As our industry continues to evolve and shape-shift, printed circuit board manufacturing continues to shrink through consolidations and attrition. Unfortunately, this trend will most likely continue, albeit at a slower pace than over the last decade. In what has truly become a global economy, partnering with worldclass suppliers is mandatory, and excluding a sub-set of this dwindling supply base because they also happen to be in a crossover business will severely hinder this effort.
Some type of cleaning and surface structuring is required in virtually every step of the printed circuit manufacturing process, from preparing the raw laminate for etch or plating resist to final assembly board cleaning before shipment. In this edition of “Trouble in Your Tank,” I will attempt to cover most of the general cleaning problems that can occur in any of these steps and, where possible, any problems unique to a specific manufacturing step.
There is never a shortage of dumb sayings that people use. In fact, no matter what is going on in our business—good or bad, up or down, scary or comforting—there is always somebody somewhere who will say something dumb...
During the 1980s, manufacturers ran around the barn a few times trying to decide the best way to produce reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high-density flexible...
Solder Mask: You’ve Come a Long Way, Baby, experts’ discussion with the I-Connect Editorial Team
Countering Solder Mask Residue Concerns, by Rick Nichols, et al.
Circuit Automation on the Ever-Evolving World of Solder Mask, experts’ discussion with the I-Connect007 Editorial Team
Thermal Capabilities of Solder Masks: How High Can We Go?, by Sven Kramer