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Unimicron Germany Rises from the Ashes with New Smart Factory
April 30, 2018 | Pete Starkey, I-Connect007 and Michael Weinhold, EIPCEstimated reading time: 9 minutes
Figure 6: Safelight imaging area.
The develop-etch-strip lines were equipped with digital pressure sensors and flow meters, enabling the ultimate in accurate setting and monitoring of process parameters for consistency and reproducibility. Etching technology had been developed to the highest level, with copper thickness, copper line profile and surface roughness measured continuously over the whole width of the panel. These parameters were particularly relevant in automotive medium- and long-range radar applications. At the upper end of the thickness scale, it was possible to etch 400-micron copper at a line speed of 1.6 metres per minute. At the lower end, for applications such as modified semi-additive technology, it was more cost-effective to produce 5-micron copper by differential etching down from 12 microns than to buy it in as ultra-thin copper-clad. A cupric chloride etchant was used, on a closed loop recycling system with copper recovery, and all the process chemistry was managed on lean principles with the minimisation of waste and a high level of environmental responsibility.
Figure 7: Develop-etch-strip lines.
Figure 8: Differential etching line.
Figure 9: Robot AGV takes etched panels for inspection.
After automated optical inspection, verification and, where necessary, automated optical repair, the etched innerlayer panels proceeded through surface preparation and bonding treatment to the lay-up area, where there was the option of pinned or pin-less tooling. The pin-less optical registration system had been refined and optimised in cooperation with the equipment supplier to achieve a layer-to-layer registration accuracy of ± 5 microns, and a proprietary self-learning software solution enabled the accuracy to be continuously measured and refined for any particular design.
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05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
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Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
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ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
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Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.