Characterization of PCB Material & Manufacturing Technology for High-Frequency

August 31, 2015 | E. Schlaffer, AT&S; and O. Huber, T. Faseth, and H. Arthaber, University of Technology, Vienna

Concepts like Industry 4.0, Internet of things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement—a considerable amount of data and increased data transfer rate. The aim of this paper is to develop a concept to use materials in combination with optimized PCB manufacturing processes, which allows a significant reduction of losses and increased signal quality.

Copyright © 2015 I-Connect007. All rights reserved.