Article Highlights
EIPC Technical Snapshot Review: Semi-additive Processes
12/01/2021 | Pete Starkey, I-Connect007
Alex Stepinski: A Philosophical View
11/30/2021 | I-Connect007 Editorial Team
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/26/2021 | Nolan Johnson, I-Connect007
Happy Thanksgiving From the I-Connect007 Team
11/25/2021 | I-Connect007
RBP Discusses New Management and Plans for the Future
11/23/2021 | Nolan Johnson, I-Connect007

Latest Articles

Ron Lasky: A Perspective on Writing About Solder Defects

Nolan Johnson speaks with Dr. Ron Lasky About "The Printed Circuit Assembler’s Guide to... Solder Defects." Ron is a full professor at Dartmouth College, but works part-time at Indium Corporation, helping their customers solve defects. This I-Connect007 eBook, he says, is a compilation of all he’s learned over the years as well as the deep technical knowledge of the team at Indium.

Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products

Achieving design for test (DFT) can be challenging for both design and test groups, as sometimes both expect that the other will be the one to manage DFT. The design and test groups might be in the same organization, or they could be an OEM vs. an EMS company. It works best if both the design and test groups are engaged in the process of DFT and trying to achieve the goal of the best test coverage and lowest rate of field returns.

EIPC Technical Snapshot Review: Semi-additive Processes

The development of ultra-high-density PCBs and packaging substrates using semi-additive and additive manufacturing processes was the theme of the 13th Technical Snapshot webinar presented by EIPC on November 24. It was introduced and moderated by technical director Tarja Rapala-Virtanen. Daniel Schulze, application engineering manager at Dyconex in Switzerland, gave the opening presentation, “Advanced high density rigid packaging substrates for RF and miniaturization.” He explained that with their long-established capabilities in ultra-high-density PCBs in flex, rigid-flex and rigid multilayer technologies, it was logical for Dyconex to apply their expertise to the development of specialist IC substrates.

Alex Stepinski: A Philosophical View

"My philosophy is to rely more on sensors throughout the process to measure things non-destructively, then build a model for how you’re going to perform, and just validate against the model," said Alex Stepinski. "It’s the next step slowly happening worldwide. For instance, we’ve had 2D AOI for many years. Sometimes, this is complemented with electrical tests. Now, you start to see more 3D AOI happening. You see them putting more sensors on the AOI equipment for direct measurement. Then, you also have the traditional signal integrity testing."

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

If you’re in the United States like I am, and if you celebrated with a traditional Thanksgiving dinner, like my family did, then you just might have fallen asleep sitting up in a chair (or in my case, stretched out on the couch) and missed some of the highlights in the news this week. Never fear, I woke up early to bring the top five news items you should know for this week. We have industry bookings and sales news from IPC, some news from the flex sector, an explanation of induction lamination from Happy Holden, and two different takes on “sustainability.”

Happy Thanksgiving From the I-Connect007 Team

In the United States, the Thanksgiving holiday is a celebration of gratitude and appreciation for the harvest and for the people close to us. Thankfulness, however, transcends just one day of official observance. The fourth Thursday of November is when the U.S. officially celebrates Thanksgiving Day and as we take time to observe this holiday, the I-Connect007 team wishes to offer our thanks to you, our global readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. You breathe life into the vital, thriving, world-changing electronics industry. You are the real story.

RBP Discusses New Management and Plans for the Future

Ernie Litynski, president of RBP Chemical Technology and Dan Carey, incoming executive vice president, brief Nolan Johnson on the recent organizational changes that brought Carey on board. Both Litynski and Carey outline how they see these changes benefiting their customers and partners, including in the defense and aerospace sectors. As they explain, it's their expertise at helping solve problems that customers value most.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This month—and this year, really—has just flown by. As someone mentioned to me recently, “There are basically only three full work weeks before New Year’s Day.” Yikes. Thanksgiving is next week, which means most of your customers and suppliers will be hard to reach. Unless there’s a problem, that is! In that case, they’ll find you, even if you’re carving a turkey with the kids and grandkids. So, with a short week on the horizon, most of us are in overdrive now, trying to get ahead of the game.

New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges

Gerry Partida explains, "The industry is at a new point in evolving how we look at building boards. Our industry has historically built boards and then tried to find a test for them. Then, when they found a test for it, they figured out that it needed to be analyzed before they built the board. We did this with electrical test. We built boards and down the road, as people started asking, “Why am I buying bad boards? We should electrically test them,” electrical test was introduced, reluctantly, into the test part of manufacturing printed circuit boards by suppliers or fabricators. Then they embraced it. But when we started testing boards, we did comparison tests."

DuPont Discusses Acquisition of Rogers Corporation

Nolan Johnson gets the latest news from Avi Avula, vice president and general manager of Interconnect Solutions at DuPont, regarding the recent announcement of DuPont’s intent to acquire Rogers Corporation. Avula outlines the motivation for the acquisition, and how the two companies complement each other. Avula also gives some detail on how this might affect customers and business operations, under the proviso that it is early in the process and that many details have not yet been worked out.


Fascinating Opportunities in Flying Probe Testing

Pete Starkey visits with Peter Brandt, director of sales, Europe and Japan for atg Luther & Maelzer, who reflects upon joining the Mycronic group and goes on to discuss market and technology trends in testing, and what to expect from atg at this year’s productronica. "There are big challenges regarding accuracy and measurement methods for our flying probe. But this is a high-volume business. This means we only participate in smaller production quantities, because you can say 99.9% of this market for electrical testing will be covered by dedicated testers, using high-density, and high-cost fixtures," Brandt says.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Welcome to Friday in mid-November. If you're celebrating Thanksgiving, have you made up your menu and bought the turkey? It will be here before you know it. Around here, we're talking financial news and I've selected my top five financial news items of the week. There was plenty to choose from and my picks this week highlight a few of the most-read financial news pieces from our industry, as well as a couple high-interest technology related pieces. We also released our latest webinar, an 11-part series from the expert at GEN3. Definitely check that one out!

Aismalibar on Thermally-Conductive Solutions

Pete Starkey chats with Eduardo Benmayor about the products Aismalibar will be bringing to productronica 2021, and how the pandemic gave the company time to really work on internal processes.

Honoring Those Who Served

On this Veteran’s Day holiday, the I-Connect007 staff takes a moment to honor those men and women over the years, who served to protect and defend their country. Just on the I-Connect007 staff, we have loved ones who served, ranging from World War I to present-day active-duty military. The holiday isn’t intended to be a political statement, but rather a reflection on service, duty, and personal sacrifice. In some cases, the ultimate sacrifice. Our staff has submitted images of veterans who are near and dear to their hearts. Check them out!

Do You Really Need to Buy New Equipment?

When we began looking into CapEx strategies for PCB manufacturing, we ran into a few company owners who were proud of making their old fabrication equipment last for decades. We recently spoke about CapEx planning with Alex Stepinski, former VP of GreenSource Fabrication, who built a zero-wastewater PCB fabrication facility from the ground up. As Alex explains, your old equipment might actually last for decades, and if you need new equipment, you might find what you’re looking for in another industry.

Taiyo Discusses New Inkjet Technology and Solder Mask for Flex

At PCB West, Nolan Johnson spoke with Brian Wojtkiewicz of Taiyo about some of the company’s new inkjet technology, which will be manufactured in the U.S. Brian also discusses a new solder mask that has been developed especially for the flexible circuit segment of the industry. "They basically want to keep all the same specifications with regular solder mask, so we’re trying to keep all of that: the printability of it and how it looks. We’re getting a lot more interest on the colors. They just don’t want green anymore. They want it to be standard blue, reds, and whites and stuff like that."

Real Time With... productronica: SÜSS MicroTec on Supply Chain Options

Dr. Luca Gautero, product manager at SÜSS MicroTec, discusses marketing strategies for inkjet printing of solder mask, and explains how collaborative development along the supply chain has introduced new options for the designer and demonstrated the real benefits of this technology to the OEM.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

It’s merger mania! Yes, there’s been a lot of M&A activity lately in our industry over the past few months. This week was no different when it comes to merger activities. In this week’s selections, we have news about DuPont’s acquisition of Rogers, Nano Dimension’s merger with Essemtec, and NCAB’s acquisition of Elmatica. We also have news from SMTA International, and an interview with Joe Clark of DownStream Technologies about their new flex and rigid-flex technology.

NCAB Discusses Recent Merger with Elmatica

I-Connect007’s Nolan Johnson catches up with Anders Forsén, chief financial officer at NCAB Group, to get an update on the recently announced acquisition of Elmatica by NCAB. In this audio interview from the NCAB headquarters in Sweden, Anders details how he sees Elmatica and NCAB working together to deliver a stronger solution for customers.

DFM 101: PCB Via Structures

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.


Polar Instruments: Pandemic and Parts Shortage Lead to More R&D Time

During PCB West, I met with Geoffrey Hazelett, VP of sales for Polar Instruments. He explained how the pandemic actually helped Polar’s R&D in the long run, and why the current parts shortages may offer a similar benefit for OEMs, who can now spend more time in what he calls “forced R&D.”

I-Connect007 Editor’s Choice: Five Must Reads for the Week

This week’s top picks, as influenced by readership interest, don’t seem to hold to a particular theme. Previously, I’ve referred to this as a potpourri, and now that I’ve done that once, I can’t really do so again, can I? How about a mixed bag? No, I don’t think so. While the news is certainly a diverse assortment, this just feels too obvious.

EIPC Technical Snapshot Review: Packaging Trends and a PTFE Masterclass

In circumstances that forced the postponement of its live conferences, seminars and workshops, EIPC has continued to provide its platform for the exchange and dissemination of market knowledge and technical information to the European interconnection and packaging industry. October 22 brought the 12th in the sequence, introduced and moderated by Martyn Gaudion, EIPC board member and CEO of Polar Instruments.

Bring Our Industry Back? Shift Your Attitude

Dan Beaulieu discusses some comments he made in a recent column and why this is an opportunity for our industry in North America to retool, refocus, and make one fundamental shift in our plan to bring our industry back.

Real Time With... SMTAI: Anaya Vardya of American Standard Circuits

Anaya Vardya, president and CEO at American Standard Circuits, speaks with Nolan Johnson ahead of the SMTA International exposition. Vardya shares why American Standard Circuits will be exhibiting at the show, and outlines the topics ASC will be presenting on the show floor.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

There’s a lot going on in the industry this week, and my top five picks have a little bit of everything.

Soldering to Aluminum With Mina

At DesignCon, I caught up with Divyakant Kadiwala of Averatek Corporation. He spent a few minutes explaining a special process developed by Averatek that allows technologists to solder to aluminum.

Made in the USA

Barry Matties interviewed Thomas Walsh and Travis Houchin of Integrated Process Systems regarding industry trends they’re seeing in capital expenditure and the changes they have noticed in their customers’ requirements.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Well, William Shatner finally did the field research for his role as Captain James T. Kirk this week, going sub-orbital on the Blue Origin launch platform. No, I’m not making fun of Shatner’s flight, quite the contrary. He’s the first actor in the entire Star Trek franchise to go into space while still living. And at 90 years old, he’s now the oldest person to make the trip as well!

Making Process Decisions in a Greenfield

While SEL is new to manufacturing PCBs, we have more than 35 years of experience in manufacturing. In addition to assembling our own PCBs and building completed units, we also manufacture many of the critical components used in our products and solutions, such as transformers and plastics.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week we have quite a potpourri for you. Our newest columnist, Kim O’Neil of Prototron Circuits, offers details on setting up your own quality management system (QMS). Emmy-winning tech writer David Pogue will be a keynote at IPC APEX EXPO, which I think is a great move on the part of IPC. We have an article from Brent Fischthal of Koh Young America on the value of investing in the latest AOI equipment, which can save you time and money by eliminating false calls.

Tribal Knowledge and Design Data Formats

I recently began to investigate “tribal knowledge” in PCB and PCBA operations. My goal was to determine whether anything of value would be lost if it were not recorded or preserved for future industry technologists. In the face of modern material science and industry standards, the descriptive title “tribal knowledge” suggests that one must determine what is fact, what is fiction, and what may just be plain embellishment, coincidence, or even magic. In many cases, tribal knowledge seems to be composed of memories of problems solved due to trial and error, coupled with observations of resulting causes and effects.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

Once again, seemingly like clockwork, the controversy erupts. It’s such a divisive issue, and it seems no one can be undecided in this debate; each of us is expected to take a stand. All of society—including the media—asks, “Which side are you on?”

24 Essential Skills for Engineers: The Story Behind the Book

In this interview with I-Connect007’s own Happy Holden about his newest book, 24 Essential Skills for Engineers, which he wrote over the span of his career, he highlights some particular moments from his time working at HP and as CTO of Foxconn which inspired many of the book’s chapters. Happy explains why he covered engineering skills as well as “soft skills” such as problem-solving and communication—skills which are keys to succeeding as an engineer.

From DesignCon: Tektronix’s Pavel Zivny on TDECQ

I caught up with Pavel Zivny, a system engineer at Tektronix in Portland, Oregon. Pavel was happy to share some of the technical aspects of the paper he was presenting at DesignCon.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Every fall, the action in the world of PCB design and manufacturing begins to pick up again. No more out-of-office email replies; summer vacation is over, and it’s time to get back at it. This week’s Top Five is a veritable pastiche of columns, articles, and news from the electronics industry.

Catching up With Schaltbau’s Jim Tullo

As the electric vehicle market expands, it is useful to hear from someone with a goal of creating a significant position in that market. Schaltbau Group is one of those companies. In fact, one might say because of its string position in the rail marketplace, the company has been dealing in EVs for years. I sat down recently with Jim Tullo, president of Schaltbau’s North American operations, to talk about their current and future business. I strongly advise you to dig into this one.

From DesignCon: Victory Giant Pushing the Technology Envelope

Victory Giant’s Executive Vice President and CTO George Dudnikov let me in on the growth happening within his company, which includes a much larger Industry 4.0 facility and the capability to do pulse plating up to a 25:1 aspect ratio.

From DesignCon: Ohmega’s New Home with Quantic

At this year’s DesignCon, Nolan Johnson stops to visit with Bruce Mahler, who details the exciting changes happening with Ohmega and Ticer after being acquired by Quantic, and what that means for the market opportunity of OhmegaPly and TCR.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In some weeks, readership numbers are pretty even, which means I make my picks based on “excellence” or “achievement” of some sort. Other weeks, you readers “go viral” on a few key news items, making the selection process numerically driven. This was one of those weeks. Here, then, are the five most-read news items. Of course, leading the way are our esteemed technical editors, Pete Starkey and Dan Feinberg. These gentlemen are examples of my opening statement, as both enjoy huge popularity with readers precisely because they are so good at reporting on the industry.


ICT Autumn 2021 Webinar Review: High-voltage Testing and Advanced Antenna Materials

The Institute of Circuit Technology continues to deliver first-class on-line events. This year's ICT Autumn Webinar on September 7 presented papers by leading experts on high-voltage testing and advanced antenna materials. It was introduced and moderated by ICT Chair Emma Hudson.

Ucamco Improves Communication With Gerber Job Editor Notes in Mandarin

Ucamco recently announced that its Gerber Job Editor can now accept notes in Mandarin. I asked Karel Tavernier, managing director of Ucamco, to discuss the move to add Mandarin notes to the Gerber Job Editor, and what this means for CAM department users who may speak little or no English.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The kids and grandkids are back in school, and fall is on the way. During this busy week, we published a variety of articles, covering everything from trade shows to mergers. It’s hard to argue with IPC’s plans to require proof of vaccine or a negative COVID test to enter IPC APEX EXPO; you can expect other trade shows to follow suit in the future. We’d hate for a show to become a super-spreader event.

From DesignCon: Insulectro Educating Designers About New Materials

I recently met with Insulectro VP of Technology Chris Hunrath at DesignCon 2021. We discussed a variety of new laminates that Insulectro is distributing, as well as some newer processes and the need to educate designers on the ins and outs of cutting-edge laminates.

Flex DFM: When All Things Must Be Considered

One of the best ways to avoid flex failures is by communicating with your flex fabricator early and often. Here are a couple key reasons why involving your flex and rigid-flex supplier early in the design of your product will help you save time and money—and produce a more reliable flex circuit.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

The past couple weeks have delivered quite a bit of PCB manufacturing industry news, to be sure. If you haven’t already seen this news piece from USPAE, “Electronics Industry Summit With US DoD Spawns More Dialogue, Collaboration,” I’d like to bring it to your attention one more time.

From DesignCon: Isola Navigating a Challenging Supply Stream

Nolan Johnson and Andy Shaughnessy visited with Jim Hartzell of Isola to learn about how the company has thrived in the past 18 months, despite some real supply chain backlogs. Jim also talks about new products, and what’s on the horizon for Isola.

DFM from the Fabricator’s Point of View

What do you think of when you hear the term DFM? The I-Connect007 Editorial Team posed this question to a trio of design and fabrication experts: DownStream Technologies co-founders Joe Clark and Rick Almeida, and Max Clark, business unit manager for Valor at Siemens EDA. We think you’ll enjoy this wide-ranging conversation.

From DesignCon: Technica’s 35 Years of Progress

During DesignCon 2021, Nolan Johnson caught up with Frank Medina of Technica, who looks back on the company’s 35-year history and how it has successfully weathered the bumps in the electronics market.

I-Connect007 Editor's Choice: Five Must-Reads for the Week

This week, we’ve covered a variety of topics in our newsletters and websites. In my Top Five picks, we have quite a mixed bag of industry news and articles. In market reports, there’s good news from the North American PCB side of things, but bad news from the EMS segment, driven by long lead times and material shortages. We also have an article that gets down to the root cause, or causes, of the six-month lead time and price increases.


Reasons and Solutions to PCB Lead Times and Price Increases

If there is anyone left in the electronics community who has not been impacted by the chaos in PCB pricing and lead times, they must live in an alternate universe. Seldom does a day pass without someone requesting a conference call to discuss the price increase. Everyone asks the same question: “What is the root cause?” I have concluded there is no single root cause.

We Must Talk to Each Other

“What we have here is a failure to communicate.” Sometimes when I hear that line from "Cool Hand Luke," I can’t help but think that old Strother Martin was in our business. That is to say that printed circuit board designers and board builders have always battled with a failure to communicate.

Electronics Industry Summit With U.S. DoD Spawns More Dialogue, Collaboration

The U.S. Government, the electronics industry, and academia must continue to step up their joint efforts to address risks and gaps in the defense electronics supply chain.

Designing With the End in Mind—How the Meaning of DFM Will Transform in the Future

Designers of today’s complex printed circuit boards occasionally encounter setbacks due to their lack of early planning. Such consequences for apathy in preparation and awareness will continue to escalate along the growth curve of complexity that the industry continues to experience. In this article, Altium's Vince Mazur explains how designers can be served by a design for manufacturing (DFM) mindset to help assure first-pass success.

I-Connect007 Editor’s Picks: Five Must-Reads for the Week

I’m at DesignCon as I start pen this week’s must-reads. It’s good to be back in the convention centers, I have to say. In my last installment, I expressed the anticipation; I can now confirm that taking the pulse of our industry is so much easier when one is nearer the heartbeat.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Well, we’re officially in the trade show season. Delta variant or not, Editor Nolan Johnson and I are going to DesignCon next week. I’m flying on Delta, which I think is a harbinger of good luck. I did get flight insurance, though. I’m definitely ready to fly somewhere.

The Demand for Copper

Nolan Johnson spoke with Michael Coll and Chris Stevens of Nippon Denkai, home of the last-standing ED foil manufacturer in North America, about the demands and projections they’re seeing in the copper market currently.

Riding the Wave of Copper Inflation Pricing

In this interview with Ventec’s Mark Goodwin, he discusses the rising inflation hitting the electronics industry at the same moment as shortages of copper and other raw materials. He believes that, while the PCB industry has endured cycles like this before, this one feels different.

DFM For Your PCBs

Nolan Johnson speaks to Greg Link of WUS Printed Circuit Co. to gain a better understanding of where DFM fits in from a fabricator’s perspective.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This week’s must-reads include: a recently-run interview with Travis Kelly from Isola; IPC Chief Economist Shawn DuBravac discussing economic trends that will touch the industry; new high-speed materials; technique for copper pour from Design007’s recent “Just Ask…” series; and maintaining continuous manufacturing knowledge throughout your enterprise.


Isola Responding to the Market

This interview with Isola’s Travis Kelly provides an overview of many important topics that the industry is facing, including how the global supply chain is being strained by materials, and what companies are trying to do to best manage the items within their control.

DFM 101: PCB Controlled Impedance

One of the biggest challenges facing PCB designers is not understanding the cost drivers in the PCB manufacturing process. This article is the latest in a series that will discuss these cost drivers (from the PCB manufacturer’s perspective) and the design decisions that will impact product reliability.

Catching Up With AMI’s Jim Barry

I met Jim Barry 25 years ago when we worked on a project at Eltek Ltd. Since then, I have followed his career with a great deal of interest, believing that he is one of the best technical sales professionals in our industry. When Jim recently accepted the position as vice president of business development at AMI right here in Maine, I knew it was time to catch up. Jim discusses the company's plans, including its move deeper into the milaero market.

Economic Drivers Take Us ‘Up, Up, and Away!’

Prices are up, up, and… up! Copper, for example, is at an all-time high—up 94% over the last year and up 69% compared to two years ago. But copper isn’t alone. We are seeing higher prices across the board. The IMF’s Non-Fuel Price Index, which includes precious metal, food, and industrial inputs, is up 43.6% over the last year and 44.7% over the last two years. Include fuel prices, and prices are up 70% over the last year. And that’s if you can even get the product you want in the first place, as shortages and longer lead-times abound. Shawn DuBravac explains.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In the past week, we published quite a bit of news—some good, some not so good. The supply chain is likely to be a challenge for the next year or so. But in this industry, technologists always seem to find a workaround.

Rogers Technology Update

At the IEEE International Microwave Symposium (IMS) show in Atlanta, I met with John Coonrod, technical marketing manager with Rogers Corporation and a Design007 columnist. I asked John to discuss the papers he presented at IMS and to give us an update on Rogers’ materials and technology.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

In this week’s top five: a high profile surprise merger between Autodesk and Altium, which had been in the works, resolved this week; financial news from fabs and assemblers around the globe is reporting strong bookings and sales as the industry bounces back from pandemic-related shutdowns; component demands continue to exert pull pressures on the semiconductor suppliers, keeping the market (overly?) competitive pricewise. The tiles are indeed being stirred. Which pieces will you be dealt?

EIPC Technical Snapshot: Thinking Differently in a Post-Pandemic World

President Alun Morgan introduced the 10th in the enormously popular series of EIPC’s monthly Technical Snapshots. He said that although previous webinars had been directed at specific technical issues, the focus of the present session had been expanded to include a good measure of business content to provide better understanding of how it had developed during the pandemic, and also some pointers to how it would look and feel as we began to emerge from such unusual times

Anaya Vardya Discusses ASC’s Move into Additive Processes

It’s been far too long since I’ve been at a live trade show, so I jumped on the chance to attend the IEEE International Microwave Symposium (IMS) show in Atlanta. I ran into Anaya Vardya, CEO of American Standard Circuits, and asked him to give us an update on ASC’s new technologies.

Feeling the Supply Chain Squeeze

Nolan Johnson speaks with Joe D’Ambrisi of MacDermid Alpha to gain insight into what he’s seeing in the market from his perspective as a specialty chemicals and materials provider.


I-Connect007 Editor’s Choice: Five Must-Reads for the Week

Trade show season is around the corner, and we’re talking about real, in-person trade shows. The virtual shows served their purpose, and we may see more virtual shows in tandem with live events, but I’ll be glad to get back on the show floor and see what’s “really” going on out there. It's great to see IPC’s hand soldering competitions returning to Europe this fall.

Catching Up With Prototron’s Kim O’Neil

I recently sat down with industry veteran and friend Kim O’Neil to get to know more about his story. From his time his two tours in Vietnam, to his time in our industry, Kim has always been a solid contributor wherever he has served. Having known and worked with Kim for a number of years I knew that his was an interesting story that should be told.

Averatek Pushing Boundaries of Additive and Semi-Additive Processes

At the IEEE International Microwave Symposium show in Atlanta, I met with Tara Dunn, I-Connect007 columnist and VP of marketing and business development for Averatek. We sat down at the show and discussed the past year and a half, and after joking about how we felt like we were on an episode of The Twilight Zone, Tara gave me an update on Averatek’s continuing research into additive and semi-additive technologies.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

This may be a global industry, but the effect is very real: holidays in the U.S. will drive the industry news cycle. In fact, I can even (unscientifically) rank the major U.S. holidays by their silencing effect on the news. Christmas leads the way, of course, followed by New Year’s, Thanksgiving, Independence Day, Memorial Day, and Labor Day. Here's a wrap-up of the biggest stories of the past week, starting before Independence Day weekend.

Catching Up With Archer Circuits’ Echo Yang

I was thrilled when Echo Yang called to talk about her company, Archer Circuits. And the more she talked, the more I liked her story. Echo is a 37-year-old woman who started her own trading company. She is well-educated, well-trained, and well-spoken; she is filled with ambition and passion for what she does. You are going to find her story and the story of her company as interesting as I have. Enjoy.
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