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Dan Feinberg and Nolan Johnson speak with Amit Dror, CEO of Nano Dimension, about recent company events and the company’s focus on high-mix/low-volume and agile local manufacturing.
Microvias connect adjacent copper layers to complete electrical paths. There are copper-filled microvias, which can be stacked to form connections beyond adjacent copper layers, and staggered microvias, which stitch adjacent copper layers with paths that meander on the layers between the microvias. This article discusses the various laser-drilled microvias and presents SEM photographs to begin the search for the root cause of weak copper interface.
It has happened to all of us. It’s part of doing business. No matter how hard you try, somewhere along the way, you lose a customer. These lost customers are what my friend Bruce appropriately dubbed “the orphans.”...
Microvias: Links of Faith Are Not Created Equal by Jerry Magera and J.R. Strickland
Interconnect Reliability Correlation With System Design and Transportation Stress by Dr. Paul Wang, et al.
How Changing Cleaning Technologies Affect Reliability An interview with Mike Konrad
A Guide to High-reliability PCBs From Design to Specification by Jeff Beauchamp
Avoiding CAF Failures at the IPC High-reliability Forum An interview with Terry Munson
How to Feed Test Data Back to Engineering for Process Improvement by Todd Kolmodin
Focusing on Surface Sensitivity for Reliability An interview with Elizabeth Kidd and Alex Bien
Welcome to Real Time with… IPC APEX EXPO 2019 Show & Tell by Nolan Johnson
Electronics Industry Comes Together at IPC APEX EXPO 2019 by Dr. John Mitchell
Real Time with… IPC APEX EXPO 2019 Video Showcase and Library
Happy’s Highlights by Happy Holden
Leo Lambert, IPC’s 2019 Hall of Fame Inductee by Patty Goldman
Inspiring the Next Generation of Leaders: IPC STEM Student Outreach Program by Patty Goldman
A STEM Student on FIRST Robotics and Career Opportunities by Barry Matties
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