDI PCB Production
Klaus Koziol, director of sales at atg Luther & Maelzer, explains the rationale behind the development of the newly-introduced A8A from atg and discusses how the latestinnovations in high-accuracy automatic testing deliver high throughput whilst retaining the flexibility of flying-probe techniques.
A Conversation with Gene Weiner
In a discussion following the PCB Executive Forum at IPC APEX EXPO in February, Gene Weiner opened up to Barry Matties and Patty Goldman on the state of the North American electronics industry supply chain and the importance of cooperative efforts up and down that supply chain.
RTW IPC APEX EXPO: New Dimensions in Fine-Pitch Probe Testing from Microcraft
MicroCraft introduces two new product lines. Regional Sales Manager Jesse Ziomek describes a flying-probe tester capable of hitting 0.4 mil pads at 2 mil pitch without sacrifice of testing speed, and a digital ink-jet printer able to print both solder resist and legend in the same cycle.
RTW IPC APEX EXPO: John Davignon Offers HDPUG Update
The HDPUG (High-Density Packaging User Group) is an industry consortia designed to leverage members expertise to solve a variety of problems and issues affecting the electronics industry. Recent examples include the publication of project for the effects on back drilling on PTH reliability and reliability of press fit technology.
Ray Pritchard Looks Back at IPC’s Beginning and His Role in Getting it Started
I have known Ray Pritchard for a long time—as long as I’ve been involved with IPC, in fact. He directed the organization for 35 years before turning over the reins. One could say he grew up with the organization—or vice versa. Ray was always a bundle of energy and still is, still joking and warm, a great people person, and I am sure he had a little something to do with the spirit of camaraderie and cooperation that is the hallmark of the IPC we know today.
RTW CPCA: Helmut Fischer Discusses Solutions Approach in PCB Measurements
Dr. Wolfgang Babel, CEO and president of Helmut Fischer Group, discusses Industry 4.0, automation, and advanced solutions in PCB measurements.
RTW IPC APEX EXPO: HDPUG Discusses the Impact of Copper Bonding Treatment on Signal Integrity
Jim Fuller, vice president of engineering and technology development at Sanmina, gives an insight on how HDPUG, the High Density Packaging User Group, shares the experience and resources of member companies to tackle projects and get results, and reviews the study of the effect of copper bonding treatment on signal integrity.
Now, isn’t that the mantra we all hear today? For me, it’s Tai Chi to maintain physical flexibility. But of course, that is not what we’re here for. We’re talking flexible circuits including all the variations of same, which is why we called this issue “The Wide World of Flex.” Because the world of flex is broad—and it’s rapidly getting wider.
RTW IPC APEX EXPO: Schmoll and Taiyo America Partner to Speed Up Solder Mask Development
How to accelerate the development of specialist direct-imaging solder resists to suit the requirements of the Asian and North American markets? Jesse Session, technical manager at Taiyo America, describes how close collaboration between ink formulator and equipment supplier enables the optimization to be achieved most effectively.
RTW CPCA Show 2017: ESI Discusses Latest Innovations in Laser Drilling
At the recent CPCA Show 2017 in Shanghai, China, Mike Jennings, director of marketing for flex and interconnect products at Electro Scientific Industries Inc. (ESI), highlights their expertise in laser drilling, as well as being the first roll-to-roll capable UV laser drill provider. He also talks about their recently released RedStone PCB laser processing system, a low cost-of-entry solution for FPC manufacturers considering the adoption of laser processing for flex PCB.
RTW IPC APEX EXPO: The Power of Synergies with MacDermid Enthone and Alpha Assembly Solutions
Don Cullen, global director of marketing communications with MacDermid Enthone, and Tom Hunsinger, VP global marketing with Alpha Assembly Solutions explain the structure of MacDermid Performance Solutions, which combines the former MacDermid, Enthone and Alpha Assembly Materials businesses to provide PCB and EMS industries with enhanced innovation and service throughout the supply chain, with unified sales strategies and improved processes.
RTW IPC APEX EXPO: IPC Validation Services Update
Randy Cherry, IPC's Director of Validations Services speaks with Guest Editor Judy Warner. Randy gives an update on the QML and QPL programs, including updates on the newest QPL program for copper clad laminates. They also discuss the growing value of industry engagement with VS as the number of certified facilities increases.
Rogers' John Ranieri Discusses 92ML Conductive Epoxy Materials for Power Electronics
John Ranieri, Business Development Manager for Rogers Corporation, sat down for an interview with me at IPC APEX EXPO in San Diego. He discussed Rogers’ 92ML™ series of thermally conductive epoxy materials, and some of the challenges facing technologists in the power electronics market.
Weiner’s World—February 2017
IPC APEX EXPO 2017 was the best in five or more years. The 60th annual meeting drew a crowd. The meetings were good. The mood was upbeat. There were reports of new orders from Asia as well as the Americas, and news of increasing business from the show floor. IPC membership was up in all its regions to more than 4,000.
CPCA Moves into New Venue for 2017 Show
I-Connect007 China Editor Edy Yu recently interviewed Jin Zhang, CPCA Secretary General, via e-mail. They discussed the upcoming CPCA Show, scheduled for March 7-9, and some recent changes, including the move to a new venue for this year’s annual event.
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