HDI’s Beneficial Influence on High-Frequency Signal Integrity

October 17, 2017 | Happy Holden, I-Connect007

The increasingly widespread use of finepitch ball-grid array (BGA), chip scale packaging (CSP), and other evolving technology form-factors means that new fabrication techniques must be used to create printed circuit boards (PCBs).

PCB Signal Integrity Optimization Using X-ray Metrology

October 16, 2017 | Scott Jewler, SILICON VALLEY X-RAY

It happens again. A new backbone router/switch build or a line card upgrade is approaching completion when something goes wrong. The system won’t operate at the targeted data rate. Deadlines are looming and the root cause of the problem is buried somewhere in a big rack of electronic components.


It's Only Common Sense: Marketing Your Contract Manufacturing Company

October 16, 2017 | Dan Beaulieu, DB Management

We often focus on North America’s shrinking PCB fabricator landscape, which is are now down to less than 200 shops. But there are well over 1,000 contract electronics manufacturers in existence, and they come in all shapes and...

EPTE Newsletter: Can Toshiba Survive?

October 3, 2017 | Dominique Numakura, DKN Research

Toshiba was the leader in the electronics industry, and developed and marketed many types of electronic equipment and devices that included word processors, printers, VCR cameras, tape recorders, hard disc drives, transceivers, laptop...

Flex Talk: The Man Behind the Curtain

October 3, 2017 | Tara Dunn, Omni PCB

“Pay no attention to the man behind the curtain.” This famous quote from The Wizard of Oz conjures up the image of Dorothy, the Tin Man, the Cowardly Lion and the Scarecrow discovering that the great Wizard of Oz...

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