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EIPC Technical Snapshot: Thinking Differently in a Post-Pandemic World
07/22/2021 | Pete Starkey, I-Connect007
Anaya Vardya Discusses ASC’s Move into Additive Processes
07/20/2021 | Andy Shaughnessy, Design007 Magazine
Feeling the Supply Chain Squeeze
07/19/2021 | Nolan Johnson, PCB007
Catching Up With Archer Circuits’ Echo Yang
07/06/2021 | Dan Beaulieu, D.B. Management Group
Meet Luca Gautero, New PCB007 Columnist
06/30/2021 | I-Connect007 Editorial Team
PCB :: Materials
Why We Simulate
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.
EIPC Technical Snapshot: Supply Chain and Material Price Pressures
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.
Driving Down Cost with Process Engineering
Nolan Johnson, Barry Matties, and Happy Holden speak with Matt Mack, process engineer at ICM Controls. Matt shares a day in the life of a process engineer, along with how he approaches continuous improvement and planning for the future on the floor.
Time, Space, Structure, and Model Analysis of CCL Price Increase
According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.
EIPC Technical Snapshot: 5G and Loss Minimisation
Bringing a specialised technical area into sharp focus, this month’s topic was “5G and the understanding of loss minimisation at the PCB level,” with papers on dielectric material, copper foil, and modelling solutions. The webinar was moderated by EIPC board member Paul Waldner managing director of Multiline International Europa, who admitted that he had managed to get a haircut especially for the occasion!
Achieving Growth in a Difficult Year: The Benefits of Global Supply Chain Management
Jack Pattie, president of Ventec USA, discusses the growth of the business, the strengthening of the operation, quality system accreditations, the advantages of building close working relationships with OEMs, and how a well-managed global supply chain has overcome some of the challenges and frustrations encountered during the past year.
EV Industry Facing Bottleneck Challenges
Nolan Johnson talks with Eduardo Benmayor, general manager at Aismalibar, about materials challenges facing the powertrain portion of the automotive EV industry. Eduardo also speaks about what he sees as the biggest challenge facing EVs—infrastructure.
Present and Future Industry Trends With Denkai America
Editor Dan Feinberg recently spoke with Chris Stevens, global sales manager for Denkai America, the only electrodeposited copper foil manufacturer in North America. During this conversation, Chris provides his view of present and emerging trends, the need for higher speed digital designs, and overall business conditions over the past year.
ICT Webinar: Novel Materials and Methods for Printed Circuit Fabrication
For the first time since its foundation in 1974, the Institute of Circuit Technology had no alternative than to conduct its Annual General Meeting online. The event, which took place on February 25, 2021, was remarkably well-attended, and was followed, as is traditional, by a technical seminar. The seminar became a webinar focused on novel materials and methods for printed circuit fabrication and moderated by ICT Chair Emma Hudson.
Benchmarking With Your Suppliers: What to Know About Solder Mask
Everyone wants a smooth-running solder mask process with high productivity and minimal rejects, but to achieve this you really need a firm understanding of what your current process is capable of, what its limitations are, and what you want to improve. Process capability benchmarking is a great way to identify and implement improvements within your process.
Kemmer Praezision Partners with Insulectro
In this interview, Nolan Johnson and Gregor Dutkiewicz discuss Kemmer Praezision, their new working partnership with Insulectro, and some of the recent market challenges in mechanical drill bit technology.
Seven Tips for Your Next Stackup Design
Rarely do we have the luxury of designing a board just for connectivity. When interconnects are not transparent, we must engineer them to reduce the noise they can generate. This is where design for signal integrity, power integrity and EMC—collectively high-speed digital engineering—are so important. Eric Bogatin offers seven tips for stackup design.
EIPC Technical Snapshot: Business Outlook
A headline in a Sunday newspaper had caught John Ling’s eye as he composed the invitation to this fourth EIPC seminar: “Now, more than ever, we need to talk.” Thus, it is that EIPC decided to run another technical webinar, which was just like one of their in-person conferences, except no one had to travel—or got to enjoy a beer or excellent food with convivial company.
Bruce Mahler Discusses Ohmega Technologies' Acquisition by Arcline Investment Management
I-Connect007’s Nolan Johnson catches up with Bruce Mahler, vice president and general manager at Ohmega Technologies, about Thursday’s announcement that Ohmega Technologies has been acquired by Arcline Investment Management. Mahler outlines the new opportunities this presents for Ohmega Technologies and discusses how this change in ownership will benefit existing customers and markets as well.
Top 10 Most-Read PCB Articles of 2020
As 2020 comes to a close, the I-Connect007 Editorial Team takes a look back at its most read articles. Here are the top 10 reads in PCB from the past year.
EIPC Technical Snapshot: PCB Surface Finishes
For the third in a series of Technical Snapshot webinars, EIPC chose to focus on PCB surface finishes, comparing specific properties, examining corrosion behaviour and discussing selection criteria for low-loss, high frequency applications.
Happy’s DIY Solution to Chemical Control
I confess. I am a control nerd and highly analytical. My second degree is in EE control theory, and I see the world in terms of feedback loops and black boxes. Early in my career, I was volunteered for the technical programs for the California Circuits Association (CCA), which was created by my mentor Clyde Coombs. In discussions with fellow process engineers, it was clear that the chemical process controls that HP could afford and allow me to put in place were not able to be duplicated by much smaller PWB shops.
Pacothane on the Future of Laminate Technologies
Nolan Johnson recently spoke with the Pacothane Technologies team about the current drivers of circuit board technology and how that has influenced and increased their product development of lamination and lamination assist products.
GreenSource Fabrication Creates Plating Flexibility
The I-Connect007 editorial team spoke with GreenSource Fabrication’s Alex Stepinski, VP and officer, and Rick Nichols, product engineer, about plating capabilities, new equipment developments, and how best to create more plating flexibility in a shop.
EIPC Technical Snapshot: Market Analysis and Advanced Manufacturing Tech
Pete Starkey details the November EIPC webinar program that combined knowledgeable market analysis and advanced manufacturing technology, including insights from Prismark's Dr. Shiuh-Kao Chiang, Averatek's Mike Vinson, and Atotech's Roland Herold.
Catching up With QCMS General Manager Rick McAnally
Founded in 2007, QCMS is one of the more interesting EMS companies on the East Coast. They are actually a sister company to Niche Electronics located in Pennsylvania. Dan Beaulieu interviews QCMS General Manager Rick McAnally.
Institute of Circuit Technology Technical Webinar
With its regular program of physical seminars and symposia on hold, the Institute of Circuit Technology went virtual and presented a webinar of three technical papers, organized by Technical Director Bill Wilkie and introduced by IPC Chair Emma Hudson. Pete Starkey brings you all the details.
This Month in PCB007 Magazine: The Copper Foil Market Is Anything But Flat
Nolan Johnson interviewed Mike Coll, COO of Denkai America, about the copper foil and substrate market, the recent acquisition of the company by Nippon, and what they’re doing to respond to very small feature sizes.
Real Time with… Altium Live Europe 2020: Rick Hartley’s Secrets of PCB Optimization
As Lawrence Romine said in his introduction, “There’s that moment when you sit in the crowd and hear Mr. Rick Hartley speak that you know you’ve arrived in PCB design.” With 50 years in the industry focused on circuit and PCB design—and as a specialist in EMI, noise, and signal integrity issues—Rick Hartley was invited to talk about PCB optimization. Pete Starkey provides an overview of the presentation.
EIPC Technical Snapshot: Automotive Technology
Although current circumstances have forced the postponement of its live conferences, seminars, and workshops, EIPC continues to provide a platform for the exchange and dissemination of the latest knowledge and technical information to the European interconnection and packaging industry. Pete Starkey details how its current series of technical snapshots, delivered in a webinar format, address technology challenges facing the automotive, telecom, and high-speed sectors of the industry.
Real Time with… AltiumLive: Eric Bogatin on Unlearning What You’ve Learned
The second day of the virtual AltiumLive 2020 event got off to a great start with a class by Dr. Eric Bogatin. It was officially titled “You Must Unlearn What You’ve Learned,” but it could have just as easily been called “Designing Interconnect That Sucks Less.”
Just Ask Paul: Automotive and Lead-Free Solders
We asked you to send in your questions for Happy Holden, Joe Fjelstad, Eric Camden, John Mitchell, and Greg Smith in our “Just Ask” series. Now, MacDermid Alpha Electronics Solutions’ Paul Salerno gets a chance to answer a question. Paul Salerno is a global portfolio manager for SMT applications focused on the automotive and consumer market segments. He holds a bachelor’s degree in materials engineering as well as an MBA in finance and marketing from Rutgers University.
Real Time with… SMTAI 2020: Reflections on the Technical Conference
This year’s SMTA International Conference and Exposition went virtual! Pete Starkey explains how the SMTA team did a fine job in difficult circumstances to present an interactive show and technical conference. Here, he highlights four of the papers that particularly caught his interest.
Real Time with… SMTAI 2020: Technical Conference Review
SMTAI 2020, which was converted to a virtual event, took place from September 28–30. I attend every year, but since there was no keynote in the virtual format, I went straight to the technical conference. This event covered a broad range of topics related to everything in assembly. Over 90 technical presentations are available, but this report covers just some of the sessions I attended.
Just Ask John Mitchell: The Exclusive Compilation
We asked for you to send in your questions for IPC President and CEO John Mitchell, and you took us up on it! We know you all enjoyed reading these questions and answers, so we’ve compiled all of them into one article for easy reference. We hope you enjoy having another bite at the apple. And if you’d like to hear more from John Mitchell, view his column series “One World, One Industry.”
Real Time with… SMTAI 2020: SMTA Announces Members of Distinction Annual Awards
SMTA recognized exceptional individual and corporate members for their immeasurable contributions to the association since 1994. And while the SMTA International Technical Committee announced the best presentation and paper awards from the 2019 conference on March 18, 2020, recipients were also recognized at SMTAI 2020.
Real Time with...SMTAI 2020: MacDermid Alpha’s Single-Step Metalization Paper
Nolan Johnson talks with MacDermid Alpha Electronics Solutions about a new process for filling through-holes with copper in a single step. Carmichael Gugliotti, the primary author and an applications specialist, and Richard Bellemare, director of electrolytic metalization, address why this new process matters and what’s in Gugliotti’s technical paper presentation for SMTAI.
Just Ask John Mitchell: Blurring the Lines of Technology
First, we asked you to send in your questions for Happy Holden, Joe Fjelstad, and Eric Camden in our “Just Ask” series. Now, it’s IPC President and CEO John Mitchell’s turn! A regular PCB007 columnist, John focuses on many of the challenges affecting the global electronics industry supply chain. Over the years, he has served as an engineer, manager, and executive at a variety of companies and organizations. We hope you enjoy “Just Ask John.”
Mentor and Z-zero Collaborate on New Stackup Tool
I recently spoke with Max Clark, business unit manager with Mentor, a Siemens Business, and Z-zero founder Bill Hargin about the newly formed partnership that resulted in a new stackup tool that Mentor is now selling worldwide. Fun fact: Hargin used to work for Mentor as part of the HyperLynx team, which now has an interface with Z-planner Enterprise. Talk about coming full circle.
Rethinking Interconnects With VeCS Technology
Nolan Johnson and Happy Holden chat with Joe Dickson of WUS about the work he’s done with VeCS, the continuing development of the technology, and the potential impact it can have on the manufacturing floor.
Just Ask Joe: The Occam Process
First, we asked you to send in your questions for Happy Holden. Now, it’s Joe Fjelstad’s turn! Inventor, columnist, instructor, and founder of Verdant Electronics, Joe has been involved with rigid PCBs and flexible circuits for decades, and he’s ready to share some of his knowledge with our readers. We hope you enjoy “Just Ask Joe.”
Aurora Circuits on Ultra-Heavy Copper PCBs
It’s always fun to talk with a company that can do something different—in this case, ultra-heavy copper PCBs, meaning over 20-ounce copper. Wanting to know more, Dan Beaulieu talked to Aurora Circuits Director of Business Development Thad Bartosz.
Atotech Looks to Expand Product Portfolio
When Barry Matties toured Atotech’s facility in Feucht, Germany, he spoke with Andreas Schatz, Atotech’s global product manager of equipment, and Daniel Schmidt, Atotech’s global director of marketing. In this interview, Andreas and Daniel break down the global plating and chemistry trends they see, most notably around horizontal plating and smart factory automation.
Simulation Technology in Acid Copper Pattern Plating
PCB designers and CAM engineers may feel there is little they can do to achieve uniform finished copper thickness of PCB traces and holes. But in an illuminating discussion with Robrecht Belis, manager of surface finishing and e-coating with Elsyca NV in Belgium, Pete Starkey learned that nothing could be further from the truth, provided they act on time and use the right tools.
A Year in Review: Cultivate New Opportunities in Crisis, Start Fresh
Recently, the China Electronic Circuit Industry Association (CPCA) invited Dr. Shiuh-Kao Chiang from Prismark to present an online video report regarding the current and future impact of the current epidemic on the global electronic circuit industry. The I-Connect007 China Team attended the presentation, and the following report summarizes some of Dr. Chiang’s remarks.
MTV Offers Solder Paste Testing Solution
The miniaturization test vehicle (MTV) is a common benchmark test board that can gauge about 25 different paste properties and analyze how different solder pastes will perform in an assembly line. Chrys Shea details the work she’s done to develop and release the MTV.
The iNEMI 2019 Board Assembly Roadmap
iNEMI continues to publish chapters of its 2019 Roadmap and recently presented an overview of its Board Assembly Roadmap Chapter in a webinar prefaced by Grace O’Malley, vice president of global operations. The new chapter is just the latest addition to this global effort from 23 working groups contributing expert input from all aspects of the electronics industry.
Autodesk’s Fusion 360 Merges ECAD, MCAD
Andy Shaughnessy spoke with Autodesk’s Matt Berggren about the company’s Fusion 360 EDA tool and the new capabilities added to the software. Matt explains how Fusion 360 blends ECAD and MCAD functionality in one environment and at an affordable price, and why he believes it will help round out Autodesk's electronic portfolio with end-to-end capabilities.
Rogers Corporation Keeps Materials Moving
The I-Connect007 editorial team spoke with Roger Tushingham of Rogers Corporation about the company’s current priorities with everything that’s been changing recently, including his perspective on the distributing and manufacturing trends he sees as a global supplier.
iNEMI’s PCB Roadmap Explained
In an informative and enlightening webinar, iNEMI Project Manager Steve Payne was joined by Isola Group CTO Ed Kelley to explain, review, and discuss the details of the recently published “iNEMI 2019 Roadmap for Organic PCBs.” Pete Starkey provides an overview.
Freedom CAD’s Expert PCB Design Tips, Part 1
When you’re designing complex PCBs, knowledge truly is power. The more PCB design tips, tricks, and techniques you know, the better your cutting-edge designs will be. With that in mind, we’re bringing you a series of PCB design tips, courtesy of Freedom CAD Services.
Survey: Complete, Accurate Design Data Tops List of Fab Expectations
In a recent survey, we asked PCB designers about expectations, particularly fabricators’ expectations of their PCB designer customers. The overwhelming majority (84%) of respondents indicated that a fabricator’s primary expectation of a designer is a complete, accurate data package.
Improving Copper Distribution in Pattern Plating Using Simulation Software
Technical Editor Pete Starkey had the opportunity to sit in on a webinar presented by Robrecht Belis, manager of the surface finishing business unit at Elsyca—a Belgian company specialising in the simulation of electrochemical processes.
MFLEX Increases Growth
Happy Holden recently spoke with Jay Desai of MFLEX about the latest flex work the company has been doing and its aim to transition toward more automation and a smart factory approach.
IPC Europe Shares Technical Education and Standards Awareness
Against a background of COVID-19 uncertainty and unprecedented challenges, but recognizing the vital importance of continuing to educate engineers and share the knowledge and skills required to manufacture boards and assemblies of the highest yields and reliability, the IPC Europe team hosted a technical webinar for the European electronics industry, featuring the expertise of two of I-Connect007’s regular columnists: Mike Carano and Jan Pedersen. Pete Starkey provides an overview.
Via Reliability and Robustness in Today’s Environment
When Bob Neves dropped by the I-Connect007 booth at IPC APEX EXPO 2020 this year, Happy Holden took the opportunity to record the conversation. Bob had some startling and exciting updates on the testing of microvias and through-hole technology.
Isola’s Travis Kelly: Maintaining Continuity of Supply
On April 9, Barry Matties spoke with Travis Kelly, Isola president and CEO. Travis gave an update on Isola’s responses to the COVID-19 challenges in materials manufacturing. Travis pointed out that Isola’s products fill a critical need in the switch to medical equipment manufacturing for ventilators and related products. He also spoke to the three keys to maintaining continuity of supply.
PCB Surface Preparation Before Solder Mask on Non-copper Finishes
A circuit board is made of copper. Usually, final finishes are applied after the solder mask process. In some cases, for special applications, the final finish may be applied before solder mask. In this case, we have solder mask on ENIG or galvanic nickel-gold. It is also possible to have tin or tin-lead under solder mask; this was an old technology that no longer plays a role today.
Advantages of Using ZIF Connectors as a Termination Method
There are many types of connectors and termination methods available when designing a flexible circuit. One of the most common is the zero insertion force (ZIF) connector. The reason why the ZIF connector is so popular is that they eliminate the requirement for an added connector. They create a direct connection from the circuit to the mating connector reducing overall weight and cost. Here are a few general facts about ZIF connectors.
Are Trade Shows at a Crossroads?
With the cancellation of this year’s E3 show, the biggest gamer conference, the event’s format is shifting to a more fluid, online communication method. This may be the wave of the future. Can you imagine if the COVID-19 outbreak had occurred just three months earlier? Would there have been a Consumer Electronics Show, DesignCon, or IPC APEX EXPO? If the coronavirus is still in play in six months, will these shows take place in 2021?
Institute of Circuit Technology Spring Seminar 2020
Back to Meriden, the nominal centre of England where the daffodils were blooming. A good crowd made it to the spring seminar that followed the Annual General Meeting of the Institute of Circuit Technology (ICT), with five specialist presentations and excellent opportunities to network with their peers in the industry. Pete Starkey shares his overview of the event.
I-Connect007 Researchers Survey Industry on COVID-19 Outbreak Effect
In the last 24 hours, we surveyed our readers regarding the coronavirus (COVID-19) outbreak and its effect on our industry. After reviewing the first 100 survey responses primarily from North America and Europe, one-third of the respondents reported that the outbreak was having at least a small effect on their orders. Two-thirds of our readers have yet to see any effect on their orders.
2020 EIPC Winter Conference, Day 2
Rested and refreshed, delegates returned to the conference room for the second day of the 2020 EIPC Winter Conference in Blijdorp, Rotterdam, South Holland. Pete Starkey provides an overview of the presentations and activities from Day 2.
2020 EIPC Winter Conference, Day 1
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”
Congratulations to Mike Carano! Dieter Bergman IPC Fellowship Award Recipient
Patty Goldman spoke with Mike Carano about being awarded the Dieter Bergman IPC Fellowship Award, what that means to him as someone who was inspired by Dieter, and after 40 years in the industry, what keeps him excited going forward. Talking with Mike, one can feel his enthusiasm for IPC and the industry, which is contagious.
Joe Fjelstad Breaks Down His Occam Process
Joe Fjelstad recently met with the I-Connect007 Editorial Team to discuss the potential benefits of his Occam process for solderless assembly. This technique allows assembly of the PCB without the risks associated with traditional surface-mount processes, such as solder joint failure. Has the time come for the industry to embrace Occam?
XRF: An Essential Tool to Help PCB Manufacturers Meet IPC Specifications
One of the main challenges in PCB manufacturing is to create a stable, long-term coating of the copper surface to perform critical functions throughout the expected lifetime of the part. The surface coating is there to do two things: prevent the copper from oxidizing by coming in contact with the air and form a reliable contact for a soldered joint or wire-bonded connector.
Catching up With Midstate Electronics
Dan Beaulieu recently sat down with Susan Matteo, Joan Allen, and Gerri Wooten from Midstate Electronics’ sales team to discuss their company, how long they have been in business, the key ingredients to their longevity and success, and how they see the market today in general. Midstate offers everything from multilayer PCBs to flex and rigid-flex circuits and PCB assembly.
Rogers Continues to Grow and Adapt
In this video interview from the show, Guest Editor Judy Warner and Tony Mattingly, senior product manager at Rogers Corporation, discuss the state of materials at the company, as well as the Rogers innovation centers the company has opened recently.
Randy Cherry: IPC Validation Services Continues to Expand
In this video interview from the show, Randy Cherry, IPC's director of validation services, gives Guest Editor Judy Warner his annual update on IPC's Validation Services, which is growing along with ever-increasing IoT and connectivity.
Stencils: Not As Simple As They Seem
Stephanie Hardin of Integrated Ideas and Technologies Inc. discusses her role in the supply chain as a stencil manufacturer, improvements she sees from micromachined step stencils, and why she believes trying to have standardized stencil layouts is wishful thinking due to the many fluctuating variables.
Ventec’s Materials are Enablers for 5G, Industry 4.0
In this video interview from the show, Technical Editor Pete Starkey and Ventec COO for Europe and the Americas Mark Goodwin discuss Ventec’s latest high-speed, low-loss, high-frequency materials as enablers for 5G and Industry 4.0.
CB Tech and Technica Tout Titan’s Traits
During the show, Technical Editor Pete Starkey met with Frank Medina, president and CEO of Technica USA, and Harry Kok, international sales director at CB Tech. They discuss the features of the CB Tech Titan direct imaging system, which has very high throughput capability with best-in-class registration consistently maintained from the beginning to the end of the batch. Kok also explains how the Titan fits in with CB Tech’s ongoing plans for Industry 4.0.
IPC APEX EXPO 2020 Attendees Speak: Brian Wojtkiewicz
"It seems they are all pursuing digital imaging; whether it’s direct imaging exposure or inkjet solder mask, they’re all going that direction, and it’s not just the big customers; small customers are doing the same," said Taiyo's Brian Wojtkiewicz. "They’re investing money, which is good. New investment is what has been lacking for a couple of years."
Will Moisture Management Expand to the U.S. Market?
Rich Heimsch, Super Dry director, chats with Nolan Johnson about the growing demand for moisture management in North America versus its earlier adoption in Europe, and how moisture management fits into Industry 4.0 and the smart factory.
IPC Government Relations: Focus on Supply Chain Resiliency
During IPC APEX EXPO, Editor Nolan Johnson sat down with Chris Mitchell, VP of global government affairs, to discuss IPC’s latest initiative with industry intelligence programs. As Chris explains, some of these efforts are focused on improving the DoD’s supply chain. This includes moving the DoD from leaded to lead-free components to help avoid millions of dollars in rework. He also discusses the team’s drive to unite with partners around the world and create a truly global organization.
Solder in PCBA: Can’t Live Without It... or Can We?
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.
IPC APEX EXPO 2020 Attendees Speak: Sheryl Long
"It’s a great place to see our customers and other friendly faces," said Sheryl Long, global marketing communications manager for Rogers Corporation. "The traffic has been a little slow this year, but it’s a great place to meet everybody at one spot and to get together and talk about what’s going on in the industry.
IPC: Automotive Electronics Segment Exploding
Electronics are increasingly being used in the design of new vehicles, driving IPC activities in standards development to help the industry adapt to building electronics better for the automotive industry. At IPC APEX EXPO 2020 we saw an increase in automotive content throughout the show which also provided opportunities for automotive OEMs and Tier1 suppliers to network.
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