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In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
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SMTconnect 2020 Offers Free Visitor Registration, Extensive Networking Opportunities
July 20, 2020 | SMTconnectEstimated reading time: 1 minute
The program of the SMTconnect goes digital, which takes place from 28 – 29 July 2020, is now almost complete. Well-known representatives from the industry, including the VDMA, ZVEI and the Fraunhofer IZM, will be on board. In addition to the latest developments in the field, participants can expect unique networking features and exciting presentations on electronics manufacturing.
An important focus this year is the development of the industry in times of Corona, a subject the VDMA will be holding a press conference on at the beginning of the event. Subsequently, there will be several exciting panel discussions, including one by media partner SCOOP on the accelerated digital transformation of the industry due to COVID-19. The unique "Future Packaging" production line, which depicts the entire manufacturing process of an electronic component, will be shown virtually on the first day of the event, and organized by the Fraunhofer IZM.
Extensive networking options
The exchange of knowledge remains highly relevant this year. The SMTconnect will therefore continue to offer participants a valuable platform for cross-industry networking. In this respect, SMTconnect goes digital will be providing numerous opportunities to find out about the latest products and services within electronics manufacturing and to connect.
While the matchmaking function of the integrated communication tool will support participants to find the right contact, they can also add up to five new contacts in just 30 minutes on both days with the optional business “speed-dating” function. Furthermore, it is possible to network with all active participants at any given time.
Registration for the event is free of charge. Visit smtconnect.com for details and registration.
Suggested Items
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
TTM’s High Tech Expansion and Industry Innovation
04/30/2024 | Marcy LaRont, PCB007 MagazineTom Edman has been the CEO of TTM Technologies since 2014 and has an extensive background in electronics and manufacturing. TTM is a leading global manufacturer of technology solutions, including mission systems, RF component and RF microwave microelectronics assemblies, and quick turn and advanced technology printed circuit boards.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.