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Achieving design for test (DFT) can be challenging for both design and test groups, as sometimes both expect that the other will be the one to manage DFT. The design and test groups might be in the same organization, or they could be an OEM vs. an EMS company. It works best if both the design and test groups are engaged in the process of DFT and trying to achieve the goal of the best test coverage and lowest rate of field returns.

EIPC Technical Snapshot Review: Semi-additive Processes

December 1, 2021 | Pete Starkey, I-Connect007

The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.





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Standard of Excellence: Great Customer Service is a Two-Way Street

November 22, 2021 | Team ASC, American Standard Circuits

We all enjoy great customer service. Actually, we love great customer service. We love it so much that we are always happy to tell everyone we know when one of our vendors provides us with great customer service. We actually want to...

Dan’s Biz Bookshelf: Pogue’s Basics

November 19, 2021 | Dan Beaulieu, DB Management

David Pogue is one of my favorite reporters on CBS Sunday Morning, one of my favorite programs. He is also the technology reporter for the New York Times. And he is the opposite of what you’d expect for a tech reporter for the...

The Big Picture: Cybersecurity and Hardware Security

November 10, 2021 | Mehul Davé, Entelechy Global and Linkage Technologies

Wherever I go, I am pleasantly reminded of the role our industry plays into everyday lives. From the sight of people texting and calling loved ones on their phones, to children laughing and playing with their high-tech toys, to...

Fein-Lines: End-User Technology Show Season Ramps Up

November 4, 2021 | Dan Feinberg, FeinLine Associates, Inc.

There are several technology trade shows on the horizon, including IPC APEX EXPO, AltiumLive, NEPCON Japan, and SEMICON West. There are many others, but the ones coming up primarily focus on end-user technology rather than the design,...

Test and Inspection Featuring:

  • Test and Inspection: Far Beyond Opens and Shorts, with Todd Kolmodin 
  • Fascinating Opportunities in Flying Probe Testing, with Peter Brandt 
  • New Methods for Quantifying Potential PCB Design Weaknesses and Manufacturing Challenges, with Gerry Partida 
  • Test and Inspection: Competitive Advantage and Cost of Doing Business, with Charlie Capers 
  • Alex Stepinski: A Philosophical View
  • The New Electrical Test—Riding the Wave, by Todd Kolmodin
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