-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
AGC Multi Material General Division is Launching its New Website
June 3, 2022 | AGC Multi Material General DivisionEstimated reading time: Less than a minute
AGC Multi Material General Division is launching its new website www.agc-multimaterial.com.
The former Nelco and Taconic brands have been successfully integrated into the AGC brand. Product names remain the same, however everything else is now AGC.
AGC is looking forward to enhancing our cooperation with all our industry partners and customers. Customers can find information and downloads related to AGC's material solutions for high frequency and highspeed applications on the new website. AGC looks forward to strengthening cooperation with all industry partners and customers.
Suggested Items
SEMI Applauds U.S. CHIPS Act Award for Polar Semiconductor Facility in Minnesota
05/14/2024 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion and modernization of Polar Semiconductor’s fab in Minnesota.
Siemens Partners with Microsoft to Deliver AI-enhanced Solutions for Resilient Product Lifecycle Management with Azure
05/14/2024 | PRNewswireSiemens Digital Industries Software announced an expansion of its partnership with Microsoft to make the Siemens Xcelerator as a Service portfolio of industry software available through Microsoft's cloud and AI platform Azure and integrating it with generative AI and Copilot features.
Real Time with… IPC APEX EXPO 2024: The Success and Future of IPS's Vertical Technology
05/13/2024 | Real Time with...IPC APEX EXPOMike Brask reports on his experience at the show, telling us about the buzz surrounding the vertical technology offerings at IPS, and its benefits. He highlights their customer-centric approach, future growth strategies, and the challenges in workforce management. The conversation also touches upon their recruitment strategies and expresses optimism for the industry's future.
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
05/13/2024 | SEMIThe 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.
AEye Announces Partnership with Leading Automotive Electronics and Vision Solutions Provider, LITEON
05/13/2024 | BUSINESS WIREAEye, Inc., a global leader in adaptive, high-performance lidar solutions, today announced that the non-binding Letter of Intent (“LOI”) announced in March is with LITEON Technology Corporation and is intended to provide AEye with a customer channel and industrialization partnership.