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Latest Articles
EIPC Technical Snapshot Webinar: Aspects of Additive Manufacturing
EIPC Technical Snapshots have become a monthly highlight, eagerly anticipated, enthusiastically supported, and with consistently outstanding quality of content. Introduced and moderated by EIPC board member Martyn Gaudion, managing director at Polar Instruments, the eighth in the series on May 19 featured a well-balanced selection of presentations with the collective focus of additive manufacturing in the electronics industry.
Why You Should Get Involved in IPC Standards Development
From a business perspective, involvement in IPC standards is incredibly important. Usage of IPC’s globally accepted standards creates a level playing field in the electronics supply chain. The playing field, however, is only as level as the participants who are involved in the development of a standard.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Summer is almost upon us. But it doesn’t look like there’s much of a summer vacation afoot for this industry. In the past week, we saw lots of traction with our coverage of everything from M&A activity and the supply chain shortage to challenges facing PCB designers, Spanish language training courses, and designing for semi-additive processes.
IPC: Driving Our Industry for 64 Years
I have participated in many areas of IPC for several years, particularly the Government Relations Committee and the Suppliers Council. Now, there are many IPC committees, and most of them are focused on standards. Many IPC members take part in the committees—after all, electronic design and manufacturing standards is one of the key reasons IPC was founded. The results of the committees’ efforts represent a significant part of the value the IPC has contributed to the industry since it was founded in 1957.
Operational Excellence from a Design Services Manager
Jesse Vaughan discusses the key aspects of continuous improvement he sees in his role as manager of design services at ACDi, and the importance of carving out communication channels—both internally and externally to help build operational excellence.
Joe D’Ambrisi Discusses MacDermid Alpha's Acquisition of HK Wentworth
Element Solutions’ Executive Vice President Joe D’Ambrisi speaks with Nolan Johnson about MacDermid Alpha's recent acquisition of HK Wentworth. Joe shares some details on the transaction and outlines the expected benefits that come from bringing these two companies together.
Catching Up With Gardien’s Niraj Patel
I have always been fascinated by this company, especially two particular services they offer. First, they embed their team into a facility and actually take over as the PCB company’s expert test center; second, they have a universal quality system to track problems and solutions from all over the world and then keep them in a universal database that can be shared by everyone. These are two services everyone in our business needs to know about, which is why I recently reached out to Niraj Patel, Gardien’s vice president in charge of North America.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Finally, it’s May. The snow has melted, the flowers are beginning to bloom, and summer is just around the corner. We’re slowly getting back to normal after the craziest year I can remember. And our industry is on the move! This week, we bring you a veritable seafood platter of articles and columns about PCB design, fabrication, and assembly.
Arlon President Discusses Acquisition by EMC
Arlon President Brad Foster updates Nolan Johnson on EMC’s acquisition of Arlon in December 2020. Foster shares the basic structure of the agreement, the long-term stability built into the merger, and outlines how this brings EMC, Arlon and Technica together as a team. Foster also hints at what we can expect to see from Arlon and EMC in the coming months.
An Inside Look at the IPC Committee Process
As IPC committee meetings were in full effect at this year’s APEX EXPO, Nolan Johnson and Barry Matties have a discussion with many of IPC’s directors and program managers—Teresa Rowe, Chris Jorgensen, Deb Obitz, John Perry, Andres Ojalill, and Patrick Crawford—to gain a better understanding of how committees work.
Show & Tell Magazine Now Available on Demand
IPC APEX EXPO 2021 is in the history books now. But as the paperboys used to say in the 1930s, you can still “read all about it” in Real Time With… IPC APEX EXPO 2021 Show & Tell Magazine! It’s all right here in one convenient publication: interviews with award winners, coverage of keynote speeches, show notes from our technical staff, thoughts from IPC Emerging Engineers, and much more
Exciting Advances From NVIDIA’s GPU
NVIDIA’s Graphics Processing Technology Conference was, as expected, a showcase of new developments, as well as an opportunity for engineers and developers to learn, enhance skills, and discuss new ideas. Just hearing about all the amazing new developments and the accelerating expansion of AI in virtually all aspects of modern society gives those who attended a better idea of just how much AI is and will continue to change their work and our world.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week’s biggest news came in the form of industry briefings—there were a lot of them and the news was universally positive. The news you need to read for this week includes three reports from IPC detailing: the strength and risks in the global economic recovery; a strong EMS book-to-bill ratio; and strong North American PCB sales. Zeroing in on a single company, Apple reported a significant jump in revenue.
Why We Simulate
When Bill Hargin was cutting his teeth in high-speed PCB design some 25 years ago, speeds were slow, layer counts were low, dielectric constants and loss tangents were high, design margins were wide, copper roughness didn’t matter, and glass-weave styles didn’t matter. Dielectrics were called “FR-4” and their properties didn’t matter much. A fast PCI bus operated at just 66 MHz. Times have certainly changed.
Benchmarking Your Process Engineering
Mark Thompson has been in bare board fabrication for over 30 years. He is now laying out printed circuit boards at Monsoon Solutions, a high-tech design bureau near Seattle, Washington. With Mark’s extensive hands-on knowledge of PCB manufacturing, he brings a unique perspective to PCB design. In this discussion with the I-Connect007 editorial team, Mark shares what’s important from a process engineer’s point of view, and how to stay on top of evaluating and benchmarking your manufacturing process, along with insights from his new role as a designer.
DFM 101: PCB Materials
One of the biggest challenges facing PCB designers is understanding the cost drivers in the PCB manufacturing process. This article is the first in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.
Isola Releases IS550H Material
Nolan Johnson speaks with Michael Gay of Isola and Chris Hunrath of Insulectro about the release of their new halogen-free, high-thermal reliability material, which they hope fills the gap in the market between epoxies and polyimides.
EIPC Technical Snapshot: Supply Chain and Material Price Pressures
EIPC’s seventh Technical Snapshot webinar on April 14 was timely and appropriate. In the context of current supply chain issues and material price pressures facing the PCB industry, particularly in Europe, the EIPC team brought together an outstanding group of experts—each a leading authority in his field—to analyse and comment upon the areas of concern and to respond to questions raised by a capacity audience. As Alun Morgan said, “If you don’t use the European supply chain, you won’t have it anymore!”
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
This week, we bring you a wide swath of news, columns, and articles from the past week. Altium announced a new cloud platform that connects design stakeholders with users of its Altium 365 environment. Cadence Design Systems has acquired a company that develops computational fluid dynamics technology to help expand its system analysis offerings.
I-Connect007 'Just Ask' Q&A Compilation Available Now
Throughout 2020, we asked you to send us your questions for Happy Holden, John Mitchell, Joe Fjelstad, Tara Dunn, and Heidi Barnes. You all had plenty of questions for these industry experts. The following is a handy compilation of your questions and their answers.
Driving Down Cost with Process Engineering
Nolan Johnson, Barry Matties, and Happy Holden speak with Matt Mack, process engineer at ICM Controls. Matt shares a day in the life of a process engineer, along with how he approaches continuous improvement and planning for the future on the floor.
Time, Space, Structure, and Model Analysis of CCL Price Increase
According to the CCL Association, copper foil accounts for the largest proportion of raw materials (traditional CCL uses epoxy resin, glass fiber cloth and copper as raw materials). Copper foil in thin plate accounts for about 30% of the overall cost; in thick plate copper accounts for 50%. In CCL production, using Shengyi Technology and Chaohua Technology as examples, the cost of raw materials accounts for about 88% of the total cost, with labor accounting for about 4%. Other costs such as equipment depreciation account for about 8%.
A New Captive PCB Facility in the U.S.
Diane Maceri and Jessi Hall discuss how Schweitzer Engineering Laboratories (SEL) has been working with Alex Stepinski of GreenSource Fabrication to build their own captive PCB facility in Moscow, Idaho; the thought process behind that decision; and their involvement in the Managers Forum at IPC APEX EXPO 2021.
IBM Awarded Best Technical Paper at IPC APEX EXPO 2021
Nolan Johnson and Happy Holden speak with Sarah Czaplewski, whose team at IBM won the Best Technical Paper award at this year’s IPC APEX for “Signal Integrity, Reliability, and Cost Evaluation of PCB Interlayer Crosstalk Reduction.”
A Show Full of Opportunities
Looking back to my notes from IPC APEX 2020, I noticed one of my comments: There were so many interesting sessions that I often found myself in the position of choosing between several that I wanted to attend in the same timeslot. This year was not any different in that regard. I am purposely glossing over the fact that I, like many of my friends, missed the camaraderie and opportunity to catch up in person while attending these technical sessions, and I look forward to being able to do that next year.
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