August 2022 Issue of SMT007 Magazine Available Now

Ventec Expands Flex-rigid Material Range for Critical Military, Aerospace, and Ultra-high Reliability Applications

'CHIPS Plus' Bill Passed with IPC’s Active Support

Q4 Concerns: Hold on to Your Hats

IPC Offers First Advanced Packaging Symposium

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

IPC's I-Connect007 Acquisition Update With John Mitchell

Challenges of the 2022 PCB Market: The Party’s Over

Printed Circuit Boards: Past the Lobby and Onto the Floor

Today’s M&A: Right on Target