There's definitely an art to plating. Start with a generally planar substrate, then alternately put stuff on and take things off. Continue this in subtle variations until what you have is the stuff you want, where you want.
This article will present a hybrid manufacturing process to manufacture FHE systems with a two-layer interconnect structure utilizing screen printing of silver conductive ink, filled microvias to connect ink traces at the different layers, and use of the traditional reflow process to attach the semiconductor chips to the printed substrates.
Many vendors and manufacturers featured test equipment for flexible circuits. It was worthwhile for me to take a long look at this equipment that evaluates new functional, flexible circuits. The first piece of equipment I examined was...
We are all human, and we sell to humans. For your product or service to be successful, you are going to have to make it appealing to the people in charge of buying it. Please put real stories in your advertising, websites, and...
The State of Plating by Marc Ladle
Chemcut: Wet Processing Equipment for the Long Haul Interview with Rick Lies and Jerry Reitz
Putting Green Into a Brownfield Facility Interview with George Milad
The Advantages of Non-sludge Acid Copper Products Interview with Mike Wood
Pollution Prevention Techniques: Rinse Water Reduction by Happy Holden
Innovative Electroplating Processes for IC Substrates by Saminda Dharmarathna, et al.